Abstract: The present disclosure describes embodiments of driver circuit. The driver circuit includes a first impedance element electrically coupled to a first inverter circuit and a second impedance element electrically coupled to the first impedance element and a second inverter circuit. For a first encoding using the driver circuit, the first inverter circuit and the second inverter circuit are controlled such that a first current flows through the first and second impedance elements, the first current having a first value and a first direction. For a second encoding using the driver circuit, the first inverter circuit and the second inverter circuit are controlled such that a second current flows through the first and second impedance elements, the second current having a second value and a second direction. The first value is substantially the same as the second value and the first direction is opposite to the second direction.

Abstract: A flexible display panel is provided, which includes a base substrate, a thin film transistor (TFT) array layer, and an encapsulation layer. The TFT array layer includes an inorganic layer. An organic layer is disposed on the TFT array layer in a non-display region. The organic layer is defined with a hollow structure at least penetrating the organic layer and the encapsulation layer covers the hollow structure. The organic layer includes a planarization layer, a pixel definition layer, and a support layer. The hollow structure includes grooves with different groove levels, which improves a bending resistance of the flexible display panel and prevents cracks from extending to a display region.

Abstract: An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer. The first metal layer is disposed on the substrate and configured to transmit a ground signal. The first insulating layer is disposed on the first metal layer and includes at least one first opening. The second metal layer is disposed on the first insulating layer and electrically connected to the first metal layer through the at least one first opening. The second insulating layer is disposed on the second metal layer and includes at least one second opening. In the top view direction, the at least one first opening is separated from the at least one second opening. The electronic device in the embodiments of the disclosure and the manufacturing method thereof may improve the process yield.

Abstract: A packaged radio-frequency device can include a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side and a first overmold structure implemented on the first side, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement a redundant ground pad or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.

Abstract: Provided are modified microorganisms, such as live recombinant commensal bacteria, that express a non-native antigen, or are surface-labeled with a non-native antigen, and methods of using the modified microorganisms to induce an antigen-specific immune response to the non-native antigen. The modified microorganism can be used to induce a regulatory T cell immune response to the heterologous antigen to treat an autoimmune disease in a subject in need thereof, or can be used to induce an effector T cell immune response to the heterologous antigen to treat an infectious disease or proliferative disease in a subject in need thereof.

Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

Abstract: Shielded module fabrication methods and devices. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

Abstract: A method for manufacturing an electronic device includes the following steps. A substrate including a first region and a second region is provided. A seed layer is formed on the substrate. A circuit structure layer is formed on the seed layer, and the circuit structure layer has a plurality of first circuit structures disposed on the first region and a plurality of second circuit structures disposed on the second region. The first circuit structures and the second circuit structures are electrically connected through the seed layer. A circuit test process is performed and includes applying a predetermined voltage to the second circuit structures to test the first circuit structures to determine whether the first circuit structures are normal or not.

Abstract: A dual-sided molded package module has a substrate, and a die and multiple posts attached to a bottom side of the substrate. A bottom mold surrounds and extends between the posts and the die. Electrically and thermally conductive interconnect members are attached to the posts and extend through the bottom mold. A thermally conductive layer is attached to a bottom facing surface of the die. The thermally conductive layer extends through the mold and couples to a motherboard (e.g., via solder material) so that the thermally conductive layer can dissipate heat from the die to the motherboard.

Abstract: A dual-sided packaged radio-frequency (RF) module comprises a packaging substrate having a first surface with at least one RF circuit component mounted thereon and a second surface opposite to the first surface with at least one circuitry component mounted thereon, at least one contact feature attached to the second surface of the packaging substrate, a vertical extension of the at least one contact feature being larger than a distance between a bottom surface of the at least one circuitry component and the second surface of the packaging substrate, an underside molding encapsulating the at least one circuitry component and the at least one contact feature, a bottom surface of the underside molding being flush with the bottom surface of the at least one circuitry component, and a trench structure formed in the underside molding around the at least one contact feature.

Abstract: Zr-based metal-organic frameworks (Zr-MOFs) independently comprising the following formula and/or structure: Zr6O4(OH)4(polycarboxylate)6, and methods of making and using same. In various examples, a method produces a Zr-MOF or Zr-MOFs. In various examples, a Zr-MOF is a hydrogen sulfide (H2S)-loaded Zr-MOF. In various examples, a method produces a (H2S)-loaded Zr-MOF or (H2S)-loaded Zr-MOF. In various examples, a Zr-MOF or Zr-MOFs is/are used to deliver H2S to an aqueous environment, a solvent, or the like. In various examples, a Zr-MOF or Zr-MOFs is/are used to deliver H2S to an aqueous environment, a solvent, or the like. In various examples, a Zr-MOF or Zr-MOFs is/are used to deliver H2S to an individual, such as, for example, an individual suffering from or at risk of an ischemia-reperfusion injury, inflammation, a wound, or the like, or any combination thereof.

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.

Abstract: A manufacturing method of a semiconductor package is provided. The manufacturing method includes the following. A plurality of semiconductor components are provided. Each semiconductor component has at least one conductive bump. A substrate is provided. The substrate has a plurality of conductive pads. A transfer device is provided. The transfer device transfers the semiconductor components onto the substrate. A heating device is provided. The heating device heats or pressurizes at least two semiconductor components. During transferring of the semiconductor components to the substrate, the at least one conductive bump of each semiconductor component is docked to a corresponding one of the conductive pads.

Abstract: An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.

Abstract: An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can be L-shaped. The L-shaped interconnect member with can be positioned at or proximate one of the corners. The interconnect members can be arranged as a two-dimensional array, with first interconnect members each occupying a single array location, and second interconnect members each occupying at least three array locations that are arranged nonlinearly. The package can be a dual-sided molded package.

Abstract: Provided herein are agents that modulate histone acetylation and pathways downstream thereof, and methods for the treatment and prevention of organ injury therewith. In particular, provided herein are combinations of histone deacetylase (HDAC) inhibitors, bromodomain and extraterminal-containing protein family (BET) inhibitors, promoters of histone acetyl transferase (HAT) activity, mineralocorticoid receptor (MR) antagonists, nuclear factor erythroid 2-related factor 2 (NRF2) activators, and/or aldehyde dehydrogenase (ALDH) agonists, and methods of use thereof for the treatment and prevention of heart injury.