Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: Activation of an automatic driving feature in a vehicle is detected by evaluating sequential vehicle operation data against subtractive and additive heuristic rules that define a likelihood of an automatic driving feature having been engaged as a function of vehicle performance. The sequential vehicle operation data, which does not include an explicit indication of whether the automatic driving feature was engaged, is provided for time intervals of a trip made by the vehicle. Automatic driving information is generated, which provides an indication of whether the automatic driving feature was engaged during a subset of the time intervals.

Abstract: The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.

Abstract: In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extending through the substrate and electrically connecting the first surface of the substrate with the second surface of the substrate, applying a strip to the second surface of the substrate, mounting a semiconductor die on the strip, at least a portion of the semiconductor die being disposed inside the cavity, encapsulating in a molding material at least a portion of the first surface of the substrate, and removing the strip from the substrate.

Abstract: The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.