Abstract: A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method according to one embodiment may include providing circuit board having a faceplate. The method of this embodiment may also include providing a label surface capable of moving between a deployed position and a stowed position. When the label surface is in a deployed position at least a portion of the label surface extends outwardly from the faceplate relative to the circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: Information is obtained from a module received in a slot in a chassis. The information includes a number of ports in one or more module connectors which route at least one communication channel associated with a communication interfaces on the module. A determination is made as to the number of ports the slot has a capability to route the at least one communication channel to one or more backplanes in the chassis and to another module received in another slot in the chassis. A given number of ports in the one or more module connectors are enabled to forward data from the communication interface on the module and through the at least one communication channel to the other module based on the determination.

Abstract: A chassis includes a plurality of slots to receive modules. The chassis further includes a first backplane to couple to modules that are received in the plurality of slots. The modules are to couple to the first backplane via a first communication interface on each module. The chassis also includes a second backplane to couple to at least a subset of the modules via a second communication interface on each of the subset of modules.

Abstract: A chassis includes a plurality of slots to receive modules. The chassis includes an electrical backplane to couple to a module received in a first slot of the plurality of slots. The module to couple via a first communication interface on the module. An optical backplane is also included in the chassis. The optical backplane is to couple to the modules via a second communication interface on the module. The optical backplane is to couple to the second interface on the module via at least one interconnect through an opening in the electrical backplane. The interconnect configured to couple a fabric interface associated with the second communication interface to a communication channel routed over the optical backplane.

Abstract: One or more components on one or more circuit boards in a chassis may be configured and/or oriented such that the component(s) are aligned with a diagonal predominant air flow path through the chassis. In one embodiment, components may be mounted on a circuit board with a skewed orientation that aligns the components with the predominant air flow path. In another embodiment, one or more heat sinks may include angled fins that are aligned with the predominant air flow path. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: An interconnect system may be used to interconnect node boards and one or more switch boards coupled to a common backplane in a computer system shelf or chassis. The interconnect system may interconnect the node boards and switch board(s) using external signal paths external to the backplane. In one embodiment, the signal paths may be connected to a rear transition module (RTM) that provides conversion between electrical node board signals and optical switch board signals. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: An apparatus, method, computer program product, integrated circuit and system that include a backplane that provides direct and indirect connections among a plurality of slots in communication with the backplane. The backplane is also complies with a telecommunication architecture specification. The slots include at least a source slot, an intermediate slot and a destination slot. The intermediate slot may receive a first data set from the source slot via the backplane. The intermediate slot sends the first data set to the destination slot via the backplane.

Abstract: A chassis includes a plurality of slots to receive modules. The chassis includes an electrical backplane to couple to a module received in a first slot of the plurality of slots. The module to couple via a first communication interface on the module. An optical backplane is also included in the chassis. The optical backplane is to couple to the modules via a second communication interface on the module. The optical backplane is to couple to the second interface on the module via at least one interconnect through an opening in the electrical backplane. The interconnect configured to couple a fabric interface associated with the second communication interface to a communication channel routed over the optical backplane.

Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.

Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

Abstract: A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method to couple a module to a board including power circuitry. The method includes detecting a module's power requirements before providing payload power to the module and routing a regulated power level to the module via at least one power feed based on the detected power requirements. The regulated power is provided by the board's power circuitry.

Abstract: The application describes embodiments of an apparatus including a plurality of first channels, each having an inlet, an outlet, and a first path length between the inlet and the outlet, and a plurality of second channels, each having an inlet, an outlet, and a second path length between the inlet and the outlet. The second path length is different from the first path length, and each second channel is adjacent to at least one first channel. The application also describes embodiments of a process including suppressing electromagnetic radiation using a filter comprising a plurality channels, and simultaneously passively canceling noise at the outlets of the plurality of channels. Other embodiments are also described and claimed.

Abstract: A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.

Abstract: An interface enhancing apparatus is provided for increasing the potential number of interfaces on the interface panel of a modular platform board. The interface enhancing apparatus may include a first component coupled an interface panel of a modular platform board and second component coupled to the first component. The second component may be substantially parallel with the interface panel when the first component is mated with the interface panel, and the second component may have one or more enhanced interfaces configured for electrical communication with the modular platform board.

Abstract: A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.

Abstract: A data transport module includes a connector to be received and coupled to a backplane within a modular platform. The data transport module also includes another connector to be received and coupled in a slot resident on a board such that the data transport module is coplanar to the board when received and coupled in the slot. The data transport module further includes one or more data transport interfaces to forward data between the board and the backplane via the connectors.

Abstract: An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The power rails are electrically coupled to a power supply and the integrated circuits. At the same time, the power rails are used to thermally couple one or more heatsinks to the integrated circuit(s). Each power rails includes at least one slot configured to receive a flange on the heatsink(s). In situations under which different voltages are supplied via the power rails, means are provided to electrically insulate at least one power rail from the heatsink(s) while maintaining thermal coupling to the power rails. In one embodiment, a split-rail configuration is used, wherein the power rail includes multiple conductive sections separated by one or more insulator sections. The scheme is well-suited for modular board/blade architectures, such as the Advanced Telecommunications Architecture (ATCA).