Patents by Inventor Eiji Kawamoto

Eiji Kawamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010025415
    Abstract: A method of performing a printed circuit board including the steps of: (a) disposing a first release film on the surface of a substrate and a second release film on the back of the substrate; (b) forming a through-hole in the first release film, the second release film, and the substrate; (c) filling conductive paste into a through-hole; (d) removing the first release film and the second release film from the substrate with the through-hole filled with the conductive paste; (e) placing a first metallic member on the surface of the substrate with the release films removed and placing a second metallic member on the back of the substrate; (f) compressing under heat the substrate with the first metallic member and the second metallic member disposed thereon; and (g) forming a desired circuit pattern on the first metallic member and the second metallic member.
    Type: Application
    Filed: March 7, 2001
    Publication date: October 4, 2001
    Inventors: Eiji Kawamoto, Shigeru Yamane, Toshiaki Takenaka
  • Patent number: 5448055
    Abstract: The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad.
    Type: Grant
    Filed: December 2, 1993
    Date of Patent: September 5, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuro Nakamura, Eiji Kawamoto, Shinji Fujiwara
  • Patent number: 4595178
    Abstract: A leg is fitted through a joint material into each of a pair of vertical openings on a bottom wall of a vacuum tank for refining molten steel, for protecting the vertical openings from molten steel. The abovementioned leg has an annular inner wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal annular rows arranged one on the other so as to form an inner bore for passing molten steel therethrough. The leg also has an annular outer wall formed by piling up through a joint material a plurality of magnesia-chrome fired radial bricks in a plurality of horizontal rows arranged one on the other so as to cover substantially the entire outer surface of the annular inner wall. The inner surface of the annular outer wall is in contact with the outer surface of the annular inner wall through a joint material.
    Type: Grant
    Filed: December 31, 1984
    Date of Patent: June 17, 1986
    Assignee: Tokyo Yogyo Kabushiki Kaisha
    Inventors: Hitoshi Kato, Eiji Kawamoto