Patents by Inventor DongYun Lee
DongYun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240100639Abstract: An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. Movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.Type: ApplicationFiled: August 14, 2023Publication date: March 28, 2024Inventors: INSEOK SEO, MINSUNG KIM, DASOM LEE, HEEWON MIN, DONGYUN YEO
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Patent number: 11759813Abstract: An apparatus for supplying chemical liquid may include a chemical liquid supply head, a receiving member, a removing member and a supplying member. The chemical liquid supply head may provide a chemical liquid onto a substrate. The receiving member may receive a recycle chemical liquid discharged from the chemical liquid supply head, and the removing member may remove impurities remaining in the recycle chemical liquid received in the receiving member. The supplying member may provide the recycle chemical liquid from which the impurities are removed to the chemical liquid supply head.Type: GrantFiled: September 24, 2021Date of Patent: September 19, 2023Assignee: SEMES CO., LTDInventors: Jeeyong Jung, Dongyun Lee
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Patent number: 11750426Abstract: A signal transmitter circuit includes an output driver circuit configured to transmit a signal using a multi-level pulse amplitude modulation (PAM) scheme comprising a plurality of discreet signal levels. During operation, the output driver initiates a first transition of the signal to a first level of the multi-level PAM scheme from a second level of the multi-level PAM scheme, and initiates a second transition of the signal to the first level from a third level of the multi-level PAM scheme. The signal transmitter further includes a control circuit configured to control a slew rate of the signal transmitter circuit to cause the signal to reach a threshold voltage level at a first time, the first time occurring a first duration of time after the first transition is initiated, and to cause the signal to reach the threshold voltage level at a second time, the second time occurring the first duration of time after the second transition is initiated.Type: GrantFiled: July 13, 2022Date of Patent: September 5, 2023Assignee: Rambus Inc.Inventors: Kamran Farzan, Dongyun Lee
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Publication number: 20230176953Abstract: Described are memory systems and devices in which each memory die in a three-dimensional stack of memory dies includes drive and receive circuitry that can communicate data signals from the stack on behalf of all the memory dies in the stack. The drive and receive circuitry, if defective on one device in the stack, can be disabled and substituted with the drive and receive circuitry from another. The stack of memory dies can thus function despite a failure of drive or receive circuitry in one or more of the memory dies. Each memory die includes test circuitry to detect defective drive and receive circuitry.Type: ApplicationFiled: November 29, 2022Publication date: June 8, 2023Inventors: Joohee Kim, Dongyun Lee
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Patent number: 11646284Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a semiconductor device is disclosed. The semiconductor device includes a first semiconductor die having a first bonding surface that is formed with a first set of contacts patterned with a first connection pitch. A second semiconductor die has a second bonding surface that is formed with a second set of contacts patterned with a second connection pitch. The second set of contacts are further patterned with a paired offset. The second semiconductor die is bonded to the first semiconductor die such that the first set of contacts is disposed in opposed electrical engagement with at least a portion of the second set of contacts.Type: GrantFiled: October 4, 2021Date of Patent: May 9, 2023Assignee: Rambus Inc.Inventors: Dongyun Lee, Ming Li
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Publication number: 20230125262Abstract: Command/address and timing information is distributed to buffer integrated circuits on a module using multiple wavelengths of light modulated with the same information. Each individual wavelength of modulated light carrying command/address information is received by a corresponding single buffer device that deserializes the command/address information and communicates it electrically to memory devices(s). Likewise, each individual wavelength of modulated light carrying timing/synchronization/clock information is received by a corresponding single buffer device and used to synchronize accesses to the memory device(s). Thus, multiple buffer integrated circuits on a module each receive information from the CPU using different wavelengths of light transmitted on the same waveguide.Type: ApplicationFiled: October 10, 2022Publication date: April 27, 2023Inventors: Mark D. KELLAM, Dongyun LEE, Thomas VOGELSANG, Steven C. WOO
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Publication number: 20230099474Abstract: An interconnected stack of Dynamic Random Access Memory (DRAM) die has a base die and DRAM dies. The base die is interconnected vertically with the DRAM dies using through-silicon via (TSV) connections that carry data and control signals throughout the stack. The data signals of the DRAM dies are interconnected vertically to the base die using separate, non-overlapping, sets of TSVs. In a first configuration, each die in the stack is accessed using unique chip identification numbers. In a second configuration, a single chip identification number is used to access two or more dies in the stack. At least one bit of the chip identification number may be used in determining the row being accessed. Data communicated with dies in the stack may be communicated with the base die using non-overlapping sets of data signal connections.Type: ApplicationFiled: September 9, 2022Publication date: March 30, 2023Inventors: Dongyun LEE, Carl W. WERNER, Torsten PARTSCH
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Publication number: 20230087576Abstract: A control component implements pipelined data processing operations in either of two timing domains bridged by a domain-crossing circuit according to one or more configuration signals that indicate relative clock frequencies of the two domain and/or otherwise indicate which of the two timing domains will complete the data processing operations with lowest latency.Type: ApplicationFiled: September 8, 2022Publication date: March 23, 2023Inventors: Michael Raymond Miller, Dongyun Lee
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Publication number: 20230006869Abstract: A signal transmitter circuit includes an output driver circuit configured to transmit a signal using a multi-level pulse amplitude modulation (PAM) scheme comprising a plurality of discreet signal levels. During operation, the output driver initiates a first transition of the signal to a first level of the multi-level PAM scheme from a second level of the multi-level PAM scheme, and initiates a second transition of the signal to the first level from a third level of the multi-level PAM scheme. The signal transmitter further includes a control circuit configured to control a slew rate of the signal transmitter circuit to cause the signal to reach a threshold voltage level at a first time, the first time occurring a first duration of time after the first transition is initiated, and to cause the signal to reach the threshold voltage level at a second time, the second time occurring the first duration of time after the second transition is initiated.Type: ApplicationFiled: July 13, 2022Publication date: January 5, 2023Inventors: Kamran Farzan, Dongyun Lee
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Publication number: 20220413768Abstract: A memory module supports multiple memory channel modes, each including a double-date-rate (DDR) data channel supported by an independent command-and-address (CA) channel. In a two-channel mode, the memory module supports two DDR data channels using two respective DDR CA channels. Each CA channel includes a corresponding set of CA links. In a four-channel mode, the memory module supports two pairs of DDR data channels, each pair supported by a pair of independent CA channels. Memory commands issued in the four-channel mode are time interleaved to share one of the sets of CA links.Type: ApplicationFiled: June 6, 2022Publication date: December 29, 2022Inventors: Dongyun Lee, Steven C. Woo
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Publication number: 20220405016Abstract: Technologies for converting serial data stream to a parallel data and strobe scheme with data strobe preamble information in the serial data stream are described. A device includes an interface circuit that receives a serial data stream and converts the serial data stream to parallel data and a data strobe (DQS) signal associated with the parallel data using N-bit header fields inserted into the serial data stream. The N-bit header fields specify DQS preamble information for the parallel data.Type: ApplicationFiled: June 6, 2022Publication date: December 22, 2022Inventor: Dongyun Lee
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Patent number: 11522470Abstract: A display apparatus is disclosed. The display apparatus includes a display panel, a supporter attached to a rear surface of the display panel, and a piezoelectric vibration unit including a fixing portion attached to the supporter and a cantilever portion overhanging from the supporter.Type: GrantFiled: March 16, 2018Date of Patent: December 6, 2022Assignee: LG ELECTRONICS INC.Inventors: Jongha Park, Dongyun Lee
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Publication number: 20220295206Abstract: A display device according to an embodiment of the present disclosure is to provide a display device for automatically configuring an audio channel suitable for a location of each of a plurality of external speakers when the plurality of external speakers are connected, and an operating method thereof, which establish each of the plurality of external speakers and transmit audio signals to the plurality of external speakers according to the established roles.Type: ApplicationFiled: August 9, 2019Publication date: September 15, 2022Applicant: LG ELECTRONICS INC.Inventors: Jongha PARK, Dongyun LEE, Seokhee JEONG
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Patent number: 11394591Abstract: A signal transmitter circuit includes an output driver circuit configured to transmit a signal using a multi-level pulse amplitude modulation (PAM) scheme comprising a plurality of discreet signal levels. During operation, the output driver initiates a first transition of the signal to a first level of the multi-level PAM scheme from a second level of the multi-level PAM scheme, and initiates a second transition of the signal to the first level from a third level of the multi-level PAM scheme. The signal transmitter further includes a control circuit configured to control a slew rate of the signal transmitter circuit to cause the signal to reach a threshold voltage level at a first time, the first time occurring a first duration of time after the first transition is initiated, and to cause the signal to reach the threshold voltage level at a second time, the second time occurring the first duration of time after the second transition is initiated.Type: GrantFiled: December 30, 2020Date of Patent: July 19, 2022Assignee: Rambus Inc.Inventors: Kamran Farzan, Dongyun Lee
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Publication number: 20220184653Abstract: An apparatus for supplying chemical liquid may include a chemical liquid supply member for supplying a chemical liquid onto a substrate, a chemical liquid storing member for storing the chemical liquid, a chemical liquid receiving assembly for receiving the chemical liquid provided from the chemical liquid storing member and for providing the chemical liquid into the chemical liquid supply member, a first chemical liquid supply line for supplying the chemical liquid from the chemical liquid storing member to the chemical liquid receiving assembly, and a second chemical liquid supply line for supplying the chemical liquid from the chemical liquid receiving assembly to the chemical liquid supply member.Type: ApplicationFiled: December 7, 2021Publication date: June 16, 2022Applicant: Semes Co., Ltd.Inventors: Jinwoo YANG, Bongman CHOI, Dongyun LEE
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Publication number: 20220114431Abstract: An integrated-circuit neural network includes chain of multiply-accumulate units co-located with a high-bandwidth storage array. Each multiply accumulate includes a digital input port, analog input port and multiply-adder circuitry. The digital input port receives a matrix of digital-weight values from the storage array and the analog input port receives a counterpart matrix of analog input signals, each analog input signal exhibiting a respective electronic current representative of input value. The multiply-adder circuitry generates a matrix of analog output signals by convolving the matrix of digital-weight values with the matrix of analog input signals including, for each analog output signal within the matrix of analog output signals, switchably enabling weighted current contributions to the analog output signal based on logic states of on respective bits of one or more of the digital-weight values.Type: ApplicationFiled: January 23, 2020Publication date: April 14, 2022Inventors: Dongyun Lee, Brent S. Haukness
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Publication number: 20220105531Abstract: An apparatus for supplying chemical liquid may include a chemical liquid supply head, a receiving member, a removing member and a supplying member. The chemical liquid supply head may provide a chemical liquid onto a substrate. The receiving member may receive a recycle chemical liquid discharged from the chemical liquid supply head, and the removing member may remove impurities remaining in the recycle chemical liquid received in the receiving member. The supplying member may provide the recycle chemical liquid from which the impurities are removed to the chemical liquid supply head.Type: ApplicationFiled: September 24, 2021Publication date: April 7, 2022Applicant: SEMES CO., LTDInventors: Jeeyong Jung, Dongyun Lee
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Publication number: 20220108964Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a semiconductor device is disclosed. The semiconductor device includes a first semiconductor die having a first bonding surface that is formed with a first set of contacts patterned with a first connection pitch. A second semiconductor die has a second bonding surface that is formed with a second set of contacts patterned with a second connection pitch. The second set of contacts are further patterned with a paired offset. The second semiconductor die is bonded to the first semiconductor die such that the first set of contacts is disposed in opposed electrical engagement with at least a portion of the second set of contacts.Type: ApplicationFiled: October 4, 2021Publication date: April 7, 2022Inventors: Dongyun Lee, Ming Li
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Patent number: 11089423Abstract: Disclosed are a signal processing device and an image display apparatus including the same. The signal processing device and an image display apparatus including the same include: a converter configured to convert of frequency of an input stereo audio signal; a primary component analyzer configured to perform primary component analysis based on a signal from the converter; a feature extractor configured to extract a feature of a primary component signal based on a signal from the primary component analyzer; an envelope adjustor configured to perform envelope adjustment based on prediction performed on the basis of a deep neural network model; and an inverse converter configured to inversely convert a signal from the envelope adjustor to output an upmix audio signal of multi-channel. Accordingly, when upmixing the downmix stereo audio signal to a multichannel audio signal, spatial distortion can be improved.Type: GrantFiled: January 8, 2020Date of Patent: August 10, 2021Assignee: LG ELECTRONICS INC.Inventors: Kichul Kim, Joonil Lee, Jongkun Kim, Sunha Jeon, Jongha Park, Dongyun Lee
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Publication number: 20210203530Abstract: A signal transmitter circuit includes an output driver circuit configured to transmit a signal using a multi-level pulse amplitude modulation (PAM) scheme comprising a plurality of discreet signal levels. During operation, the output driver initiates a first transition of the signal to a first level of the multi-level PAM scheme from a second level of the multi-level PAM scheme, and initiates a second transition of the signal to the first level from a third level of the multi-level PAM scheme. The signal transmitter further includes a control circuit configured to control a slew rate of the signal transmitter circuit to cause the signal to reach a threshold voltage level at a first time, the first time occurring a first duration of time after the first transition is initiated, and to cause the signal to reach the threshold voltage level at a second time, the second time occurring the first duration of time after the second transition is initiated.Type: ApplicationFiled: December 30, 2020Publication date: July 1, 2021Inventors: Kamran Farzan, Dongyun Lee