Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: Quick release couplings for releasably coupling components of a computer to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating the use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.

Abstract: A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A case (12) for a computer monitor (10) having a tub (16) with a case aperture (38) therein adapted for receiving a subpanel (26). The subpanel (26) has a plurality of electrical connectors 28 which are user accessible thereby. A beveled flange (40) on the subpanel (26) is received within a receiving flange (44) on the case aperture (38). A structural grid (32) within the case (12) has a flexible portion (34) which includes an electronics enclosure (33) having a screw receiving aperture (42) therein such that a screw (30) is passed through a subpanel screw aperture (48) in the subpanel (26) and secured within the screw receiving aperture (42), thereby flexing the flexible portion (34) to hold the subpanel (26) firmly within the case aperture (38).

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading.

Abstract: A case (12) for a computer monitor (10) having a tub (16) with a case aperture (38) therein adapted for receiving a subpanel (26). The subpanel (26) has a plurality of electrical connectors (28) which are user accessible thereby. A beveled flange (40) on the subpanel (26) is received within a receiving flange (44) on the case aperture (38). A structural grid (32) within the case (12) has a flexible portion (34) which includes a can (33) coupled to a flexible arm (35), and which has a screw receiving aperture (42) therein such that a screw (30) is passed through a subpanel screw aperture (48) in the subpanel (26) and secured within the screw receiving aperture (42), thereby flexing the flexible portion (34) to hold the subpanel (26) firmly within the case aperture (38).

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: A computer system is provided comprising a support frame, a logic board mounted to the support frame, a processor on the logic board, a cathode ray tube mounted to the support frame above a plane of the logic board, and a transparent housing located over the cathode ray tube.

Abstract: An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

Abstract: The invention provides a computer monitor bezel including a bezel mount, and opaque planar member, and a bezel face. The bezel mount includes a frame and a mounting formation. The frame defines a frame viewing opening entirely surrounded by the frame. The mounting formation is located on the frame to mount the frame to a sub-monitor in a position wherein a screen of the sub-monitor is viewable through the frame viewing opening. The opaque planar member is located over the bezel mount. The bezel face includes a translucent planar member and an attachment component. The translucent planar member is located over the opaque planar member. The attachment component has a first end secured to the translucent planar member, extends past a plane of the opaque planar member, and has a second, opposing end secured to the frame.

Abstract: A computer monitor case (10) having a subframe (28) with an intermediate bucket (12) affixed thereto to form a front assembly (56). A top bucket (14) is affixed to a bottom bucket (16) by rivets (52) to form a rear assembly (55). The rear assembly (55) is affixed to the front assembly (56) by top fastening clips (36) wide fastening clips (38) and narrow fastening clips (40). Alignment pins (34) on the subframe (28) align with alignment pin notches (42) and side alignment pin notches (64) on the intermediate bucket (12) and top bucket (14) respectively. Side lips (62) and a front lip (58) on the top bucket (14), attachment ribs (50) on the top bucket (14) and bottom bucket (16), and an intermediate bucket lip (44) on the intermediate bucket (12) provide rigidity and alignment and are used in conjunction with other components as fastening means to hold the computer monitor case (10) together.

Abstract: A computer monitor case (10) having a case front (16) to which is affixed a bezel (20) using a plurality of intermediate attachment devices (28). The attachment device (28) is affixed to the bezel (20) by inserting projections (42) of the attachment device (28) within associated irregular apertures (38) in bezel attachment tabs (24) on the bezel (20). The attachment device (28) is, in turn, affixed to a case front (16) using case attachment tabs (26) and screws (30). Accordingly, the computer monitor case (10) is constructed such that moldings for affixing the bezel (20) to the case (10) are not readily visible through the transparent case (10).

Abstract: A cathode ray tube (CRT) is housed in an enclosure by using four clamp devices, two wedges and a housing. The clamp devices are located at the corners of the CRT and are secured to the enclosure with screws. The CRT rests on the housing, which is preferably comprised of fixed posts that the CRT rests on top of. The wedges, preferably made of rubber, are placed between the CRT and the enclosure and usually located at the top of the CRT. The clamp devices, housing and wedges are used to secure the CRT in the enclosure.