Abstract: The present invention relates to an antenna device, comprising: a front housing including antenna arrangement units in which at least one radiation element is disposed on the front sides thereof, and heat dissipation units formed between adjacent antenna arrangement units and being exposed to outside air to transfer heat generated from the rear side to the front; and a rear housing coupled to the front housing and provided with a filter for filtering RF signals and a main board on which an RF element is mounted, wherein the heat generated from the filter is transferred to the front of the front housing through the contact with the back surface of the front housing by using the filter as a heat transfer medium.

Abstract: The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.

Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.

Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed

Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.

Abstract: The present invention relates to a cooling device for an antenna apparatus. Particularly, the cooling device comprises a heat-dissipating cover which has an inner surface exposed to a thermal space and an outer surface exposed to the outside where outside air flows, and multiple wave heat-dissipating fins which are disposed in multiple rows on the outer surface of the heat-dissipating cover so as to be thermally conductive, and form curved surfaces that are continuous from the outer surface of the heat-dissipating cover to a discretionary height, in which the horizontal cross-sections at the discretionary height have straight-line shapes in which same are rotated by a predetermined angle in any one direction from the horizontal cross-sections on the outer surface of the heat-dissipating cover. Therefore, the present invention provides the advantage of enhancing heat-dissipating performance.

Abstract: An antenna device is disclosed for implementing spatial-polarization separation of beams using a quad-polarized antenna module array. The antenna device including a quad-polarized antenna module array including first and second quad-polarized antenna modules in which signal paths of radiating elements having the same polarization direction are coupled, and configured to radiate first and second beams having different polarizations, and a polarization/separation beamforming module configured to set phases between signals to be different from each other so that the first beam and the second beam are spatially separated.

Abstract: The present invention relates to an apparatus and method for measuring signal quality of an antenna.

Abstract: A quad-polarized antenna module is provided for implementing temporal-polarization separation.

Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.

Abstract: The present invention relates to a time-division duplex (TDD) antenna apparatus which can reduce signal loss, and thereby minimize the noise figure (NF) of a system and extend uplink coverage of the system, by separating a transmitter circuit from a receiver circuit of the antenna apparatus, and disposing a low noise amplifier (LNA) of the receiver circuit between a reception antenna and a reception filter of the receiver. A time-division duplex antenna apparatus according to an embodiment of the present invention includes: a transmitter which includes at least one transmission antenna module and transmits a downlink signal through a first path; a receiver which includes at least one reception antenna module and receives an uplink signal through a second path that is separated from the first path without any overlapping portions thereof; and a controller which controls the transmitter and the receiver in a time-division duplex manner.

Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe.

Abstract: The present disclosure includes, in a dual polarized omni-directional antenna and a base station including the same, a plurality of radiating elements disposed to be spaced apart in one direction by the dual polarized omni-directional antenna, and a feed line for providing a feed signal to the plurality of radiating elements, and the plurality of radiating elements include a first radiator for generating one polarization of dual polarization, and a second radiator for generating the other polarization of the dual polarization, respectively, the first radiator is prepared on a first surface, and the second radiator is prepared on a second surface, and a main lobe direction of the first radiator and a main lobe direction of the second radiator are different directions from each other.

Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.

Abstract: The present disclosure includes, in a dual polarized omni-directional antenna and a base station including the same, a plurality of radiating elements disposed to be spaced apart in one direction by the dual polarized omni-directional antenna, and a feed line for providing a feed signal to the plurality of radiating elements, and the plurality of radiating elements include a first radiator for generating one polarization of dual polarization, and a second radiator for generating the other polarization of the dual polarization, respectively, the first radiator is prepared on a first surface, and the second radiator is prepared on a second surface, and a main lobe direction of the first radiator and a main lobe direction of the second radiator are different directions from each other.

Abstract: Provided is an antenna device including a first antenna body, and a power supply module detachably attached to the first antenna body. The power supply module is provided on a fastening region of a first radiation fin of the first antenna body.