Patents by Inventor Edward J. Laurin

Edward J. Laurin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density interconnection device
    Patent number: 6923683
    Abstract: A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: August 2, 2005
    Assignee: ATI Technologies, Inc.
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean Francois Drolet
  • High density interconnection device
    Publication number: 20030027448
    Abstract: A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 6, 2003
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean Francois Drolet
  • High density interconnection device
    Patent number: D494544
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: August 17, 2004
    Assignee: ATI Technologies Inc.
    Inventors: Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet