Abstract: In an OAM multiplexing communication system that subjects a plurality of signal sequences to multiplex transmission by using an OAM mode, a transmitting station includes a transmitting antenna using an M-UCA formed of a plurality of UCAs, and a unit performing basis transformation in each of the rotational direction dimension and a diameter direction dimension in a polar coordinate system having a center of UCAs as an origin, and subjecting the plurality of signal sequences to multiplex transmission for each complex mode formed by a combination of different bases in each dimension. A receiving station includes a receiving antenna using an M-UCA, and a unit receiving a signal subjected to multiplex transmission from the transmitting station, performing basis transformation in each of the rotational direction dimension and the diameter direction dimension by using the received signal, and demultiplexing the plurality of signal sequences subjected to the multiplex transmission.

Abstract: A circuit includes a first input and output terminals to which a current, a voltage, or an electromagnetic wave (referred to as “current or the like” below) is applied, a second input and output terminals to which the current or the like is applied, a first board including a matrix circuit which is formed by a first line and includes a 90-degree hybrid circuit and a delay line, the first line in which one end is connected to the first input and output terminals and a tip of the other end is opened, a second board including a second line in which one end is connected to the second input and output terminals, and a tip of the other end is opened, and a shielding plate including an opening portion.

Abstract: Disclosed is an antenna module, which include a first antenna element, a second antenna element, and a communication module that includes a first transmit path and a first receive path connected with the first antenna element, a second transmit path and a second receive path connected with the second antenna element, and a detection circuit connected with at least a part of the second receive path. The communication module may output a specified signal by using the first transmit path and the first antenna element based at least on obtaining a request for identifying a state of the antenna module from an external device, may obtain the output specified signal by using the second receive path and the second antenna element, may identify an intensity of the obtained specified signal by using the detection circuit, and may determine whether the antenna module is abnormal, based at least on the intensity of the obtained specified signal.

Abstract: A method of manufacturing a fan-out semiconductor package includes forming a frame having a through-hole and including one or more wiring layers; forming a semiconductor chip in the through-hole of the frame; forming an encapsulant covering an upper surface of each of the frame and the semiconductor chip, and filling a space between a wall surface of the through-hole of the frame and a side surface of the semiconductor chip; forming a connection structure below each of the frame and the semiconductor chip; forming a first metal pattern layer on an upper surface of the encapsulant; forming an insulating material on the upper surface of the encapsulant and covering the first metal pattern layer; and forming a second metal pattern layer on the insulating material, a first metal via passing through the insulating material, and a second metal via passing through the insulating material and the encapsulant.

Abstract: A semiconductor package may include: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame to each other; a first connection structure d on the second surface of the frame and including a first redistribution layer connected to the wiring structure; a semiconductor chip on the first connection structure within the cavity and having connection pads connected to the first redistribution layer; an encapsulant encapsulating the semiconductor chip, covering the first surface of the frame, and having an upper surface substantially coplanar with an upper surface of the wiring structure; and a second connection structure including an insulating layer disposed on the upper surfaces of the encapsulant and the wiring structure, a second redistribution layer on the insulating layer, and vias penetrating through the insulating layer and connecting the wiring structure and the second redistribution layer.

Abstract: An antenna displacement correction method for an OAM multiplexing communication system includes: a step of estimating a displacement amount by evaluating an evaluation function defined such that a theoretical channel response between a transmitting antenna and a receiving antenna matches a measured channel response estimated in a receiving station by using a known signal transmitted from a transmitting station, wherein the theoretical channel response has, as a parameter, the displacement amount indicating an amount of displacement of a reference axis predefined for each of the transmitting antenna and the receiving antenna from a predetermined position with respect to a desired relative positional relationship between the transmitting antenna and the receiving antenna; and a step of correcting a displacement of each of the transmitting antenna and the receiving antenna according to the estimated displacement amount.

Abstract: A fan-out semiconductor package includes a semiconductor chip, an encapsulant covering the semiconductor chip, a connection structure disposed below the semiconductor chip, and first and second metal pattern layers disposed on different levels on the semiconductor chip, wherein the first metal pattern layer is provided to electrically connect to an electrical connection member such as a frame, provided for electrical connection of the package in a vertical direction by a path via the second metal pattern layer.

Abstract: A semiconductor package includes a semiconductor chip including a connection pad disposed on an active surface of the semiconductor chip, a passivation layer disposed on the connection pad and the active surface and having an opening exposing at least a portion of the connection pad, and a capping pad covering the connection pad exposed to the opening; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a connection via connected to the capping pad and a redistribution layer connected to the connection via, wherein the capping pad includes: a central portion disposed in the opening, and a peripheral portion extending from the central portion onto the passivation layer, and having a crystal grain having a size different from that of the crystal grain of the central portion.

Abstract: A semiconductor package includes: a redistribution layer including a plurality of redistribution insulating layers, a plurality of redistribution line patterns that constitute lower wiring layers, and a plurality of redistribution vias that are connected to some of the plurality of redistribution line patterns while penetrating at least one of the plurality of redistribution insulating layers; at least one semiconductor chip arranged on the redistribution layer; an expanded layer surrounding the at least one semiconductor chip on the redistribution layer; and a cover wiring layer including at least one base insulating layer, a plurality of wiring patterns that constitute upper wiring layers, and a plurality of conductive vias that are connected to some of the plurality of wiring patterns while penetrating the at least one base insulating layer.

Abstract: A wireless communication device includes a plurality of antenna elements; a modulation unit modulating signals including data in a plurality of first OAM modes having different real number values; a calculation unit calculating factors indicating weights corresponding to each of the signals in the plurality of first OAM modes modulated by the modulation unit for each of the plurality of antenna elements, based on information indicating a wireless environment of a counter wireless communication device that is a transmission destination of the data; and a transmission processing unit multiplexing each of the signals in the plurality of first OAM modes for each of the plurality of antenna elements by using the factors, and outputting the signals obtained through multiplexing for each of the plurality of antenna elements to each of the plurality of antenna elements.

Abstract: A semiconductor package includes a lower connection structure, a semiconductor chip on the lower connection structure, an upper connection structure including a first conductive pattern layer on the semiconductor chip, a first insulating layer on the first conductive pattern layer, a second conductive pattern layer on the first insulating layer, a first via penetrating the first insulating layer to extend between the first conductive pattern layer and the second conductive pattern layer, and a second insulating layer extending between a side surface of the first via and the first insulating layer, and an intermediate connection structure between the lower connection structure and the upper connection structure. A chemical composition of the first insulating layer may differ from a chemical composition of the second insulating layer.

Abstract: A method of manufacturing a semiconductor package may include forming a first substrate including a redistribution layer, providing a second substrate including a semiconductor chip and an interconnection layer on the first substrate to connect the semiconductor chip to the redistribution layer, forming a first encapsulation layer covering the second substrate, and forming a via structure penetrating the first encapsulation layer. The forming the via structure may include forming a first via hole in the first encapsulation layer, forming a photosensitive material layer in the first via hole, exposing and developing the photosensitive material layer in the first via hole to form a second encapsulation layer having a second via hole, and filling the second via hole with a conductive material. A surface roughness of a sidewall of the first encapsulation layer may be greater than a surface roughness of a sidewall of the second encapsulation layer.

Abstract: A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.

Abstract: A semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.

Abstract: An OAM multiplexing communication system multiplexes signals of one or more sequences for each OAM mode. A transmitting station includes a transmitting antenna using an M-UCA, and an OAM mode generation unit that simultaneously generates one or more OAM modes from each UCA. A receiving station includes a receiving antenna equivalent to the M-UCA, an OAM mode separation unit that separates signals received by each UCA for each OAM mode, and a channel estimation/interference compensation unit that compensates for inter-mode interference between the OAM modes by using a weight. The channel estimation/interference compensation unit selects, for each OAM mode, signals of a subject mode and an adjacent mode from among the signals of the OAM modes separated by the OAM mode separation unit, and compensates for the inter-mode interference by multiplying an approximate weight calculated by using channel matrixes of the subject mode and the adjacent mode.

Abstract: An OAM multiplexing communication system multiplexes signals of one or more sequences for each OAM mode. A transmitting station includes a transmitting antenna using an M-UCA, and an OAM mode generation unit that simultaneously generates one or more OAM modes from each UCA. A receiving station includes a receiving antenna equivalent to the M-UCA, an OAM mode separation unit that separates signals received by each UCA for each OAM mode, and a channel estimation/interference compensation unit that compensates for inter-mode interference between the OAM modes by using a weight. The channel estimation/interference compensation unit selects, for each OAM mode, signals of a subject mode and an adjacent mode from among the signals of the OAM modes separated by the OAM mode separation unit, and compensates for the inter-mode interference by multiplying an approximate weight calculated by using channel matrixes of the subject mode and the adjacent mode.

Abstract: An antenna displacement correction method for an OAM multiplexing communication system includes: a step of estimating a displacement amount by evaluating an evaluation function defined such that a theoretical channel response between a transmitting antenna and a receiving antenna matches a measured channel response estimated in a receiving station by using a known signal transmitted from a transmitting station, wherein the theoretical channel response has, as a parameter, the displacement amount indicating an amount of displacement of a reference axis predefined for each of the transmitting antenna and the receiving antenna from a predetermined position with respect to a desired relative positional relationship between the transmitting antenna and the receiving antenna; and a step of correcting a displacement of each of the transmitting antenna and the receiving antenna according to the estimated displacement amount.

Abstract: A circuit includes a first input and output terminals to which a current, a voltage, or an electromagnetic wave (referred to as “current or the like” below) is applied, a second input and output terminals to which the current or the like is applied, a first board including a matrix circuit which is formed by a first line and includes a 90-degree hybrid circuit and a delay line, the first line in which one end is connected to the first input and output terminals and a tip of the other end is opened, a second board including a second line in which one end is connected to the second input and output terminals, and a tip of the other end is opened, and a shielding plate including an opening portion.

Abstract: An OAM multiplexing communication system uses one or more OAM modes and multiplexes signals of one or more sequences for each OAM mode. A transmitting station includes a transmitting antenna using an M-UCA, and an OAM mode generation unit that simultaneously generates one or more OAM modes from each UCA. A receiving station includes a receiving antenna equivalent to the M-UCA, an OAM mode separation unit that separates signals received by each UCA for each OAM mode, and a received signal processing unit that estimates channel information for each OAM mode and performs an equalization process for each OAM mode by using a receiving weight calculated from the channel information. The received signal processing unit is configured to estimate, for each OAM mode, channel information of another OAM mode causing interference and calculate the receiving weight of a subject OAM mode by using the channel information of the subject OAM mode and said another OAM mode.

Abstract: An OAM multiplexing transmission device includes a unit generating each of the transmission streams in a baseband (BB), in which a channel estimation signal sequence is disposed before a transmission target data signal sequence, and a CP having a predetermined length is disposed in the first half of the channel estimation signal sequence, the channel estimation signal sequence is time-shifted with a channel estimation signal sequence (a basic channel estimation signal sequence) having a predetermined length and a zero correlation, by a predetermined shift value for each of the transmission streams; a unit converting a baseband signal sequence of the generated transmission streams to frequency conversion into RF band, or converting into IF band and then converting into the RF band; and a unit converting a plurality of the frequency-converted transmission streams into a plurality of OAM mode signals having different orders, and multiplexing spatially by using the UCA.