Abstract: The present invention relates to a doped semiconductor nanocrystal layer comprising (a) a group IV oxide layer which is free of ion implantation damage, (b) from 30 to 50 atomic percent of a semiconductor nanocrystal distributed in the group IV oxide layer, and (c) from 0.5 to 15 atomic percent of one or more rare earth element, the one or more rare earth element being (i) dispersed on the surface of the semiconductor nanocrystal and (ii) distributed substantially equally through the thickness of the group IV oxide layer. The present invention also relates to a semiconductor structure comprising the above semiconductor nanocrystal layer and to processes for preparing the semiconductor nanocrystal layer.

Abstract: The present invention relates to compounds of general formula (13), and pharmaceutically acceptable salts thereof, in which: n=an integer of from 1 to 4; A represents a trioxane-containing residue; B represents a group having the general formula: -D-E-F-, in which D is linked to A and represents an atom or group selected from the following (a, b, c, d), E represents a bivalent, optionally substituted organic radical; and F is linked to C and represents a group selected from the following: (e, f, g, h) and C represents a group containing at least two nitrogen atoms, (13).

Abstract: This application relates to compounds of the general formula (11), and pharmaceutically acceptable salts thereof, in which R is selected from the group comprising optionally substituted alkyl, aryl, bisalkyl or bisaryl ester, bisalkyl or bisaryl ether, acetal, ketal, boronate, silyl ether, carbamate, carbonate, sulphate, sulphonate, phosphate and phosphonate, and to processes for their production. The compounds are useful as medicaments, in particular for the treatment of malaria and cancer.

Abstract: The present invention provides a process for preparing a sulphoxonium salt from the corresponding sulphonium salt which comprises oxidising the sulphonium salt using a peracid, under basic conditions, in a solvent other than a ketone.Some of the sulphoxonium salts are new compounds.

Abstract: A data-carrying laminate such as a credit card or identity card comprises a sheet of cellulosic material or synthetic material and a thermoplastic polymeric film, at least one of said sheet and said thermoplastic film carrying data, said sheet and said thermoplastic film being bonded together by a cured adhesive layer obtained by curing a solid film adhesive comprising (A) a solid polymer of a vinyl carboxylic acid and (B) a curable material having at least one acrylate or methacrylate group.

Abstract: A security card comprises a data-carrying sheet having a gelatin layer thereon and a transparent polymeric film having a gelatin layer thereon, said sheet and said film being bonded together by an adhesive composition polymerized between and in contact with the gelatin layers, the adhesive composition comprising a carboxylic acid having at least one polymerizable acrylic group.

Abstract: Images are formed by the following process:(i) a substrate is treated with a layer of a liquid composition comprising(A) a residue that is polymerizable by means of free radicals, such as an acrylic ester,(B) a radiation-activated polymerization initiator for (A), such as a metallocene or a mixture of a Group IVA organometallic compound with a photoreducible dye.

Abstract: The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas which comprises (i) protecting the bare metal by coating with a film-forming resin, (ii) removing any film-forming resin from the resist, (iii) removing the resist from said remaining areas using a solvent which will not remove the film-forming resin, thereby exposing metal in said remaining areas, (iv) etching the metal exposed in (iii) using an etchant which does not remove the film-forming resin and (v) removing the film-forming resin with a suitable solvent.

Abstract: Monethylenically unsaturated compounds whose polymers are useful as polymeric photoinitiators are of formula Ar.sup.1 COC(R.sup.1)(R.sup.2)R.sup.3 where R.sup.1 is C.sub.1 -C.sub.10 alkyl or alkoxy, R.sup.2 is C.sub.1 -C.sub.10 alkyl, --X--O--R.sup.4 --OCOC(R.sup.5).dbd.CH.sub.2 (II) --X--NH--R.sup.6 --OCOC(R.sup.5).dbd.CH.sub.2 (III), or --CH.sub.2 [OCH.sub.2 CH(OH)CH.sub.2 ].sub.a OCOC(R.sup.5).dbd.CH.sub.2 (IIIA) or R.sup.1 and R.sup.2, together with the attached carbon, denote C.sub.4 -C.sub.8 cycloalkyl, R.sup.3 is a C.sub.6 -C.sub.20 aromatic group, OH, tert.amino, --OCOC(R.sup.5).dbd.CH.sub.2 (VI) or --OCH.sub.2 CH(OH)CH.sub.2 OCOC(R.sup.5).dbd.CH.sub.2 (VIA), R.sup.4 is C.sub.1 -C.sub.4 alkylene, which may be substituted by --OH or by C.sub.2 -C.sub.20 acyloxy, R.sup.5 is H or C.sub.1 -C.sub.4 alkyl, R.sup.6 is C.sub.1 to C.sub.4 alkylene, X is a group of formula R.sup.7 CO-- or ##STR1## where R.sup.7 is C.sub.1 -C.sub.4 alkylene, R.sup.8 is C.sub.1 to C.sub.4 alkyl, and is 0 or 1, Ar.sup.1 is a C.

Abstract: A method of making a pattern on an electrically conductive material such as a printed circuit comprises(i) electrodepositing on an electrically conductive surface a film of an organic polymer having, per average molecule, more than one reactive functional group,(ii) forming on the electrodeposited film a predetermined pattern of a heat-curable resist having, per average molecule, more than one group reactive with the reactive groups in the electrodeposited film on heating, thereby leaving predetermined areas of the electrodeposited film uncovered,(iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, conductive material coated by areas of the electrodeposited film covered by the resist, and(iv) heating to complete adhesion of the resist to the electrically conductive surface through the areas of the electrodeposited film covered by the resist,st

Abstract: A process for the formation of an image comprises(i) electrodepositing on a conductive surface a photosensitive film from an aqueous composition which is a solution or dispersion comprising a mixture of (A) a photosensitive o-quinone diazide such as an o-naphthoquinone diazide sulfonyl ester of a phenol, and (B) an electrodepositable film-forming resin such as a reaction product of a novolak resin, formaldehyde and diethanolamine in (C) an aqueous medium, the composition being substantially free from a resin having both a quinone diazide residue and a carboxyl, phosphonic or sulfonic acid group or amino group in the same molecule,(ii) subjecting the electrodeposited film to radiation in a predetermined pattern, such that exposed areas of the film become more soluble in aqueous base than unexposed areas, and(iii) removing the exposed areas by treatment with an aqueous base.The process is useful in the production of printing plates and printed circuits.

Abstract: Imides of the formula I ##STR1## In which R.sub.1, R.sub.2 and R.sub.4 independently of one another are hydrogen or methyl, R.sub.3 is a direct bond or a C.sub.2 -C.sub.20 aliphatic radical which can be interrupted by O atoms or a mononuclear or polynuclear C.sub.5 -C.sub.20 cycloaliphatic or C.sub.6 -C.sub.20 aromatic radical or is a group of the formula II ##STR2## in which T is methylene, isopropylidene, CO, O, S or SO.sub.2 and R.sub.5 is hydrogen or phenyl, can be crosslinked either photochemically or by heat and produce polymers having excellent properties, in particular a very high resistance to heat. They are particularly suitable for the production of heat-resistant photolithographs or as matrix resins for the production of composite materials.

Abstract: Metallic patterns, such as printed circuits, are prepared by immersing metal substrates, bearing electrodeposited films and resist films in patterned areas, into an aqueous solution or dispersion of a hardening agent so that the hardening agent diffuses only into the electrodeposited film. This is followed by curing the hardening agent by heat or irradiation to render it resistant to the solvent used to remove the resist film and to the etchant solution for the metal exposed when the resist film is removed.

Abstract: A method of making a pattern of an electrically conductive material which comprises(i) electrodepositing on an electrically conductive surface a film comprising a photocurable organic resin,(ii) forming on the electrodeposited film a predetermined pattern of a resist co-cured with with underlying areas of the electrodeposited film by exposure to actinic radiation, thereby leaving predetermined areas of the electrodeposited film uncovered, and(iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, photocured resist securely bonded to the electrically conductive surface through the cured areas of the electrodeposited film covered by the resist.The method is useful in the production of printed circuits.

Abstract: A process for the formation of an image comprises(i) electrodepositing on a conductive surface a layer of a quinone diazide positive photoresist,(ii) subjecting the layer to radiation in a predetermined pattern,(iii) heating the layer such that areas thereof exposed in stage (ii) are rendered insoluble in an aqueous base developer,(iv) subjecting the layer to radiation such that the areas not exposed in stage (ii) are rendered more soluble in an aqueous base developer than the areas rendered insoluble in stage (iii) and(v) removing the areas not exposed in stage (ii) by treatment with an aqueous base developer.The process is useful in the production of printing plates and printed circuits.

Abstract: A process for the formation of an image comprises(i) applying to a substrate a layer of a liquid composition which comprises(A) a polymerizable material having, on average, more than one polymerizable acrylic group per molecule,(B) a first radiation-activated polymerization initiator for (A) and(C) a second radiation-activated polymerization initiator for (A), the initiator (B) being activatable by radiation of longer wavelength than that of radiation by which (C) is activatable,the composition being substantially free from polymerizable epoxide or vinyl ether groups when (B) or (C) is an aromatic onium salt,(ii) subjecting the composition to radiation having a wavelength at which one of (B) and (C) is activated but the other is not substantially activated, thereby polymerizing (A) such that the layer of liquid composition is solidified but remains curable,(iii) subjecting the solidified layer in a predetermined pattern to radiation having a wavelength at which the initiator not activated in stage (ii) is act

Abstract: Monoethylenically unsaturated compounds whose polymers are useful as polymeric photoinitiators are of formula Ar.sup.1 COC(R.sup.1)(R.sup.2)R.sup.3 where R.sup.1 is (C.sub.1 -C.sub.10 alkyl or alkoxy, R.sup.2 is C.sub.1 -C.sub.10 alkyl, --X--O--R.sup.4 -OCOC(R.sup.5).dbd.CH.sub.2 (II) --X--NH--R.sup.6 --OCOC(R.sup.5).dbd.CH.sub.2 (III), or --CH.sub.2 [OCH.sub.2 CH(OH)CH.sub.2 ].sub.a OCOC(R.sup.5).dbd.CH.sub.2 (IIIA) or R.sup.1 and R.sup.2, together with the attached carbon, denote C.sub.4 -C.sub.8 cycloalkyl, R.sup.3 is a C.sub.6 -C.sub.20 aromatic group, OH tert. amino,--OCOC(R.sup.5).dbd.CH.sub.2 (VI) or --OCH.sub.2 CH(OH)CH.sub.2 OCOC(R.sup.5).dbd.CH.sub.2 (VIA), R.sup.4 is C.sub.1 14 C.sub.4 alkylene, which may be substituted by --OH or by C.sub.2 -C.sub.20 acyloxy, R.sup.5 is H or C.sub.1 -C.sub.4 alkyl, R.sup.6 is C.sub.1 to C.sub.4 alkylene, X is a group of formula R.sup.7 CO-- or ##STR1## where R.sup.7 is C.sub.1 -C.sub.4 alkylene, R.sup.8 is C.sub.1 to C.sub.4 alkyl, and is 0 or 1, Ar.sup.1 is a C.

Abstract: A polymerizable composition comprises a mixture of(A) a substance having at least one allyl- or methallyl-substituted bicyclo[2.2.1]-hept-5-ene-2,3-dicarboxylic acid imide residue, and(B) a substance having at least one polymerizable residue of formulaCH.sub.2 =C(R.sup.1)COO-- Iwhere R.sup.1 denotes a hydrogen atom or a methyl group.Typically, (A) is bis[4-(allylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximidophenyl)]methane and (B) is an acrylate or methacrylate of a polyhydric alcohol. The compositions can be photopolymerized or heat-cured. They are suitable for use in prepreg manufacture and in image formation.

Abstract: A polymer having a molecular weight of at least 500 and containing at least one residue of formula I(--L.sup.1 --).sub.m Ar.sup.1 [X]--OSO.sub.2 --Ar.sup.2 (--L.sup.2 --).sub.n (I)whereone of m and n denotes 1 and the other denotes 0 or 1,X denotes either a group of formula II ##STR1## linked through the carbonyl group to an aromatic carbon atom in Ar.sup.1, ora group of formula III ##STR2## linked through the carbonyl groups to aromatic carbon atoms in Ar.sup.1, p denotes zero or 1,when p denotes zero, R.sup.1 denotes a hydrogen atom or a monovalent aliphatic, araliphatic or aromatic group,when p denotes 1, R.sup.1 denotes a hydrogen atom, a hydroxyl group, an etherified hydroxyl group, an acyloxy group, an alkyl group or a phenyl-substituted alkyl group,r.sup.2 denotes a hydrogen atom or a monovalent aliphatic, cycloaliphatic, heterocyclic, aromatic or araliphatic group,Ar.sup.1 denotes a monovalent, divalent or trivalent aromatic group,Ar.sup.2 denotes a monovalent or divalent aromatic group, andAr.sup.

Abstract: A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises(i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having (a) a group which is reactive with an isocyanate group and (b) a blocked isocyanate group,(ii) heating the electrodeposited polymeric film to render it resistant to a solvent with which the resist is removable,(iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and(iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film, which can be removed subsequently using a solvent therefor.The method is useful in the production of printed circuits.