Abstract: The technology described in this document can be embodied in a method that includes establishing a first wireless communication channel between a first device and a second device. The method also includes accessing, by an application executing on the first device, a transmitter of a first device to transmit to a second device one or more signals configured to cause an occurrence of an event on the second device. The one or more signals are transmitted over a second wireless communication channel between the first device and the second device. The method further includes receiving, from the second device over the first wireless communication channel, information representing a media access control (MAC) address of the first device, and storing, on a storage device accessible by the first device, a representation of the MAC address of the first device. The MAC address is associated with the second wireless communication channel.

Abstract: The technology described in this document can be embodied in a method that includes establishing a first wireless communication channel between a first device and a second device. The method also includes accessing, by an application executing on the first device, a transmitter of a first device to transmit to a second device one or more signals configured to cause an occurrence of an event on the second device. The one or more signals are transmitted over a second wireless communication channel between the first device and the second device. The method further includes receiving, from the second device over the first wireless communication channel, information representing a media access control (MAC) address of the first device, and storing, on a storage device accessible by the first device, a representation of the MAC address of the first device. The MAC address is associated with the second wireless communication channel.

Abstract: The technology described in this document can be embodied in a method that includes establishing a first wireless communication channel between a first device and a second device. The method also includes accessing, by an application executing on the first device, a transmitter of a first device to transmit to a second device one or more signals configured to cause an occurrence of an event on the second device. The one or more signals are transmitted over a second wireless communication channel between the first device and the second device. The method further includes receiving, from the second device over the first wireless communication channel, information representing a media access control (MAC) address of the first device, and storing, on a storage device accessible by the first device, a representation of the MAC address of the first device. The MAC address is associated with the second wireless communication channel.

Abstract: A connection management system comprises a wireless speaker including first and second connectors for communicating with two selected audio content source devices, respectively, of at least three audio content source devices; a rules engine that establishes a set of conditions under which the at least three audio content source devices share the first and second connectors of the wireless speaker; and a device allocation system that forms a first communication path between one of the two selected audio content source devices and the first connector of the wireless speaker and forms a second communication path between another of the two selected audio content source devices and the second connector of the wireless speaker at a time in accordance with the set of conditions established by the rules engine.

Abstract: A connection management system comprises a wireless speaker including first and second connectors for communicating with two selected audio content source devices, respectively, of at least three audio content source devices; a rules engine that establishes a set of conditions under which the at least three audio content source devices share the first and second connectors of the wireless speaker; and a device allocation system that forms a first communication path between one of the two selected audio content source devices and the first connector of the wireless speaker and forms a second communication path between another of the two selected audio content source devices and the second connector of the wireless speaker at a time in accordance with the set of conditions established by the rules engine.

Abstract: The technology described in this document can be embodied in a method that includes establishing a first wireless communication channel between a first device and a second device. The method also includes accessing, by an application executing on the first device, a transmitter of a first device to transmit to a second device one or more signals configured to cause an occurrence of an event on the second device. The one or more signals are transmitted over a second wireless communication channel between the first device and the second device. The method further includes receiving, from the second device over the first wireless communication channel, information representing a media access control (MAC) address of the first device, and storing, on a storage device accessible by the first device, a representation of the MAC address of the first device. The MAC address is associated with the second wireless communication channel.

Abstract: Processes and apparatus are described that form a solar cell absorber on a surface of a workpiece by reacting a precursor layer disposed on the surface of the workpiece with an absorber constituent vapor in a heating chamber. The absorber constituent material is delivered from an absorber constituent material delivery system in molten form into a container in the heating chamber and vaporized to be used during the reaction.

Abstract: The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

Abstract: The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.

Abstract: Processes and apparatus are described that form a solar cell absorber on a surface of a workpiece by reacting a precursor layer disposed on the surface of the workpiece with an absorber constituent vapor in a heating chamber. The absorber constituent material is delivered from an absorber constituent material delivery system in molten form into a container in the heating chamber and vaporized to be used during the reaction.

Abstract: An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member on a fluid bearing between a first end of the polishing member and a second end of the polishing member and moving the polishing member to polish the workpiece. The fluid bearing has a curved portion at which plane of travel of the polishing member changes from a first plane to a second plane. Advantages of the invention include smooth belt motion in all desired directions of movement.

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.

Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.

Abstract: The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.