Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: A detector apparatus includes at least one x-ray detector, including a network-capable network unit; and a switching unit connected to the network unit of the x-ray detector.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: A detector apparatus includes at least one x-ray detector, including a network-capable network unit; and a switching unit connected to the network unit of the x-ray detector.

Abstract: A circuit arrangement with an interference protection is disclosed, including a supply line and a ground line, a first circuit and a second circuit. Each of the first and second circuit is connected to the supply line and to the ground line. The circuit arrangement also includes a blocking device coupled to at least the supply line to suppress any interfering signals from being applied to the supply line.

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract: Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

Abstract: A method is disclosed for transmission of register contents of a CT detector with hierarchical hardware structure, wherein the first hierarchy level is formed by a control unit containing a register table for the read-out register contents of FPGAs lying lower down in the hierarchy and an intermediate register store for register contents to be written. With each new reading, the new register contents for FPGAs lying lower down in the hierarchy arriving during the respective preceding reading from the central control at the control unit are forwarded to the next hierarchy level. With each new reading, the register contents of all FPGAs lying lower down in the hierarchy are re-entered into the register table of the control unit. Finally, in the event of a readout command transferred asynchronously from the central control, the register contents are read out exclusively from the register table.

Abstract: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Abstract: Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Abstract: A package with multiple chips and a shared redistribution layer is described. In one example, a first and a second die are formed where the first and the second die each have a different height. The dies are placed on a substrate. The first, the second, or both dies are ground so that the first and the second die are about the same height. Layers, such as redistribution layers are formed over both the first and the second die at the same time using a single process, and the first and the second die and the formed layers are packaged.