Abstract: The present disclosure relates to polyurethane comprising a reaction product of a reactive mixture including a polyester polyol, a diol chain extender, a diisocyanate; and a reactive, tertiary amine. The present disclosure further provides polishing layers and polishing pads fabricated therefrom. Additionally, the present disclosure provides polishing systems and polishing methods employing said polishing layers and polishing pads.

Abstract: Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and articles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

Abstract: Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

Abstract: An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

Abstract: A polishing pad includes a textured polishing layer comprising a working surface and a second surface opposite the working surface. The textured polishing layer comprises a polymeric blend comprising thermoplastic urethane in an amount of between 40 and 95 wt. %, and styrenic copolymer in an amount of between 5 and 60 wt. %, based on the total weight of the textured polishing layer.

Abstract: Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

Abstract: A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major surface. At least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

Abstract: Polymeric foam layer having a thickness up to 25,700 micrometers, having first and second opposed major surfaces, and comprising foam features extending from or into the first major surface by at least 100 micrometers, and having a Tg in a range from ?125° C. to 150° C., wherein the first and second opposed major surfaces are free of exposed internal porous cells (i.e., less than 10 percent of the surface area of each of the first and second major surface has any exposed porous cells) and wherein at least 40 percent by area of each major surface has an as-cured surface; and methods of making the same. Exemplary uses of polymeric foam layers described herein including a finishing pad for silicon wafers and vibration damping.

Abstract: An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

Abstract: An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.

Abstract: A polishing solution includes a fluid component and a plurality of ceramic abrasive composites. The ceramic abrasive composites include individual abrasive particles uniformly dispersed throughout a porous ceramic matrix. At least a portion of the porous ceramic matrix includes glassy ceramic material. The ceramic abrasive composites are dispersed in the fluid component.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: A multi-layered polishing pad arrangement includes a first polishing pad layer having a first top and a first bottom major surface, a second polishing pad layer having a second top and a second bottom major surface, and a coupling arrangement disposed between the first bottom surface and the second top surface. The thickness of each of the first and second polishing pad layer ranges between 0.125 mm and 10 mm.

Abstract: An abrasive element precursor includes a green body ceramic element having a first major surface, a second major surface, a plurality of inorganic particles, and a binder. At least the first major surface comprises a plurality of precisely shaped features. The plurality of inorganic particles is at least about 99% carbide ceramic by weight.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.