Patents by Inventor Ebrahim Abunasrah

Ebrahim Abunasrah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10305204
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 28, 2019
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20180323525
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 8, 2018
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 10069225
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: September 4, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 10056706
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 21, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 9985367
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 29, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170365943
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 21, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170302011
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 5, 2017
    Publication date: October 19, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170207549
    Abstract: A differential data cable for high-speed signals includes a connector PCB with angled pads cable connection pads connected to a pair of differential data cable conductors, wherein the symmetrical angled configuration minimizes lead lengths, interface discontinuities, and common mode imbalance. A third pad may be connected to a return signal wire. The connector PCB may have a similar arrangement on the other side, and may have a ground plane in between. The cable may be placed over the ground plane and away from the edge. Pads may have a bump to shorten wire lengths. Wires are glued to the bumps using a UV-curable adhesive. Wires are positioned in an angle with the PCB.
    Type: Application
    Filed: January 20, 2017
    Publication date: July 20, 2017
    Inventors: Leo Chien Chang, Ebrahim Abunasrah
  • Publication number: 20170162960
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: February 15, 2017
    Publication date: June 8, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170125950
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Applicant: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David HIRSCHY, Munawar AHMAD, Eran J. JONES, Stephen W. HAMBLIN, Darian Ross SCHULZ, Todd David WARD, Gregory B. WALZ, Ebrahim ABUNASRAH, Rehan KHAN
  • Patent number: 9608348
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: March 28, 2017
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170033478
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9490558
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 8, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20160268714
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9362678
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 7, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20160111825
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: December 17, 2015
    Publication date: April 21, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9257794
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: February 9, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20150357761
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.
    Type: Application
    Filed: August 18, 2015
    Publication date: December 10, 2015
    Applicant: Molex Incorporated
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: RE47342
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: April 9, 2019
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David Hirschy, Munawar Ahmad, Eran J. Jones, Stephen W. Hamblin, Darian Ross Schulz, Todd David Ward, Gregory B. Walz, Ebrahim Abunasrah, Rehan Khan
  • Patent number: RE48230
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto. to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 29, 2020
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David Hirschy, Munawar Ahmad, Eran J. Jones, Stephen W. Hamblin, Darian Ross Schulz, Todd David Ward, Gregory B. Walz, Ebrahim Abunasrah, Rehan Khan