Abstract: Systems, methods and apparatus are provided for moving substrates in electronic device manufacturing. In some aspects, end effectors having a base portion and at least three pads are provided. Each of the pads has a contact surface, and at least one of the contact surfaces has a curved shape. A substrate supported by the end effector may be moved at a relatively high lateral g-force without significant slipping relative to the pads. Additional aspects are provided.

Abstract: A base layer for a suspension. The base layer includes a structure. The structure has a slider end portion and a tail portion. The structure includes an opening in the tail portion. The opening provides access to a conductive assembly coupleable there with. The structure also includes a strengthening member integrated within said opening.

Abstract: A support component comprises a support structure having a support surface with one or more quartz contact tips. In one version, the support component comprises a robot blade capable of transferring a substrate into and out of a chamber. The robot blade comprises a plate having a plurality of raised mesas, each raised mesa comprising a quartz contact tip which minimizes contact with the substrate thereby generating fewer contaminant particles during substrate transportation. Other versions of the support component include a heat exchange pedestal, lift pin assembly, and lifting fin assembly.

Abstract: A lifting assembly can lift a substrate from a substrate support and transport the substrate. The lift assembly has a hoop sized to fit about a periphery of the substrate support, and a pair of arcuate fins mounted on the hoop, each arcuate fin comprising a pair of opposing ends having ledges that extend radially inward, each ledge having a raised protrusion to lift a substrate so that the substrate contacts substantially only the raised protrusion, thereby minimizing contact with the ledge, when the pair of fins is used to lift the substrate off the substrate support. The lifting assembly and other process chamber components can have a diamond-like coating having interlinked networks of (i) carbon and hydrogen, and (ii) silicon and oxygen. The diamond-like coating has a contact surface having a coefficient of friction of less than about 0.3, a hardness of at least about 8 GPa, and a metal concentration level of less than about 5×1012 atoms/cm2 of metal.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.