Abstract: An integrated circuit chip having a contact layer that includes a plurality of Vdd, Vddx, ground and I/O contacts arranged in a generally radial pattern having diagonal and major axis symmetry and generally defining four quadrants. A multilayer X-Y power grid is located beneath the contact layer. A wiring layer is interposed between the contact layer and power grid to provide a well-behaved electrical transition between the generally radial Vdd, Vddx and ground contacts and the rectangular X-Y power grid. The interposed wiring layer includes concentric square rings of Vdd, Vddx and ground wires located alternatingly with one another. The Vddx wires are discontinuous between adjacent quadrants so that the magnitude of Vddx may be different in each quadrant of the chip if desired.

Abstract: A method and a system for improving manufacturing productivity of an integrated circuit. The method including: (a) generating a set of physical design rules, (b) assigning a rule scoring equation to each physical design rule of the set of physical design rules; (c) checking a physical design of the integrated circuit for deviations from each design rule; (d) computing a score for each physical design rule, using the corresponding rule scoring equation assigned to each physical design rule, for which one or more deviations were found in step (c); and (e) computing a productivity score for the integrated circuit design based on the scores computed in step (d).

Abstract: A memory cell layout provides for sharing of power supply connections between adjacent rows and columns of a memory array, respectively by providing a subarray layout in which one power connection is serpentine, extending into adjacent rows, and another stitches together a connection of memory cells in adjacent columns and adjacent rows. The subarray layout may be expanded by reflection and produced by lithographic exposures of relatively large numbers of memory cells in a step-and-repeat fashion. The layout of the power connections to the memory cells allows a significant reduction in the number of power connections required and/or the provision of redundant connections and a shielding mesh without increase of the number of connections required as well as full exploitation of minimum feature size with increased manufacturing yield.

Abstract: A memory cell layout provides for sharing of power supply connections between adjacent rows and columns of a memory array, respectively by providing a subarray layout in which one power connection is serpentine, extending into adjacent rows, and another stitches together a connection of memory cells in adjacent columns and adjacent rows. The subarray layout may be expanded by reflection and produced by lithographic exposures of relatively large numbers of memory cells in a step-and-repeat fashion. The layout of the power connections to the memory cells allows a significant reduction in the number of power connections required and/or the provision of redundant connections and a shielding mesh without increase of the number of connections required as well as full exploitation of minimum feature size with increased manufacturing yield.

Abstract: A method and semiconductor structure are provided for intermixing circuits of two or more different cell classes, such as standard cells and gate array cells, on a common chip or substrate with minimum gound rule separation between adjacent cells of different classes. Cell locations are defined with given boundaries and contiguously arranged on the surface of a semiconductor chip, and then either standard cell type or gate array type circuits are formed within any of the cell locations to provide a structure for balancing chip density and performance versus hardware turn-around-time.

Abstract: A method and semiconductor structure are provided for intermixing circuits of two or more different cell classes, such as standard cells and gate array cells, on a common chip or substrate with minimum gound rule separation between adjacent cells of different classes. Cell locations are defined with given boundaries and contiguously arranged on the surface of a semiconductor chip, and then either standard cell type or gate array type circuits are formed within any of the cell locations to provide a structure for balancing chip density and performance versus hardware turn-around-time.

Abstract: A method and semiconductor structure are provided for intermixing circuits of two or more different cell classes, such as standard cells and gate array cells, on a common chip or substrate with minimum ground rule separation between adjacent cells of different classes. Cell locations are defined with given boundaries and contiguosuly arranged on the surface of a semiconductor chip, and then either standard cell type or gate array type circuits are formed within any of the cell locations to provide a structure for balancing the chips density and performance versus hardware turn-around-time.