Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.

Abstract: A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

Abstract: A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.

Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at place corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with a pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any airs, and the reliable PWB is thus obtainable.

Abstract: A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Abstract: A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.

Abstract: A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

Abstract: A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Abstract: A method of performing a printed circuit board including the steps of: (a) disposing a first release film on the surface of a substrate and a second release film on the back of the substrate; (b) forming a through-hole in the first release film, the second release film, and the substrate; (c) filling conductive paste into a through-hole; (d) removing the first release film and the second release film from the substrate with the through-hole filled with the conductive paste; (e) placing a first metallic member on the surface of the substrate with the release films removed and placing a second metallic member on the back of the substrate; (f) compressing under heat the substrate with the first metallic member and the second metallic member disposed thereon; and (g) forming a desired circuit pattern on the first metallic member and the second metallic member.

Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.

Abstract: A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.

Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.

Abstract: The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.

Abstract: A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.