Patents by Inventor E. Jennings Taylor

E. Jennings Taylor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8226804
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: July 24, 2012
    Assignees: The United States of America as represented by the Secretary of the Air Force, Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, E. Jennings Taylor
  • Publication number: 20120091000
    Abstract: An electrolytic filtration method and apparatus for the concentration and collection of suspended particulates from aqueous solutions is disclosed. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. The electrolytic cell also contains a filter, and in one embodiment the filter is a moving belt filter. While not bound by theory, the electrolytic filtration method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution away from the filter under the influence of an electric field. In one embodiment the electric field is a pulsed waveform with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 19, 2012
    Applicants: FARADAY TECHNOLOGY, INC., ALGAEVENTURE SYSTEMS, PHYSICAL SCIENCES, INC.
    Inventors: E. Jennings Taylor, Maria I. Inman, Joseph Kell, Heather McCrabb, Anthony Ferrante, Ross Youngs, John Nicholas Meister, James Robert Cook
  • Publication number: 20120091002
    Abstract: An electrolytic method and apparatus for the concentration and collection of suspended particulates from solutions is disclosed. In one embodiment, the solution is an aqueous solution and the suspended particles are algae particles. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. While not bound by theory, the electrolytic method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution under the influence of an electric field. In one embodiment the electric field is a pulsed wavefrom with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.
    Type: Application
    Filed: September 23, 2011
    Publication date: April 19, 2012
    Applicant: FARADAY TECHNOLOGY, INC.
    Inventors: E. Jennings Taylor, Maria I. Inman, Joseph Kell
  • Publication number: 20110303553
    Abstract: An electrochemical machining system for metals and alloys having a strongly passivating character including an electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, a workpiece spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the workpiece, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 15, 2011
    Inventors: Maria E. Inman, E. Jennings Taylor, Alonso Lozano-Morales, Holly Garich, Timothy Hall
  • Publication number: 20110209991
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Application
    Filed: April 14, 2011
    Publication date: September 1, 2011
    Inventors: Lawrence E. Gebhart, E. Jennings Taylor
  • Patent number: 7947161
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: May 24, 2011
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, E. Jennings Taylor
  • Publication number: 20110017608
    Abstract: A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
    Type: Application
    Filed: July 27, 2010
    Publication date: January 27, 2011
    Applicant: FARADAY TECHNOLOGY, INC.
    Inventors: E. Jennings Taylor, Jenny J. Sun, Alonso Lozano-Morales, Heather McCrabb, Maria E. Inman
  • Publication number: 20090205953
    Abstract: An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Application
    Filed: April 28, 2009
    Publication date: August 20, 2009
    Applicant: FARADAY TECHNOLOGY, INC.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • Patent number: 7553401
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: June 30, 2009
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, Jenny J. Sun, Phillip O. Miller, E. Jennings Taylor
  • Publication number: 20070158204
    Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.
    Type: Application
    Filed: January 5, 2007
    Publication date: July 12, 2007
    Applicant: FARADAY TECHNOLOGY, INC.
    Inventors: E. Jennings Taylor, Jenny J. Sun
  • Patent number: 7022216
    Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodi
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: April 4, 2006
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Heather Dyar
  • Patent number: 6878259
    Abstract: A smooth layer of a metal is electroplated onto a microrough electrically conducting substrate by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50% and said anodic pulses have a duty cycle greater than about 50%, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz. The plating bath is substantially devoid of levelers and may be devoid of brighteners.
    Type: Grant
    Filed: April 3, 2001
    Date of Patent: April 12, 2005
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Chengdong Zhou, Jenny J. Sun
  • Patent number: 6863793
    Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a twostep process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.
    Type: Grant
    Filed: April 3, 2001
    Date of Patent: March 8, 2005
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Jenny J. Sun, Maria E. Inman
  • Patent number: 6827833
    Abstract: The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train of long cathodic pulses followed by short anodic pulses even in the absence of conventional additives such as levelers and brighteners.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: December 7, 2004
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Jenny J. Sun
  • Patent number: 6750144
    Abstract: A method for filling recesses of different sizes on a semiconductor substrate comprising immersing a semiconductor substrate having a surface provided with recesses of different sizes in an electroplating bath containing ions of a metal to be deposited on the surface; immersing a counter electrode in the plating bath; passing an electric current between the substrate and the counterelectrode; wherein, in a first electroplating step, the electric current is a modulated reversing electric current comprising a train of pulses that are cathodic with respect to the substrate and pulses that are anodic with respect to the substrate, whereby the pulse train in the first step has a first period, the cathodic pulses have an on-time of from about 0.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: June 15, 2004
    Assignee: Faraday Technology Marketing Group, LLC
    Inventor: E. Jennings Taylor
  • Publication number: 20040011666
    Abstract: A method for selectively removing a layer of electrolytically dissoluble metal from a substrate comprising providing a substrate bearing' on a major surface thereof a layer of electrolytically dissoluble metal, said metal layer serving; as a dissoluble electrode; providing at least a first counterelectrode and a second counterelectrode; positioning said counterelectrodes opposite said metal layer and spaced from said metal layer; in a first electrolytic step, interposing an electrolyte between said metal and said first counterelectrode and in electrical contact with said metal layer and said electrode and passing an electric current between said first counterelectrode and said metal layer, wherein said first counterelectrode is maintained cathodic to said metal layer, for a period of time until said metal layer has been removed from a first central region of said surface of said substrate opposite said first counterelectrode; in a second electrolytic step, interposing an electrolyte between said metal and sai
    Type: Application
    Filed: June 11, 2003
    Publication date: January 22, 2004
    Inventors: E. Jennings Taylor, Heather Dyar, Patrick MacCarthy
  • Publication number: 20040004006
    Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising:
    Type: Application
    Filed: June 11, 2003
    Publication date: January 8, 2004
    Inventors: E. Jennings Taylor, Heather Dyar
  • Patent number: 6652727
    Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: November 25, 2003
    Assignee: Faraday Technology Marketing Group, LLC
    Inventors: E. Jennings Taylor, Jenny J. Sun, Maria E. Inman
  • Publication number: 20030178315
    Abstract: A method for filling recesses of different sizes on a semiconductor substrate comprising immersing a semiconductor substrate having a surface provided with recesses of different sizes in an electroplating bath containing ions of a metal to be deposited on the surface; immersing a counter electrode in the plating bath; passing an electric current between the substrate and the counterelectrode; wherein, in a first electroplating step, the electric current is a modulated reversing electric current comprising a train of pulses that are cathodic with respect to the substrate and pulses that are anodic with respect to the substrate, whereby the pulse train in the first step has a first period, the cathodic pulses have an on-time of from about 0.
    Type: Application
    Filed: February 14, 2003
    Publication date: September 25, 2003
    Inventor: E. Jennings Taylor
  • Patent number: 6558231
    Abstract: A surface of an electrolytically dissolvable material, e.g., an electrolytically dissolvable metal, is smoothed by a two-step electrochemical process wherein a the surface to be smoothed and a counterelectrode are contacted with an electrolyte and an electric current is passed between the substrate and counterelectrode, with the substrate as the anode. In a first step relatively large asperities on the substrate are reduced in height by maintaining a macroprofile regime by using a pulsed electric current with short pulses. In a second step, small asperities and the remainder of the large asperities are reduced or removed by maintaining a microprofile regime by using a pulsed current having longer pulses or a direct current.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: May 6, 2003
    Assignee: Faraday Technology Marketing Goup, LLC
    Inventor: E. Jennings Taylor