Abstract: An optical imaging device includes: an optical lens; and a spaceplate configured to transmit light that has passed through the optical lens, wherein the spaceplate may include a plurality of layers configured to correct a chromatic aberration of the optical lens.

Abstract: The present disclosure relates to a bolometer pixel and a bolometer array. The bolometer pixel includes: a substrate; an absorber configured to absorb incoming light in a predetermined wavelength range and having a central absorbent body that floats above the substrate by supports; and a reflector having a reflective layer provided on the substrate to reflect light incident on the substrate, and a pattern layer provided on the reflective layer to have lens power to concentrate the incident light onto the central absorbent body.

Abstract: A thermal imaging sensor may include: a pixel array in which pixels with microbolometers are arranged in an M×N matrix, where M and N are integers greater than or equal to 2; a row controller configured to output a row control signal through one or more row control signal lines to select and control a predetermined row from among multiple rows; switches connected to the one or more row control signal lines and disposed at each pixel; and a plurality of column integrators configured to read a current signal from the pixel array obtained through a pixel output line and convert it into a voltage signal.

Abstract: A metalens includes a substrate, and a metasurface provided on the substrate and including a plurality of metaatoms, where at least one of the plurality of metaatoms may include a plurality of layers.

Abstract: A thermal image sensor and a method of manufacturing the same. The thermal image sensor includes: a substrate; a row electrode and a column electrode on the substrate; a multi-layer stack including an absorption layer and a temperature sensor; supporting arms that extend from diagonal corners of the multi-layer stack and that are spaced apart from both sides of the multi-layer stack, wherein the supporting arms have a concave-convex shape including a plurality of concave portions and a plurality of convex portions; and legs protruding from the row electrode and the column electrode, wherein the legs are connected to extended ends of the supporting arms to allow the multi-layer stack to float above the substrate.

Abstract: An imprinting stamp and a nano-imprinting method using the imprinting stamp are provided. The imprinting stamp includes a first substrate; one or more field regions on the first substrate, the first substrate including nano-patterns; and a first dummy pattern region on the first substrate and adjacent to the field region, the dummy pattern region including first dummy patterns having greater dimensions than that of the nano-patterns, the first dummy patterns being a plurality of polygons, each of the polygons having a vertex pointing in a first direction proceeding from the field region toward the first dummy pattern region.

Abstract: A stamp includes a transparent body having an inner chamber containing an inlet/outlet tube configured to have a fluid injected and removed therefrom.

Abstract: A template system, and a nano-imprint method using the same, include a template having a nano-pattern and configured to transfer the nano-pattern to a resin material on a substrate, and a pressure controlling apparatus configured to change a pressure of the template with respect to the substrate according to an intensity of bubbles captured between the substrate and the template.

Abstract: A process and an apparatus for performing a UV nano-imprint lithography are provided. The process uses a polymer pad which allows a uniform application of pressure to a patterned template and an easy removal of a residual resin layer. The apparatus includes a tilt and decentering corrector which allows an accurate alignment of layers during the nano-imprint lithography process.

Abstract: A stamp includes at least one protrusion on a protrusion pattern, and an end portion of the at least one protrusion may have a non-planarized surface. The end portion of the protrusion may have a concave structure, that is, the end portion includes a center region and an edge region, and the edge region is higher than the center region.

Abstract: A nanoimprint stamp having an alignment mark includes a transparent substrate having a plurality of convex portions, and a semitransparent layer on each of the plurality of convex portions. The semitransparent layer has a transmittance of about 20% to about 80% with respect to ultraviolet rays.

Abstract: Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask.

Abstract: A process and an apparatus for performing a UV nano-imprint lithography are provided. The process uses a polymer pad which allows a uniform application of pressure to a patterned template and an easy removal of a residual resin layer. The apparatus includes a tilt and decentering corrector which allows an accurate alignment of layers during the nano-imprint lithography process.

Abstract: Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask.

Abstract: Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask.

Abstract: A cross point memory array includes a structure in which holes are formed in an insulating layer and a storage node is formed in each of the holes. The storage node may include a memory resistor and a switching structure. The master for an imprint process used to form the cross-point memory array includes various pattern shapes, and the method of manufacturing the master uses various etching methods.

Abstract: A template system, and a nano-imprint method using the same, include a template having a nano-pattern and configured to transfer the nano-pattern to a resin material on a substrate, and a pressure controlling apparatus configured to change a pressure of the template with respect to the substrate according to an intensity of bubbles captured between the substrate and the template.

Abstract: A process and an apparatus for performing a UV nano-imprint lithography are provided. The process uses a polymer pad which allows a uniform application of pressure to a patterned template and an easy removal of a residual resin layer. The apparatus includes a tilt and decentering corrector which allows an accurate alignment of layers during the nano-imprint lithography process.

Abstract: A method of fabricating a nanoimprint stamp includes forming a resist pattern having a nano size width on a stamp substrate by performing imprint processes repeatedly. In the imprint processes, resist layers that are selectively etched are sequentially used. The stamp substrate is etched using the resist pattern as an etch mask.

Abstract: A stamp includes a transparent body having an inner chamber containing an inlet/outlet tube configured to have a fluid injected and removed therefrom.