Patents by Inventor Eckhard Quandt

Eckhard Quandt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100049310
    Abstract: Method for applying a coating layer to a tubular intraluminal implant, in particular to a vascular support (stent), where the surface of the implant is perforated by a plurality of apertures, and where the coating layer is produced by deposition of material onto the surface of the implant. The implant is first pushed onto a cylindrical holder 4, a sacrificial material, in particular copper, is then deposited onto the surface of the implant until the deposited sacrificial material almost entirely fills the apertures, the coating layer is then deposited onto the surface of the implant provided with sacrificial material, and then the cylindrical holder 4 and the sacrificial material situated in the apertures 3 are removed.
    Type: Application
    Filed: February 15, 2007
    Publication date: February 25, 2010
    Applicant: ACANDIS GmbH & Co. KG
    Inventors: Eckhard Quandt, Holger Rumpf, Christiane Zamponi, Michael Koch
  • Publication number: 20100009142
    Abstract: A method for the production of a structured metal layer (7) made from an alloy composed of titanium and nickel includes the following process steps: a sacrificial layer composite (3) is provided, which comprises a second sacrificial layer (2) applied onto a first sacrificial layer (1), the first sacrificial layer (1) is subjected for the purpose of structuring to a wet-chemical etching process in such a manner that undercutting of the sacrificial layer (1) occurs, a metal layer (7) of the alloy is applied indirectly or directly to the structured sacrificial layer composite (3). The first sacrificial layer (1) is at a greater distance from the metal layer (7). The second sacrificial layer (2) facing the metal layer (7) to be deposited is subjected to a dry etching process prior to wet-chemical etching of the first sacrificial layer (1) so that the second sacrificial layer (2) is provided with a structure that corresponds to the desired structure of the metal layer (7).
    Type: Application
    Filed: June 27, 2007
    Publication date: January 14, 2010
    Applicant: ACANDIS GMBH & CO. KG
    Inventors: Eckhard Quandt, Clemens Schmutz, Christiane Zamponi
  • Publication number: 20090127226
    Abstract: A process for producing a self-supporting layer made of a titanium and nickel alloy with superelastic and/or shape memory properties has the following steps: a substrate entirely or at least mainly made of silicon is provided, a layer of said alloy is applied to a surface of the substrate, the substrate with the desired form is cut out of a wafer or formed by a wafer with the desired form; at least some zones of the lateral surfaces of the substrate adjoining the zones of the surface of the substrate which receive the layer are subjected to an etching process; a layer of said alloy is applied to the surface of the substrate; and the substrate is removed from the applied layer. Also disclosed is a substrate suitable for carrying out the process and an object, in particular an implant, comprising at least one layer produced by this process.
    Type: Application
    Filed: April 24, 2006
    Publication date: May 21, 2009
    Applicant: Arcadis GMGH & Co. KG
    Inventors: Eckhard Quandt, Holger Rumpf, Christiane Zamponi
  • Patent number: 7234360
    Abstract: A sensor for measuring mechanical changes in length, in particular a compressive and/or tensile stress sensor, includes a sandwich system with two flat and superposed electrodes separated from each other by a tunnel element (tunnel barrier), in particular an oxide barrier, a current being set up between the electrodes and through the tunnel barrier, one electrode consisting of a magnetostrictive layer 3 which responds to elongation, and wherein the contributions of the anisotropies caused by mechanical tension are larger than those from the intrinsic anisotropies, relative changes in system resistance ?R/R larger than 10% at room temperature being attained during elongation.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: June 26, 2007
    Assignees: Stifting Caesar, Infineon Technologies AG
    Inventors: Eckhard Quandt, Markus Lohndorf, Alfred Ludwig, Manfred Ruhrig, Joachim Wecker
  • Publication number: 20040050172
    Abstract: The present invention relates to a sensor measuring mechanical changes in length, in particular to a compressive and/or tensile stress sensor, comprising a sandwich system with two flat and superposed electrodes separated from each other by a tunnel element (tunnel barrier), in particular an oxide barrier, a current being set up between said electrodes and through the tunnel barrier, one electrode consisting of a magnetostrictive layer 3 which responds to elongation, and wherein the contributions of the anisotropies caused by mechanical tension are larger than those from the intrinsic anisotropies, relative changes in system resistance &Dgr;R/R larger than 10% at room temperature being attained during elongation.
    Type: Application
    Filed: April 3, 2003
    Publication date: March 18, 2004
    Inventors: Eckhard Quandt, Markus Lohndorf, Alfred Ludwig, Manfred Ruhrig, Joachim Wecker
  • Publication number: 20020045277
    Abstract: Process for qualitative and quantitative detection of an analyte present in a biological sample and in molecular form, in which process a sensor is provided with a substrate binding the analyte and in which in a first process step the sensor is loaded with the analyte and, in a subsequent process step, the total analyte mass bound by the sensor is measured, before in a further step the molecular weight of the analyte forming the total mass is measured.
    Type: Application
    Filed: October 11, 2001
    Publication date: April 18, 2002
    Inventors: Beate Schmid, Daniel Hoffmann, Stefan Wefing, Volker Schnaible, Eckhard Quandt, Michael Tewes, Michael Famulok