Abstract: A system for moving and transporting cargo, such as bundled cores and tubes, that doesn't require wheeled carts. The system may comprise a forklift truck, a front engagement device connecting the cargo to the forklift truck, a rear roller unit, and one or more spaced apart bottom supports. When the forklift forks are in the raised position, the cargo front (leading) end is tilted above the cargo rear (trailing) end and the bottom supports are disengaged from the floor, allowing the cargo to be moved.

Abstract: The present application relates to a system comprising a processor configured to execute a digital system model based on simulated conditions to generate simulated data. The processor may also be configured to train a surrogate model using at least the simulated data to approximate the digital system model of the system and generate, using the trained surrogate model, estimated values for conditions or parameters of the systems based on operational data, wherein the operational data includes sensor data or in-service data from the system. Further, the processor may be configured to execute the digital system model of the system to generate simulation data based on the operational data and the estimated values or parameters generated by the surrogate model and synchronize or update a digital twin of the system based on the simulation data, wherein the digital twin represents a state or condition of the system.

Abstract: A web splice for attaching two webs, such as paper webs used in paper converting operations. The web splice comprises a non-linear butt joint. The butt joint forms an acute included angle (?) with the side edges.

Abstract: A system for moving and transporting cargo, such as bundled cores and tubes, that doesn't require wheeled carts. The system may comprise a forklift truck, a front engagement device connecting the cargo to the forklift truck, a rear roller unit, and one or more spaced apart bottom supports. When the forklift forks are in the raised position, the cargo front (leading) end is tilted above the cargo rear (trailing) end and the bottom supports are disengaged from the floor, allowing the cargo to be moved.

Abstract: An improved core for mounting on one or more core engaging elements such as a pair of chucks and a method of making an improved core are provided. The core is adapted to wind and unwind material thereon. The core may comprise a high coefficient of friction coating disposed on the inner surface of the core to improve the core-chuck interaction. The inner surface may be mechanically or chemically treated to improve core-chuck interaction.

Abstract: Antimicrobial system including a luminaire configured to emit a disinfection light in an ultraviolet band for disinfecting a vicinity of a target pathogen. A switching device that includes a primary relay pack. The primary relay pack has a communication interface, a measurement circuit, a processor, and disinfection monitoring programming in a memory. Execution of the disinfection monitoring programming by the processor configures the primary relay pack to perform the following functions. Based on a second input from the operator, produce a visual inspection signal. Monitor, via the measurement circuit, a power parameter of the luminaire. Compare the monitored power parameter with an active disinfection threshold, a passive operation threshold, or a combination thereof. In response to the comparison, either determine that the disinfection light source is unexpectedly on, is degraded or disabled, or the luminaire is inoperable; or control power to the luminaire to emit the disinfection light.

Abstract: An improved core for mounting on one or more core engaging elements such as a pair of chucks and a method of making an improved core are provided. The core is adapted to wind and unwind material thereon. The core may comprise a high coefficient of friction coating disposed on the inner surface of the core to improve the core-chuck interaction. The inner surface may be mechanically or chemically treated to improve core-chuck interaction.

Abstract: An improved core for mounting on one or more core engaging elements such as a pair of chucks and a method of making an improved core are provided. The core is adapted to wind and unwind material thereon. The core comprises a high coefficient of friction coating disposed on the inner surface of the core to improve core-chuck interaction.

Abstract: A system can aggregate product movement information from a plurality of external information sources and convert the information into provider transactions. Compliance events can be identified in the provider transactions and associated with controlling identifiers assigned to providers associated with the provider transactions from which the compliance events are identified. Risk factor scores can be generated for providers by applying a scoring system to the compliance events and final dispositions of provider transactions respectively associated with providers. A compliance profile can be generated for each provider based on the provider's risk factor scores. The provider's compliance profile can be requested with, transmitted to, and displayed by a graphical user interface operated by an individual or entity authorized to view that provider's compliance profile.

Abstract: A web splice for attaching two webs, such as paper webs used in paper converting operations. The web splice comprises a non-linear butt joint. The butt joint forms an acute included angle (?) with the side edges.

Abstract: A well production stream solid debris separator apparatus. The apparatus includes a spherical vessel. A cylindrical sump extends below and radially from the spherical vessel. A centrifugal cylinder is positioned within the spherical vessel, the centrifugal cylinder having an axis concentric with a diameter of the spherical vessel and having an open bottom. An outlet port passes through the cylindrical vessel and through the spherical vessel with the outlet port opposed to the cylindrical sump. An inlet port passes through the spherical vessel and passes into the centrifugal cylinder substantially tangential to an inner surface of the centrifugal cylinder.

Abstract: An improved core for mounting on one or more core engaging elements such as a pair of chucks and a method of making an improved core are provided. The core is adapted to wind and unwind material thereon. The core comprises a high coefficient of friction coating disposed on the inner surface of the core to improve core-chuck interaction.

Abstract: A method of image sensor fabrication includes forming a second semiconductor layer on a back side of a first semiconductor layer. The method also includes forming one or more groups of pixels disposed in a front side of the first semiconductor layer. The one or more groups of pixels include a first portion of pixels separated from the second semiconductor layer by a spacer region, and a second portion of pixels, where a first doped region of the second portion of pixels is in contact with the second semiconductor layer. Pinning wells are also formed and separate individual pixels in the one or more groups of pixels, and the pinning wells extend through the first semiconductor layer. Deep pinning wells are also formed and separate the one or more groups of pixels.

Abstract: Arrayed imaging systems include an array of detectors formed with a common base and a first array of layered optical elements, each one of the layered optical elements being optically connected with a detector in the array of detectors.

Abstract: Monitoring resource allocation requests to computer resources shared between a plurality of computers includes detecting an allocation request by an application for a first set of the plurality of computer resources and assigning the application to a group, wherein each member of the group comprises a respective application having an associated allocation request for an associated set of the plurality of computer resources. Determining that the first set of the plurality of computer resources cannot be allocated by the application, and determining that the first application generates a function call instructing other members of the group, if any, to request allocation of their associated set of the plurality of computer resources results in incrementing a counter value corresponding to the group. A message is sent when the counter value exceeds a predetermined threshold.

Abstract: A method of image sensor fabrication includes forming a second semiconductor layer on a back side of a first semiconductor layer. The method also includes forming one or more groups of pixels disposed in a front side of the first semiconductor layer. The one or more groups of pixels include a first portion of pixels separated from the second semiconductor layer by a spacer region, and a second portion of pixels, where a first doped region of the second portion of pixels is in contact with the second semiconductor layer. Pinning wells are also formed and separate individual pixels in the one or more groups of pixels, and the pinning wells extend through the first semiconductor layer. Deep pinning wells are also formed and separate the one or more groups of pixels.

Abstract: A pixel array including an SixGey layer disposed on a first semiconductor layer. A plurality of pixels is disposed in the first semiconductor layer. The plurality of pixels includes: (1) a first portion of pixels separated from the SixGey layer by a spacer region and (2) a second portion of pixels including a first doped region in contact with the SixGey layer. The pixel array also includes pinning wells disposed between individual pixels in the plurality of pixels. A first portion of the pinning wells extend through the first semiconductor layer. A second portion of the pinning wells extend through the first semiconductor layer and the SixGey layer.

Abstract: A method of fabricating an image system includes forming a first wafer that includes a first semiconductor substrate and a first interconnect layer. A pixel array is formed in an imaging region of the first semiconductor substrate and a first insulation-filled trench is formed in a peripheral circuit region of the first semiconductor substrate. Additionally, a second wafer is formed that includes a second semiconductor substrate and a second interconnect layer. A second insulation-filled trench is formed in a second semiconductor substrate, and the first wafer is bonded to the second wafer. A third interconnect layer of a third wafer is bonded to the second wafer. At least one deep via cavity is formed through the first and second interconnect layers and through the first and second insulation-filled trenches. The at least one deep via cavity is filled with a conductive material to form a deep via.

Abstract: Embodiments of an image sensor pixel that includes a photosensitive element, a floating diffusion region, and a transfer device. The photosensitive element is disposed in a substrate layer for accumulating an image charge in response to light. The floating diffusion region is dispose in the substrate layer to receive the image charge from the photosensitive element. The transfer device is disposed between the photosensitive element and the floating diffusion region to selectively transfer the image charge from the photosensitive element to the floating diffusion region. The transfer device includes a buried channel device including a buried channel gate disposed over a buried channel dopant region. The transfer device also includes a surface channel device including a surface channel gate disposed over a surface channel region. The surface channel device is in series with the buried channel device. The surface channel gate has the opposite polarity of the buried channel gate.

Abstract: An image sensor includes a pixel array disposed in a first semiconductor die. The pixel array is partitioned into a plurality of pixel sub-arrays. Each one of the plurality of pixel sub-arrays is arranged into a plurality of pixel groups. Each one of the plurality of pixel groups is arranged into a p×q array of pixel cells. A plurality of readout circuits is disposed in a second semiconductor die. An interconnect layer is stacked between the first semiconductor die and the second semiconductor die. The interconnect layer includes a plurality of conductors. Each one of the plurality of pixel sub-arrays is coupled to a corresponding one of the plurality of readout circuits through a corresponding one of the plurality of conductors.