Patents by Inventor Earl Jensen

Earl Jensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240274401
    Abstract: An instrumented substrate is used in a substrate processing system to determine offsets to a chuck and a focus ring. The instrumented substrate includes line sensors which generate line images and a controller which determines the offsets based on the line images. A substrate handler then repositions the instrumented substrate to reduce the offsets.
    Type: Application
    Filed: February 6, 2024
    Publication date: August 15, 2024
    Inventors: James Richard Bella, Earl Jensen, Alexander Buettner, Emanuel Saerchen
  • Patent number: 11823925
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: November 21, 2023
    Assignee: KLA Corporation
    Inventors: Mei Sun, Earl Jensen, Jing G Zhou, Ran Liu
  • Patent number: 11668601
    Abstract: An instrumented substrate apparatus is configured to measure wavelength-resolved radiation, such as extreme ultraviolet radiation. The instrumented substrate apparatus includes a substrate and photoelectric sensors on the substrate. The photoelectric sensors include a photoemissive material, a photoelectron collector, and a measurement circuit. The measurement circuit is electrically coupled to the photoemissive material and the photoelectron collector. The measurement circuit is configured to measure a current generated by the photoelectron collectors by a current meter. Such current is used to determine the wavelength-resolved EUV measurement information by a controller on the instrumented substrate apparatus, or by communicating the current to a factory automation system.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: June 6, 2023
    Assignee: KLA Corporation
    Inventors: Robert D. Tas, Earl Jensen
  • Publication number: 20220189803
    Abstract: A process condition measurement apparatus is disclosed. The apparatus includes a substrate, one or more insulation portions, a first plurality of interconnect traces, a second plurality of interconnect traces, and a plurality of sensors disposed on the substrate. The second plurality of interconnect traces is disposed over the first plurality of interconnect traces and intersects at a plurality of locations to form a matrix of interconnect junctions across one or more locations of the substrate. A respective sensor is electrically coupled to a respective trace of the first and second plurality of interconnect traces. The respective sensor is individually readable by addressing the respective trace of the first and second plurality of interconnect traces.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 16, 2022
    Inventors: Farhat A. Quli, Andrew Nguyen, James Richard Bella, Earl Jensen, Huey Tzeng, Jing Zhou
  • Publication number: 20210262859
    Abstract: An instrumented substrate apparatus is configured to measure wavelength-resolved radiation, such as extreme ultraviolet radiation. The instrumented substrate apparatus includes a substrate and photoelectric sensors on the substrate. The photoelectric sensors include a photoemissive material, a photoelectron collector, and a measurement circuit. The measurement circuit is electrically coupled to the photoemissive material and the photoelectron collector. The measurement circuit is configured to measure a current generated by the photoelectron collectors by a current meter. Such current is used to determine the wavelength-resolved EUV measurement information by a controller on the instrumented substrate apparatus, or by communicating the current to a factory automation system.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 26, 2021
    Applicant: KLA Corporation
    Inventors: Robert D. Tas, Earl Jensen
  • Patent number: 10900843
    Abstract: A sensor for detecting a temperature distribution imparted on a substrate in an environment is disclosed. The sensor includes a sensor substrate with one or more temperature sensing elements formed on the sensor substrate. In embodiments, a temperature sensing element includes at least one cavity with a thermally expandable material disposed within the cavity and a channel extending from the cavity with a slug disposed within the channel. In embodiments, the cavity has a fixed volume and is enclosed by a cover layer disposed or formed over the cavity. The thermally expandable material is configured to extend from the cavity into the channel to actuate the slug from a first position within the channel to at least a second position within the channel, where the position of the slug is indicative of a temperature of a respective portion of the sensor substrate.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: January 26, 2021
    Assignee: KLA Corporation
    Inventor: Earl Jensen
  • Patent number: 10777393
    Abstract: A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. The collector portion is the top surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 15, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Earl Jensen, Mei Sun
  • Publication number: 20200203200
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Application
    Filed: October 28, 2019
    Publication date: June 25, 2020
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu
  • Publication number: 20190368944
    Abstract: A sensor for detecting a temperature distribution imparted on a substrate in an environment is disclosed. The sensor includes a sensor substrate with one or more temperature sensing elements formed on the sensor substrate. In embodiments, a temperature sensing element includes at least one cavity with a thermally expandable material disposed within the cavity and a channel extending from the cavity with a slug disposed within the channel. In embodiments, the cavity has a fixed volume and is enclosed by a cover layer disposed or formed over the cavity. The thermally expandable material is configured to extend from the cavity into the channel to actuate the slug from a first position within the channel to at least a second position within the channel, where the position of the slug is indicative of a temperature of a respective portion of the sensor substrate.
    Type: Application
    Filed: July 17, 2018
    Publication date: December 5, 2019
    Inventor: Earl Jensen
  • Patent number: 10460966
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 29, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu
  • Patent number: 10215626
    Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: February 26, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Earl Jensen, Kevin O'Brien
  • Publication number: 20180114681
    Abstract: A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. The collector portion is the top surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).
    Type: Application
    Filed: December 21, 2017
    Publication date: April 26, 2018
    Inventors: Earl Jensen, Mei Sun
  • Publication number: 20180052045
    Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.
    Type: Application
    Filed: October 12, 2017
    Publication date: February 22, 2018
    Inventors: Mei Sun, Earl Jensen, Kevin O'Brien
  • Publication number: 20170365495
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Application
    Filed: September 27, 2016
    Publication date: December 21, 2017
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu
  • Patent number: 9823121
    Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: November 21, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Earl Jensen, Kevin O'Brien
  • Patent number: 9719867
    Abstract: A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: August 1, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Stephen Sharratt, Farhat Quli, Earl Jensen, Mei Sun
  • Patent number: 9620400
    Abstract: Some aspects of the present disclosure relate to a system having a substrate device, a substrate support surface, and a substrate handler that positions the substrate device on the substrate support surface. The substrate device and the substrate support surface may have counterpart coarse position units and fine position units. The system may measure coarse positional offsets between the first and second coarse position units, re-position the substrate device on the substrate support surface based on the coarse positional offsets, and subsequently measure fine positional offsets between the first and second fine position units. In some implementations, the substrate device is integrally coupled to the substrate handler via a wireless communication link in order to communicate position information as feedback for further placement.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: April 11, 2017
    Assignee: KLA-TENCOR CORPORATION
    Inventors: Earl Jensen, Kevin O'Brien
  • Patent number: 9360302
    Abstract: A measurement unit comprising a light source and a photodetector may be formed in a cavity in a substrate. The light source produces light that impinges a material layer and is reflected back to the photodetector. Through methods such as interferometry and ellipsometry, the thickness of the material layer may be calculated from the light intensity data measured by the photodetector. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: June 7, 2016
    Assignee: KLA-Tencor Corporation
    Inventors: Earl Jensen, Kevin O'Brien, Farhat Quli, Mei Sun
  • Patent number: 9356822
    Abstract: Aspects of the present disclosure describe a smart docking station. The smart docking station may contain a data transfer and an electrical connection which allow a sensor wafer to be charged and to upload and download data. The smart docking station may be located at an off-track storage position above a tool. This location enables an automated materials handling system (AMHS) to retrieve the sensor wafer and deliver it to a tool requiring analysis. The sensor wafer may be stored in a smart front opening unified pod (FOUP). It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: May 31, 2016
    Assignee: KLA-Tencor Corporation
    Inventor: Earl Jensen
  • Publication number: 20160138969
    Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.
    Type: Application
    Filed: October 12, 2015
    Publication date: May 19, 2016
    Inventors: Mei Sun, Earl Jensen, Kevin O'Brien