Patents by Inventor Douglas C. La Tulipe

Douglas C. La Tulipe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
    Publication number: 20040115921
    Abstract: Disclosed is a method for depositing a metal layer on an interconnect structure for a semiconductor wafer. In the method, a metal conductor is covered by a capping layer and a dielectric layer. The dielectric layer is patterned so as to expose the capping layer. The capping layer is then sputter etched to remove the capping layer and expose the metal conductor. In the process of sputter etching, the capping layer is redeposited onto the sidewall of the pattern. Lastly, at least one layer is deposited into the pattern and covers the redeposited capping layer.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, Infineon Technologies North America Corp.
    Inventors: Larry Clevenger, Timothy Joseph Dalton, Mark Hoinkis, Staffen K. Kaldor, Kaushik Kumar, Douglas C. La Tulipe, Soon-Cheon Seo, Andrew Herbert Simon, Yun-Yu Wang, Chih-Chao Yang, Haining Yang