Patents by Inventor Eiichi Shinohara
Eiichi Shinohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9759762Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.Type: GrantFiled: March 18, 2014Date of Patent: September 12, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Munetoshi Nagasaka, Ken Taoka, Yoshiyasu Kato
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Patent number: 9658285Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.Type: GrantFiled: March 11, 2011Date of Patent: May 23, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Isao Kouno, Ken Taoka, Eiichi Shinohara, Ikuo Ogasawara
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Patent number: 9638719Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.Type: GrantFiled: March 18, 2014Date of Patent: May 2, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Munetoshi Nagasaka, Yoshiyasu Kato
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Patent number: 9562942Abstract: A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.Type: GrantFiled: July 11, 2014Date of Patent: February 7, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Kenji Yamaguchi, Masataka Hatta
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Patent number: 9347970Abstract: A probe apparatus 10 has a movable mounting table 12 that mounts a wafer W on which multiple power devices are formed; a probe card 14 that is provided above the mounting table 12 and has multiple probes 14A; a conductive film electrode 13 formed on a mounting surface of the mounting table 12 and an outer peripheral surface thereof; and a measurement line 16 that electrically connects the conductive film electrode 13 to a tester 17. Further, the probe apparatus measures electrical characteristics of the power devices on the mounting table 12 at a wafer level. Furthermore, the measurement line 16 includes a switch device 18 configured to open and close an electric path of the measurement line 16 between the conductive film electrode 13 and the tester 17.Type: GrantFiled: July 30, 2012Date of Patent: May 24, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ken Taoka
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Patent number: 9322844Abstract: A probe card 10 includes a first probe 11 configured to come into electric contact with an emitter electrode of a power device D; a block-shaped first connecting terminal 12 to which the first probe 11 is connected; a second probe 13 configured to come into electric contact with a gate electrode of the power device D; a block-shaped second connecting terminal 14 to which the second probe 13 is connected; a contact plate 15 configured to come into electric contact with a collector electrode of the power device D; and a block-shaped third connecting terminal 16 fixed to the contact plate 15. Further, the first connecting terminal 12, the second connecting terminal 14 and the third connecting terminal 16 electrically come into direct contact with corresponding connection terminals of a tester, respectively.Type: GrantFiled: July 30, 2012Date of Patent: April 26, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ikuo Ogasawara, Ken Taoka
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Publication number: 20160061882Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.Type: ApplicationFiled: March 18, 2014Publication date: March 3, 2016Inventors: Eiichi SHINOHARA, Munetoshi NAGASAKA, Ken TAOKA, Yoshiyasu KATO
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Publication number: 20160054357Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.Type: ApplicationFiled: March 18, 2014Publication date: February 25, 2016Inventors: Eiichi SHINOHARA, Munetoshi NAGASAKA, Yoshiyasu KATO
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Patent number: 9261553Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.Type: GrantFiled: July 28, 2014Date of Patent: February 16, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Munetoshi Nagasaka, Isamu Inomata, Kazuya Yano, Yoshiyasu Kato
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Publication number: 20150028907Abstract: A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top 12, and has many vertical fine holes in a pattern (diameter ? and pitch p) that satisfies the condition of ?<p?2?. For example, the diameter ? is about 0.25 mm, and the pitch p is about 0.5 mm.Type: ApplicationFiled: July 28, 2014Publication date: January 29, 2015Inventors: Eiichi Shinohara, Munetoshi Nagasaka, Isamu Inomata, Kazuya Yano, Yoshiyasu Kato
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Publication number: 20150015285Abstract: A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.Type: ApplicationFiled: July 11, 2014Publication date: January 15, 2015Inventors: Eiichi Shinohara, Kenji Yamaguchi, Masataka Hatta
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Publication number: 20140247037Abstract: A probe apparatus 10 has a movable mounting table 12 that mounts a wafer W on which multiple power devices are formed; a probe card 14 that is provided above the mounting table 12 and has multiple probes 14A; a conductive film electrode 13 formed on a mounting surface of the mounting table 12 and an outer peripheral surface thereof; and a measurement line 16 that electrically connects the conductive film electrode 13 to a tester 17. Further, the probe apparatus measures electrical characteristics of the power devices on the mounting table 12 at a wafer level. Furthermore, the measurement line 16 includes a switch device 18 configured to open and close an electric path of the measurement line 16 between the conductive film electrode 13 and the tester 17.Type: ApplicationFiled: July 30, 2012Publication date: September 4, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ken Taoka
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Publication number: 20140176173Abstract: A probe card 10 includes a first probe 11 configured to come into electric contact with an emitter electrode of a power device D; a block-shaped first connecting terminal 12 to which the first probe 11 is connected; a second probe 13 configured to come into electric contact with a gate electrode of the power device D; a block-shaped second connecting terminal 14 to which the second probe 13 is connected; a contact plate 15 configured to come into electric contact with a collector electrode of the power device D; and a block-shaped third connecting terminal 16 fixed to the contact plate 15. Further, the first connecting terminal 12, the second connecting terminal 14 and the third connecting terminal 16 electrically come into direct contact with corresponding connection terminals of a tester, respectively.Type: ApplicationFiled: July 30, 2012Publication date: June 26, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ikuo Ogasawara, Ken Taoka
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Publication number: 20130063171Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.Type: ApplicationFiled: March 11, 2011Publication date: March 14, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Isao Kouno, Ken Taoka, Eiichi Shinohara, Ikuo Ogasawara
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Patent number: 8085052Abstract: A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.Type: GrantFiled: July 23, 2010Date of Patent: December 27, 2011Assignee: Tokyo Electron LimitedInventors: Eiichi Shinohara, Kazuki Hanawa
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Patent number: 7859279Abstract: A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.Type: GrantFiled: September 26, 2007Date of Patent: December 28, 2010Assignee: Tokyo Electron LimitedInventors: Eiichi Shinohara, Kazuki Hanawa
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Publication number: 20100283493Abstract: A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Eiichi SHINOHARA, Kazuki Hanawa
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Publication number: 20080100313Abstract: A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contact with the probe card, static electricity of the target object via the mounting table. The charge eliminating apparatus includes a grounding wiring for grounding the mounting table; a relay switch disposed on the grounding wiring; and a switch controller that controls the relay switch to be opened or closed.Type: ApplicationFiled: September 26, 2007Publication date: May 1, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Eiichi SHINOHARA, Kazuki HANAWA
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Patent number: D609652Type: GrantFiled: January 22, 2009Date of Patent: February 9, 2010Assignee: Tokyo Electron LimitedInventors: Munetoshi Nagasaka, Ikuo Ogasawara, Eiichi Shinohara