Wafer attracting plate

- Tokyo Electron Limited
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Description

FIG. 1 is a perspective view of the wafer attracting plate, showing our design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a plan view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a section view taken along a line as shown in FIG. 2.

Claims

The ornamental design for wafer attracting plate, as shown and described.

Referenced Cited
U.S. Patent Documents
6278600 August 21, 2001 Shamouilian et al.
6628503 September 30, 2003 Sogard
6721162 April 13, 2004 Weldon et al.
6818097 November 16, 2004 Yamaguchi et al.
6834440 December 28, 2004 Lee
D548705 August 14, 2007 Hayashi
7479304 January 20, 2009 Sun et al.
D587222 February 24, 2009 Sasaki et al.
Patent History
Patent number: D609652
Type: Grant
Filed: Jan 22, 2009
Date of Patent: Feb 9, 2010
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Munetoshi Nagasaka (Nirasaki), Ikuo Ogasawara (Nirasaki), Eiichi Shinohara (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/331,222
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)