Patents by Inventor Duk-Yong Kim

Duk-Yong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11831364
    Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.
    Type: Grant
    Filed: July 4, 2021
    Date of Patent: November 28, 2023
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Bae Mook Jeong, Chang Woo Yoo, Young Chan Moon, Nam Shin Park, Bum Sik Park, Min Seon Yun, Min Sik Park, Sung Ho Jang
  • Patent number: 11824246
    Abstract: A cavity filter comprising: a resonance element including a coupling block; a first case and a second case housing the resonance element; a terminal unit penetrating the first case to be connected to an electrode pad of a PCB provided on the outside of the first case and the other end thereof is electrically connected to the coupling block of the resonance element; and an assembly unit provided on either one side or both sides of the case, and having a terminal insertion hole in which the terminal unit is insertedly provided, wherein the assembly unit is formed to protrude to the outside from a lower surface of the first case. the assembly unit provide a height between the first casing and PCB so the cavity filter avoid interference with the devices mounted on the PCB.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: November 21, 2023
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Sung Ho Jang, Joung Hoe Kim
  • Publication number: 20230344109
    Abstract: Proposed are an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an amplification unit module which is arranged between a main board and an RF filter and into which at least one analog amplification element is built.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
  • Publication number: 20230327345
    Abstract: Proposed are an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome cover combined with the front surface of the RF filter and protecting the radiation element module from the outside. The antenna RF module provides the advantage of greatly improving overall performance in heat dissipation.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 12, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
  • Publication number: 20230327327
    Abstract: The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.
    Type: Application
    Filed: June 1, 2023
    Publication date: October 12, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO, Won Jun PARK
  • Publication number: 20230299456
    Abstract: The present invention relates to an antenna RF module, an RF module assembly, and an antenna device including same. Particularly, the present invention comprises an RF filter which has at least four outer side surfaces, a radiation element module which is disposed on one surface of the outer side surfaces of the RF filter, an amplifier substrate which is disposed on another surface of the outer side surfaces of the RF filter and on which an analogue amplification element is mounted, and a reflector which is disposed between the RF filter and the radiation element module to ground (GND) the radiation element module and also mediate the outwardly dissipating heat generated by the RF filter, wherein socket pins are coupled to a main board disposed at an antenna housing in a unit of a module.
    Type: Application
    Filed: April 19, 2023
    Publication date: September 21, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
  • Publication number: 20230291117
    Abstract: The present disclosure relates to an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome combined with the front surface of the RF filter and protecting the radiation element module from the outside.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Seong Min AHN, Jae Eun KIM, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU
  • Publication number: 20230282978
    Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a first side of the RF filter, and a reflector arranged between the RF filter and the radiation element module in such a manner as to ground (GND) the radiation element module and, at the same time, to serve as an intermediary for dissipating heat generated in the RF filter to the outside. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The advantage of greatly improving performance in heat dissipation can be achieved.
    Type: Application
    Filed: April 23, 2023
    Publication date: September 7, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
  • Publication number: 20230275623
    Abstract: The present disclosure relates to a radio transmission or reception apparatus and a beam forming method thereof. The apparatus according to the present disclosure comprises: an array antenna for forming multiple beams having different directivities so as to transmit or receive signals through the multiple beams; a digital unit for synthesizing an orthogonal polarization pair so as to generate multi-beam signals for forming the multiple beams; and an RF unit for frequency-converting the multi-beam signals so as to output each of the frequency converted multi-beam signals to the array antenna.
    Type: Application
    Filed: May 3, 2023
    Publication date: August 31, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Min Seon YUN, Tea Youl OH
  • Patent number: 11736156
    Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.
    Type: Grant
    Filed: July 4, 2021
    Date of Patent: August 22, 2023
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Bae Mook Jeong, Chang Woo Yoo, Young Chan Moon, Nam Shin Park, Bum Sik Park, Min Seon Yun, Min Sik Park, Sung Ho Jang
  • Publication number: 20230253693
    Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
  • Publication number: 20230253694
    Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
    Type: Application
    Filed: April 16, 2023
    Publication date: August 10, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
  • Publication number: 20230253695
    Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF filter, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.
    Type: Application
    Filed: April 16, 2023
    Publication date: August 10, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
  • Publication number: 20230187807
    Abstract: The present invention relates to an antenna device, comprising: a front housing including antenna arrangement units in which at least one radiation element is disposed on the front sides thereof, and heat dissipation units formed between adjacent antenna arrangement units and being exposed to outside air to transfer heat generated from the rear side to the front; and a rear housing coupled to the front housing and provided with a filter for filtering RF signals and a main board on which an RF element is mounted, wherein the heat generated from the filter is transferred to the front of the front housing through the contact with the back surface of the front housing by using the filter as a heat transfer medium.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 15, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Seong Man KANG, Oh Seog CHOI, Yong Won SEO, Hyoung Seok YANG
  • Publication number: 20230109083
    Abstract: The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.
    Type: Application
    Filed: December 5, 2022
    Publication date: April 6, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Bae Mook JEONG
  • Publication number: 20230099375
    Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.
    Type: Application
    Filed: December 5, 2022
    Publication date: March 30, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Kyu Chul CHOI, Hye Yeon KIM, In Hwa CHOI, Jae Ho JANG, Jae Hyun PARK, Youn Jun CHO, Jeong Hyun CHOI
  • Publication number: 20230047942
    Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jae Hyun PARK, Kyo Sung JI, Hye Yeon KIM, Chi Back RYU, Jeong Hyun CHOI, Jae Ho JANG
  • Publication number: 20230021186
    Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed
    Type: Application
    Filed: September 18, 2022
    Publication date: January 19, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Jin Soo YEO, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jeong Hyun CHOI, Jae Hyun PARK
  • Publication number: 20220354018
    Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Jin Soo YEO, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jeong Hyun CHOI, Jae Hyun PARK
  • Patent number: D966241
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: October 11, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi