Abstract: A component handler (100) may include: a test plate (102) including multiple circular component-seating tracks (104) each including multiple component-seating sites (500) configured to retain an electrical component (510) such that its face (522) faces away from the test plate (102); a component receiving system (114, 106, 300, 302, 306, 308, 310, 400, 402, 502, and/or 508) positioned along a rotation path of the seating tracks (104); a component test module assembly (1502) for electrically contacting each electrical component (510) seated in a component-seating site (500); one or more collection bins (124); and a collection assembly (120) for collecting some of the electrical components (510) from component-seating sites (500) and directing the electrical components (510) into the bins (124) based on one or more tests conducted at the component test module assembly (1502).

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.

Abstract: A component handler (100) may include: a test plate (102) including multiple circular component-seating tracks (104) each including multiple component-seating sites (500) configured to retain an electrical component (510) such that its face (522) faces away from the test plate (102); a component receiving system (114, 106, 300, 302, 306, 308, 310, 400, 402, 502, and/or 508) positioned along a rotation path of the seating tracks (104); a component test module assembly (1502) for electrically contacting each electrical component (510) seated in a component-seating site (500); one or more collection bins (124); and a collection assembly (120) for collecting some of the electrical components (510) from component-seating sites (500) and directing the electrical components (510) into the bins (124) based on one or more tests conducted at the component test module assembly (1502).

Abstract: A rotary loader taught herein comprises a rotatable load plate including a plurality of component pockets arranged about a rotational axis of the load plate, the load plate inclined with respect to a horizontal surface at an angle of inclination of less than 50 degrees and a load wall arranged about a lower portion of the load plate adjacent certain ones of the plurality of component pockets and extending above a height of the load plate. The load wall includes a retention surface extending in a direction parallel to an outer peripheral edge of the load plate and a loading surface inclined with respect a line perpendicular to a top surface of the load plate in a direction away from the retention surface at an angle of inclination of less than 45 degrees.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: A rotary loader taught herein comprises a rotatable load plate including a plurality of component pockets arranged about a rotational axis of the load plate, the load plate inclined with respect to a horizontal surface at an angle of inclination of less than 50 degrees and a load wall arranged about a lower portion of the load plate adjacent certain ones of the plurality of component pockets and extending above a height of the load plate. The load wall includes a retention surface extending in a direction parallel to an outer peripheral edge of the load plate and a loading surface inclined with respect a line perpendicular to a top surface of the load plate in a direction away from the retention surface at an angle of inclination of less than 45 degrees.

Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.

Abstract: A conveyor mountable carrier is adapted to test an electronic device that has electrical leads. The carrier includes a body having a clamping area defined by a base surface and at least one lateral stop surface. The body also defines a pneumatic channel for directing pressurized air toward the clamping area. A clamp is movably connected to the body and has an engaging portion that is positioned opposite the stop surface of the body. The clamp is moveable between an engaged position in which the electronic device is securable to the body and a disengaged position in which the electronic device is releasable from the body.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: Recesses (72), surface contours, contact tip modifications (52, 56), and/or other methods of ensuring pressure between a bottom surface (50) of a test plate (5) and top surfaces (52) of electrical contacts (18) are employed to enhance cleaning of the top surfaces (52) of the electrical contacts (18) to promote reliable measurements of DUTs (14).

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: An electrical component handler that tests electrical circuit components and includes a self-cleaning lower contact offers reduced yield loss and mean time between assists. A preferred embodiment of the electrical component handler includes multiple sets of upper and lower contacts, each set of which is spatially aligned to electrically contact a single device-under-test (DUT). Each DUT is seated in a test plate that transports the DUT to and from a test measurement position between the upper and lower contacts. The lower contact includes a contact tip that a biasing mechanism urges against the electrical component as it undergoes a test process and against a surface of the test plate as it transports the electrical component. The lower contact rubs against the test plate, thereby contributing to removal of contaminant material acquired by the contact tip during component handler operation.

Abstract: An electrical component handler that tests electrical circuit components and includes a self-cleaning lower contact offers reduced yield loss and mean time between assists. A preferred embodiment of the electrical component handler includes multiple sets of upper and lower contacts, each set of which is spatially aligned to electrically contact a single device-under-test (DUT). Each DUT is seated in a test plate that transports the DUT to and from a test measurement position between the upper and lower contacts. The lower contact includes a contact tip that a biasing mechanism urges against the electrical component as it undergoes a test process and against a surface of the test plate as it transports the electrical component. The lower contact rubs against the test plate, thereby contributing to removal of contaminant material acquired by the contact tip during component handler operation.

Abstract: An electrical component handler that tests electrical circuit components and includes a self-cleaning lower contact offers reduced yield loss and mean time between assists. A preferred embodiment of the electrical component handler includes multiple sets of upper and lower contacts, each set of which is spatially aligned to electrically contact a single device-under-test (DUT). Each DUT is seated in a test plate that transports the DUT to and from a test measurement position between the upper and lower contacts. The lower contact includes a contact tip that a biasing mechanism urges against the electrical component as it undergoes a test process and against a surface of the test plate as it transports the electrical component. The lower contact rubs against the test plate, thereby contributing to removal of contaminant material acquired by the contact tip during component handler operation.

Abstract: Terminating the ends of passive electronic components entails applying a laser-removable coating to one or both of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-removable coating from multiple selected regions of at least one of the major surfaces to which the laser-removable coating was applied is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-removable coating to expose the multiple selected regions. The substrate is then broken into multiple rowbars or individual components, each of which includes side margins. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between portions of the side margins spatially aligned with the multiple selected regions.

Abstract: Terminating the ends of passive electronic components entails applying a laser-ablative coating to each of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-ablative coating from multiple selected regions of the major surfaces is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-ablative coating to expose the multiple selected regions of the opposed major surfaces. The substrate is then broken into multiple rowbars, each of which includes side margins along which are positioned different spatially aligned pairs of the selected regions of the opposed major surfaces. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between each spatially aligned pair of the selected regions.