Abstract: A management device 50 for power storage elements is provided with a cause analysis unit 51 that, when the voltages of power storage elements B1-B4 are reduced to a prescribed level or physical quantities correlated with the voltages are reduced to prescribed values after the supply of power to the power storage elements B1-B4 has been stopped, analyzes the cause of the voltage reduction in power storage elements B1-B4 or the cause of the reduction in the physical quantities correlated with voltages to the prescribed values, on the basis of measurement data of the power storage elements B1-B4 measured after the supply of power has been stopped.

Abstract: A system for automatic authentication of a user to allow access to websites and physical devices which provides tiered levels of security and defines an API protocol for exchange of authentication credentials.

Abstract: This document describes techniques and systems that enable a smartphone-based radar system for determining user intention in a lower-power mode. The techniques and systems use a radar field to enable the smartphone to accurately determine the presence or absence of a user and further determine the intention of the user to interact with the smartphone. Using these techniques, the smartphone can account for the user's nonverbal communication cues to determine and maintain an awareness of users in its environment, and only respond to direct interactions once a user has demonstrated an intention to interact, which preserves battery power. The smartphone may determine the user's intention by recognizing various cues from the user, such as a change in position relative to the smartphone, a change in posture, or by an explicit action, such as a gesture.

Abstract: Techniques and devices for seamless authentication using radar are described. In some implementations, a radar field is provided through a radar-based authentication system. The radar-based authentication system can sense reflections from an object in the radar field and analyze the reflections to determine whether the object is a person. In response to determining that the object is a person, the radar-based authentication system can sense an identifying characteristic associated with the person. Based on the identifying characteristic, the radar-based authentication system can determine that the person is an authorized user.

Abstract: This document describes techniques and systems that enable a radar-image shaper for radar-based applications. A radar field enables an electronic device to accurately determine a characteristic disposition (e.g., a location, orientation, velocity, or direction) of an object in the radar field. The characteristic disposition is determined by detecting a radar cross-section (or radar signature) of a radar-image shaper that is included in the object. The shape of the radar-image shaper produces a known signature when illuminated by the radar field. Using these techniques, the electronic device can determine a characteristic disposition of the object, which allows the object to be used to interact with the electronic device using gestures and other position-based techniques. Because the radar-image shaper enables a passive object to control applications on the electronic device, users have an interaction method with a rich library of gestures and controls that does not require additional components or a battery.

Abstract: Techniques and devices for seamless authentication using radar are described. In some implementations, a radar field is provided through a radar-based authentication system. The radar-based authentication system can sense reflections from an object in the radar field and analyze the reflections to determine whether the object is a person. In response to determining that the object is a person, the radar-based authentication system can sense an identifying characteristic associated with the person. Based on the identifying characteristic, the radar-based authentication system can determine that the person is an authorized user.

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract: This document describes techniques and systems that enable a radar-image shaper for radar-based applications. A radar field enables an electronic device to accurately determine a characteristic disposition (e.g., a location, orientation, velocity, or direction) of an object in the radar field. The characteristic disposition is determined by detecting a radar cross-section (or radar signature) of a radar-image shaper that is included in the object. The shape of the radar-image shaper produces a known signature when illuminated by the radar field. Using these techniques, the electronic device can determine a characteristic disposition of the object, which allows the object to be used to interact with the electronic device using gestures and other position-based techniques. Because the radar-image shaper enables a passive object to control applications on the electronic device, users have an interaction method with a rich library of gestures and controls that does not require additional components or a battery.

Abstract: This document describes techniques and systems that enable a smartphone-based radar system for determining user intention in a lower-power mode. The techniques and systems use a radar field to enable the smartphone to accurately determine the presence or absence of a user and further determine the intention of the user to interact with the smartphone. Using these techniques, the smartphone can account for the user's nonverbal communication cues to determine and maintain an awareness of users in its environment, and only respond to direct interactions once a user has demonstrated an intention to interact, which preserves battery power. The smartphone may determine the user's intention by recognizing various cues from the user, such as a change in position relative to the smartphone, a change in posture, or by an explicit action, such as a gesture.

Abstract: The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.

Abstract: In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract: Techniques and devices for seamless authentication using radar are described. In some implementations, a radar field is provided through a radar-based authentication system. The radar-based authentication system can sense reflections from an object in the radar field and analyze the reflections to determine whether the object is a person. In response to determining that the object is a person, the radar-based authentication system can sense an identifying characteristic associated with the person. Based on the identifying characteristic, the radar-based authentication system can determine that the person is an authorized user.

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract: In an electronic device, an inner lead of a signal terminal includes a base member, and a film on a surface of the inner lead adjacent to a bonding surface. The film includes a metal thin film disposed on the surface of the base member and having a portion to which a bonding wire is connected, and an oxide film made of an oxide of the same metal as a metal being a main component of the metal thin film, and disposed in at least a part of a region of the metal thin film, excluding a connection region of a bonding wire. The oxide film includes an uneven oxide film having a surface with continuous asperities formed by irradiating the metal thin film with pulsed laser light. The uneven oxide film is disposed in at least a part of a front end region of the bonding surface.

Abstract: In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.

Abstract: A pin assembly includes: a resin pin; and a collar fitted to a round shaft portion of the resin pin and having higher hardness than the resin pin. The round shaft portion is sheared to cancel connection between a first plate and a second plate upon secondary collision of a vehicle. The collar includes an end face received by a reception surface of the second plate, and shears the round shaft portion in a shear plane along the end face upon the secondary collision. The round shaft portion includes a hollow hole. An inner circumference of the hollow hole includes a straight portion which has a generating line parallel to an axial direction of the round shaft portion and which is traversed by a plane including the end face of the collar.

Abstract: A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

Abstract: In an electronic device, an inner lead of a signal terminal includes a base member, and a film on a surface of the inner lead adjacent to a bonding surface. The film includes a metal thin film disposed on the surface of the base member and having a portion to which a bonding wire is connected, and an oxide film made of an oxide of the same metal as a metal being a main component of the metal thin film, and disposed in at least a part of a region of the metal thin film, excluding a connection region of a bonding wire. The oxide film includes an uneven oxide film having a surface with continuous asperities formed by irradiating the metal thin film with pulsed laser light. The uneven oxide film is disposed in at least a part of a front end region of the bonding surface.

Abstract: An alternating material stack of insulator lines and first electrically conductive material layers is formed over a substrate, and is patterned to provide alternating stacks of insulating layers and first electrically conductive lines. A metal can be selectively deposited on the physically exposed sidewalls of the first electrically conductive material layers to form metal lines, while not growing from the surfaces of the insulator lines. The metal lines are oxidized to form metal oxide lines that are self-aligned to the sidewalls of the first electrically conductive lines. Vertically extending second electrically conductive lines can be formed as a two-dimensional array of generally pillar-shaped structures between the alternating stacks of the insulator lines and the first electrically conductive lines. Each portion of the metal oxide lines at junctions of first and second electrically conductive lines constitute a resistive memory element for a resistive random access memory (ReRAM) device.