Patents by Inventor Ebrahim Abunasrah
Ebrahim Abunasrah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10305204Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: GrantFiled: July 19, 2018Date of Patent: May 28, 2019Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20180323525Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: ApplicationFiled: July 19, 2018Publication date: November 8, 2018Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Patent number: 10069225Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: GrantFiled: February 15, 2017Date of Patent: September 4, 2018Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Patent number: 10056706Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: GrantFiled: July 5, 2017Date of Patent: August 21, 2018Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Patent number: 9985367Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: GrantFiled: August 11, 2017Date of Patent: May 29, 2018Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20170365943Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: ApplicationFiled: August 11, 2017Publication date: December 21, 2017Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20170302011Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: ApplicationFiled: July 5, 2017Publication date: October 19, 2017Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Publication number: 20170207549Abstract: A differential data cable for high-speed signals includes a connector PCB with angled pads cable connection pads connected to a pair of differential data cable conductors, wherein the symmetrical angled configuration minimizes lead lengths, interface discontinuities, and common mode imbalance. A third pad may be connected to a return signal wire. The connector PCB may have a similar arrangement on the other side, and may have a ground plane in between. The cable may be placed over the ground plane and away from the edge. Pads may have a bump to shorten wire lengths. Wires are glued to the bumps using a UV-curable adhesive. Wires are positioned in an angle with the PCB.Type: ApplicationFiled: January 20, 2017Publication date: July 20, 2017Inventors: Leo Chien Chang, Ebrahim Abunasrah
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Publication number: 20170162960Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.Type: ApplicationFiled: February 15, 2017Publication date: June 8, 2017Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Publication number: 20170125950Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.Type: ApplicationFiled: January 12, 2017Publication date: May 4, 2017Applicant: Molex, LLCInventors: Brian Keith Lloyd, Christopher David HIRSCHY, Munawar AHMAD, Eran J. JONES, Stephen W. HAMBLIN, Darian Ross SCHULZ, Todd David WARD, Gregory B. WALZ, Ebrahim ABUNASRAH, Rehan KHAN
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Patent number: 9608348Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.Type: GrantFiled: October 11, 2016Date of Patent: March 28, 2017Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20170033478Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.Type: ApplicationFiled: October 11, 2016Publication date: February 2, 2017Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Patent number: 9490558Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.Type: GrantFiled: May 23, 2016Date of Patent: November 8, 2016Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20160268714Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.Type: ApplicationFiled: May 23, 2016Publication date: September 15, 2016Applicant: Molex, LLCInventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Patent number: 9362678Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.Type: GrantFiled: December 17, 2015Date of Patent: June 7, 2016Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20160111825Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.Type: ApplicationFiled: December 17, 2015Publication date: April 21, 2016Applicant: Molex, LLCInventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Patent number: 9257794Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.Type: GrantFiled: August 18, 2015Date of Patent: February 9, 2016Assignee: Molex, LLCInventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
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Publication number: 20150357761Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.Type: ApplicationFiled: August 18, 2015Publication date: December 10, 2015Applicant: Molex IncorporatedInventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
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Patent number: RE47342Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.Type: GrantFiled: September 21, 2016Date of Patent: April 9, 2019Assignee: Molex, LLCInventors: Brian Keith Lloyd, Christopher David Hirschy, Munawar Ahmad, Eran J. Jones, Stephen W. Hamblin, Darian Ross Schulz, Todd David Ward, Gregory B. Walz, Ebrahim Abunasrah, Rehan Khan
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Patent number: RE48230Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto. to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar.Type: GrantFiled: September 26, 2017Date of Patent: September 29, 2020Assignee: Molex, LLCInventors: Brian Keith Lloyd, Christopher David Hirschy, Munawar Ahmad, Eran J. Jones, Stephen W. Hamblin, Darian Ross Schulz, Todd David Ward, Gregory B. Walz, Ebrahim Abunasrah, Rehan Khan