Abstract: The present disclosure relates to a plurality of host materials, organic electroluminescent compounds, and organic electroluminescent devices comprising the same. By comprising specific combinations of compounds according to the present disclosure as the plurality of host materials or by comprising a compound according to the present disclosure, it is possible to provide organic electroluminescent devices having improved lifespan characteristics compared to conventional organic electroluminescent devices.

Abstract: The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.

Abstract: A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

Abstract: The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.

Abstract: Disclosed is a circuit protection device including a case, a first negative temperature coefficient thermistor which is accommodated in the case and includes a first resistant heating element, a pair of electrodes installed on both sides of the first resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively, and a second negative temperature coefficient thermistor which is accommodated in the case and includes a second resistant heating element, a pair of electrodes installed on both sides of the second resistant heating element, and a fifth lead wire and a sixth lead wire withdrawn from the pair of electrodes, respectively.

Abstract: Disclosed is a circuit protection device including a case, a negative temperature coefficient thermistor which is accommodated in the case and includes a resistant heating element, a pair of electrodes installed on both sides of the resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, and a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively. Here, the second lead wire and the third lead wire are connected to each other in the case.

Abstract: A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

Abstract: A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

Abstract: Disclosed is a circuit protection device including a case, a negative temperature coefficient thermistor accommodated in the case and including a resistant heating element, a pair of electrodes installed on both sides of the resistant heating element, and a first thermistor lead wire and a second thermistor lead wire withdrawn from the pair of electrodes, respectively, and a fuse accommodated in the case and including a fuse body and a first fuse lead wire and a second fuse lead wire connected to both ends of the fuse body, respectively. Here, the fuse body includes a fuse rod with a plating layer formed thereon and a pair of fuse caps coupled to both ends of the fuse rod and having conductivity, and the first fuse lead wire and the second fuse lead wire are bonded to the pair of fuse caps, respectively.

Abstract: Disclosed is a circuit protection device including a case, a first negative temperature coefficient thermistor which is accommodated in the case and includes a first resistant heating element, a pair of electrodes installed on both sides of the first resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively, and a second negative temperature coefficient thermistor which is accommodated in the case and includes a second resistant heating element, a pair of electrodes installed on both sides of the second resistant heating element, and a fifth lead wire and a sixth lead wire withdrawn from the pair of electrodes, respectively.

Abstract: Disclosed is a circuit protection device including a case, a negative temperature coefficient thermistor which is accommodated in the case and includes a resistant heating element, a pair of electrodes installed on both sides of the resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, and a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively. Here, the second lead wire and the third lead wire are connected to each other in the case.

Abstract: The present disclosure provides a method for manufacturing a surge absorbing device, the method comprising: providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

Abstract: Provided are a fuse resistor and a method of manufacturing the same, more particularly, are a fuse resistor mounted at an electric circuit of an electronic product to prevent the electronic product from breaking down due to inrush current, increase of internal temperature, and continuous overcurrent, and a method of manufacturing the same. The fuse resistor is capable of simplifying an assembly process by coupling a thermal fuse and a lead wire in a modularized manner and by fixing a fusing lead wire to the lead wire in an integrated manner to form a lower molding unit, and a method of manufacturing the same. The fuse resistor has a simple structure and is capable of being miniaturized as an integrated structure of the thermal fuse and the lead wire is inserted, and a method of manufacturing the same.

Abstract: A surge absorber and a manufacturing method thereof are disclosed. Since a ceramic material with excellent mechanical strength is used to form a ceramic tube and the ceramic tube is joined to sealing electrodes by use of brazing rings according to the method of manufacturing the surge absorber, durability of the surge absorber is considerably improved. Since the ceramic tube is completely sealed, the surge absorber may be stably used at a high voltage.

Abstract: Disclosed is a complex protection device including a substrate, fuse terminals provided on the substrate, first resistive terminals provided on the substrate so as to be separated from the fuse terminals, second resistive terminals provided on the substrate opposite to the first resistive terminals across the fuse terminals, a fusible element connected to the fuse terminals, a first surface-mounted resistive element connected to the first resistive terminals, a second surface-mounted resistive element connected to the second resistive terminals, at least one printed resistive element connected to at least one of the first resistive terminals and the second resistive terminals and connected to at least one of the first surface-mounted resistive element and the second surface-mounted resistive element, and a switching element controlling flow of current to the first and second surface-mounted resistive elements and the at least one printed resistive element if overvoltage is applied.

Abstract: Disclosed are a shunt resistor and a shunt resistor assembly in which measurement terminals to measure voltage are disposed as close as possible to a resistor element so as to reduce a measurement error, and mechanical and electrical connection is excellent.

Abstract: Disclosed is a fuse resistor provided on an electrical circuit to protect the electrical circuit and elements. The fuse resistor includes a substrate on which first and second resistive terminals and fuse terminals are formed, first and second resistive elements surface-mounted on the first and second resistive terminals and dividing applied current or voltage, and a temperature fuse surface-mounted on the fuse terminals and broken by heat generated from the first and second resistive elements. If overcurrent or overvoltage is applied, the first and second resistive elements generate heat and the temperature fuse is broken by the generated heat.