Abstract: Disclosed are sources and methods for delivering a radioactive dose to a site in a body lumen. The sources are preferably mounted on a balloon or other expandable or deployable mechanical structure. The source and methods enable delivery of a clinically significant dose of radiation into a vessel wall in a relatively short time while using a relatively low activity. The sources also enable delivery of a substantially uniform dose into the vessel wall, whether or not such delivery is through the wall of a stent.

Abstract: A manifold system allows for the movement of a radioactive fluid from a container to a treatment balloon or other device, and the withdrawal of the radioactive fluid from the treatment device. The system allows for the convenient movement of the fluid, with minimal radiation exposure for those using the system. The manifold system is particularly useful in the use of radiation to prevent restenosis of arteries.

Abstract: A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.

Abstract: A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.

Abstract: A precious metal alloy for dental restorations which develops a light oxide upon firing, on a percentage weight basis at makeup, consists of 60-95 precious metal(s) selected from the group consisting of 60-855 palladium, 0-10 gold, 0-10 platinum, 0-12 silver, and mixtures thereof; 1-15 tin; 2-7 zinc; 0.005-0.2 boron; 0-2 gallium; 0-2 cobalt; 0-15 indium; 0-0.2 of a deoxidant selected from the group consisting of silicon, germanium, magnesium, aluminum, lithium, tantalum and mixtures thereof; and 0-1.0 of a grain refiner selected from the group consisting of ruthenium, iridium, rhenium, and mixtures thereof. The alloy has a liquidus temperature of not more than 1400.degree. C., and the alloy has a tensile yield strength of at least 250 Mpa and an elongation of at least 2 percent. Restorations having a porcelain coating fired on castings of the alloy evidence a light oxide color.

Abstract: A structured text system for generating a finished project plans and specifications for constructing a building, the system including a master specification and standardized information embedded in other documents. The system uses keynote references that are inserted into other documents, such as drawings produced by a CAD system, to construct a partial project knowledge base, which knowledge base is then used to guide the editing of a master specification to yield an initial project plans and specifications. The keynote references are found in a catalog of standardized notes and are arranged to be searched by their attributes, using an interactive index utility. The keynote references are included on the CAD drawings, or like computer readable documents, from which they may be extracted for later use in constructing or updating a project knowledge base.

Abstract: A noble metal dental casting alloy for use in making dental restorations comprises 35-70 percent by weight palladium, 25-50 percent by weight silver, 0.5-10 percent by weight manganese, and 1-30 percent of at least one modifier element selected from (i) the group of gold, platinum, copper, tin, gallium, zinc, indium and cobalt in amounts of up to 15 percent by weight each, and (ii) the group of ruthenium, rhenium, aluminum, germanium, lithium, silicon, iridium, boron, tantalum and niobium in amounts of up to 5 percent by weight each. The alloy has a solidus temperature of at least 1100.degree. C., a liquidus temperature of not more than 1400.degree. C., tensile elongation of at least 2 percent, thermal expansion coefficient of at least 14.0.times.10.sup.-6 per .degree.C., Vickers hardness of at least 150, and offset yield strength at 0.2 percent of at least 250 MPa.

Abstract: In a system for assigning to given user terminals in a multiple-user DAMA communication system access to time slots of a time frame within which to transmit messages identified in message-access requests from different given user terminals, a plurality of message-access requests from different given user terminals are stored in a memory and then processed to schedule the identified messages for transmission.

Abstract: A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.

Abstract: The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. The glass composite is particularly useful as a semiconductor package sealant.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. The glass composite is particularly useful as a semiconductor package sealant.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Abstract: A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.

Abstract: A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.

Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.

Abstract: A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.