Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: Apparatus and techniques for automated optical inspection (AOI) utilizing image scanning modules with multiple objectives for each camera are provided. A scanning mechanism includes optical components to sequentially steer optical signals from each of the multiple objectives to the corresponding camera.

Abstract: An automated optical inspection system, comprising at least one camera having a field of view; and at least one image scanning module comprising a plurality of objective modules arranged to have fields of view covering a portion of an article during inspection, and an image selection mirror mechanism, such as a pentaprism movable to sequentially select and transfer images of the fields of view from the objective modules to the at least one camera, and a beam splitter operative to simultaneously direct illumination from at least one illumination source to a portion of the article and to direct an image of the portion of the article to at least one camera, wherein the beam splitter is operative to pivot about at least one axis, thereby to create motion of the image of the article within the field of view of the camera. The objective modules may be arranged in a pair of back-to-back arcs each served by and partially encircling its own optical head.

Abstract: Apparatus and techniques for automated optical inspection (AOI) utilizing image scanning modules with multiple objectives for each camera are provided. A scanning mechanism includes optical components to sequentially steer optical signals from each of the multiple objectives to the corresponding camera.

Abstract: An automated optical inspection system, comprising at least one camera having a field of view; and at least one image scanning module comprising a plurality of objective modules arranged to have fields of view covering a portion of an article during inspection, and an image selection mirror mechanism, such as a pentaprism movable to sequentially select and transfer images of the fields of view from the objective modules to the at least one camera, and a beam splitter operative to simultaneously direct illumination from at least one illumination source to a portion of the article and to direct an image of the portion of the article to at least one camera, wherein the beam splitter is operative to pivot about at least one axis, thereby to create motion of the image of the article within the field of view of the camera. The objective modules may be arranged in a pair of back-to-back arcs each served by and partially encircling its own optical head.

Abstract: A reticle inspection system for inspecting reticles can be used as an incoming inspection tool, and as a periodic and pre-exposure inspection tool. Mask shops can use it as an inspection tool compatible to their customers, and as a printable error detection tool. The inventive system detects two kinds of defects: (1) line width errors in the printed image; (2) surface defects. The line width errors are detected on the die area. The detection is performed by acquiring the image of the reticle under the same optical conditions as the exposure conditions, (i.e. wavelength, numerical aperture, sigma, and illumination aperture type) and by comparing multiple dies to find errors in the line width. Surface defects are detected all over the reticle. The detection of surface defects is performed by acquiring transmission and dark-field reflection images of the reticle and using the combined information to detect particles, and other surface defects.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: Apparatus and techniques for automated optical inspection (AOI) utilizing image scanning modules with multiple objectives for each camera are provided. A scanning mechanism includes optical components to sequentially steer optical signals from each of the multiple objectives to the corresponding camera.

Abstract: The invention provides a method and printer for printing an image that comprises at least one group of highly dense shapes, the method includes: (i) determining multiple intermediate schemes such as to allow printing corresponding intermediate images on an object; whereas at least one intermediate scheme comprises directing at least one interference pattern toward at least one location corresponding to at least one group of highly dense shapes; (ii) generating an array of light entities in response to an intermediate scheme; (iii) directing the array of light entities towards the object to form the intermediate image; and (iv) moving the object relative to the light entities while repeating the steps of generating and directing to expose the object with the image.

Abstract: A method and system for defect localization includes: (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, so as to charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: A method, device, and system for communicating data modulated on an electromagnetic signal over free space in the atmosphere includes a Far Infrared (FIR) transciever (104) having a trasmitter and a receiver. The tranmitter includes a laser source configured to generate an electromagnetic signal in the FIR range and a modulator for modulating the electromagnetic signal giving rise to modulated data. The modulated data is transmitted at high transmission rates through free space. The receiver includes a detector for receiving modulated data at the high transmission rates through free space. A Near Infrared (NIR) transceiver (105) communicates data modulated on an electromagnetic signal in the NIR over free space in the atmosphere.

Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

Abstract: A reticle inspection system for inspecting reticles can be used as an incoming inspection tool, and as a periodic and pre-exposure inspection tool. Mask shops can use it as an inspection tool compatible to their customers, and as a printable error detection tool. The inventive system detects two kinds of defects: (1) line width errors in the printed image; (2) surface defects. The line width errors are detected on the die area. The detection is performed by acquiring the image of the reticle under the same optical conditions as the exposure conditions, (i.e. wavelength, numerical aperture, sigma, and illumination aperture type) and by comparing multiple dies to find errors in the line width. Surface defects are detected all over the reticle. The detection of surface defects is performed by acquiring transmission and dark-field reflection images of the reticle and using the combined information to detect particles, and other surface defects.

Abstract: A reticle inspection system for inspecting reticles can be used as an incoming inspection tool, and as a periodic and pre-exposure inspection tool. Mask shops can use it as an inspection tool compatible to their customers, and as a printable error detection tool. The inventive system detects two kinds of defects: (1) line width errors in the printed image; (2) surface defects. The line width errors are detected on the die area. The detection is performed by acquiring the image of the reticle under the same optical conditions as the exposure conditions, (i.e. wavelength, numerical aperture, sigma, and illumination aperture type) and by comparing multiple dies to find errors in the line width. Surface defects are detected all over the reticle. The detection of surface defects is performed by acquiring transmission and dark-field reflection images of the reticle and using the combined information to detect particles, and other surface defects.