Abstract: A semiconductor device includes a semiconductor substrate, a first electroconductive member that is formed on the semiconductor substrate and that has a first linear portion extending along a principal surface of the semiconductor substrate, and an organic insulation layer that is formed on the semiconductor substrate and that covers the first electroconductive member, and the first linear portion includes a first side edge portion formed by a curve that is alternately bent to one side and to an opposite side of a direction intersecting a longitudinal direction of the first linear portion in a plan view.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first inorganic film, a second inorganic film covering the first inorganic film, and an opening. The opening is formed in the second inorganic film to partially expose the first inorganic film. The opening has a wall surface curved in a wavy line shape in a plan view.

Abstract: An elastic wave device includes a wiring board, a device chip having a resonator, and a wiring pattern electrically connected to the resonator, the device chip is electrically connected to the wiring board, and a sealing portion that seals the device chip. The wiring pattern includes a first wiring layer and a second wiring layer. The second wiring layer includes a lower metal layer in contact with an upper surface of the first wiring layer, a partition layer which is a metal layer in contact with an upper surface of the lower metal layer, and an upper metal layer in contact with an upper surface of the partition layer. The partition layer is a metal having a lower electrical conductivity than the lower metal layer and the upper metal layer.

Abstract: Sound quality is improved. A plurality of speaker units including a first speaker unit of a dynamic type, an arrangement case having an inner space formed as an arrangement space in which the plurality of speaker units is arranged, and a sound conduit protruding from the arrangement case and provided as a path for sound output from the plurality of speaker units are provided, the first speaker unit has a highest sound output band among the plurality of speaker units, the axial direction of the sound conduit and the axial direction of the first speaker unit are oriented in the same direction, the speaker units except the first speaker unit are arranged around the first speaker unit or on the opposite side to the sound conduit with the first speaker unit therebetween, and a central axis of the first speaker unit is positioned further on the inner side than the inner peripheral surface of the sound conduit.

Abstract: A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.

Abstract: Sound quality is improved. A plurality of speaker units including a first speaker unit of a dynamic type, an arrangement case having an inner space formed as an arrangement space in which the plurality of speaker units is arranged, and a sound conduit protruding from the arrangement case and provided as a path for sound output from the plurality of speaker units are provided, the first speaker unit has a highest sound output band among the plurality of speaker units, the axial direction of the sound conduit and the axial direction of the first speaker unit are oriented in the same direction, the speaker units except the first speaker unit are arranged around the first speaker unit or on the opposite side to the sound conduit with the first speaker unit therebetween, and a central axis of the first speaker unit is positioned further on the inner side than the inner peripheral surface of the sound conduit.

Abstract: A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

Abstract: A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.

Abstract: A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

Abstract: There is provided a headphone including: a driver unit including a vibration plate; a housing configured to house the driver unit, to form an air-tightened front air chamber of which a part except for an opening for sound output is spatially blocked from the outside on a front side on which the vibration plate of the driver unit is provided, and to form a rear air chamber that has a predetermined capacity on a rear side that is the opposite side to the front side; and an acoustic tube provided in a partial region of a partition wall of the housing that constitutes the rear air chamber and configured to spatially connect the rear air chamber and the outside of the housing through a tube.

Abstract: A ladder-type filter includes: one or more series resonators connected in series between an input terminal and an output terminal; two or more parallel resonators connected in parallel between the input terminal and the output terminal; a first inductor connected in series between at least two nodes, each of the at least two nodes being located between a corresponding parallel resonator of at least two parallel resonators of the two or more parallel resonators and ground; and a first capacitor connected in series with the first inductor between the at least two nodes.

Abstract: Provided are headphones with left and right sliders in linkage with each other. The headphones includes: a head band; a first slider that is provided on one end side of the head band and slides with respect to the head band; a second slider that is provided on the other end side of the head band and slides with respect to the head band; a connecting portion that connects the first slider and the second slider and slides the second slider in linkage with a slide operation of the first slider; and a pair of housings that are provided on the first slide portion and the second slide portion, respectively, and each house a sound output unit.

Abstract: There is provided a headphone including: a driver unit including a vibration plate; a housing configured to house the driver unit, to form an air-tightened front air chamber of which a part except for an opening for sound output is spatially blocked from the outside on a front side on which the vibration plate of the driver unit is provided, and to form a rear air chamber that has a predetermined capacity on a rear side that is the opposite side to the front side; and an acoustic tube provided in a partial region of a partition wall of the housing that constitutes the rear air chamber and configured to spatially connect the rear air chamber and the outside of the housing through a tube.

Abstract: An acoustic wave device includes: an acoustic wave chip including an acoustic wave element formed therein; a multilayered substrate including the acoustic wave chip mounted on an upper surface thereof; a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip; a second ground terminal formed on the lower surface; a signal terminal formed on the lower surface and electrically coupled to a signal electrode of the acoustic wave chip; and a shield layer formed at least on the upper surface, on the lower surface, or between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, not electrically coupled to the first ground terminal in the multilayered substrate, and electrically coupled to the second ground terminal.

Abstract: An acoustic wave device includes: an acoustic wave chip including an acoustic wave element formed therein; a multilayered substrate including the acoustic wave chip mounted on an upper surface thereof; a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip; a second ground terminal formed on the lower surface; a signal terminal formed on the lower surface and electrically coupled to a signal electrode of the acoustic wave chip; and a shield layer formed at least on the upper surface, on the lower surface, or between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, not electrically coupled to the first ground terminal in the multilayered substrate, and electrically coupled to the second ground terminal.

Abstract: A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

Abstract: [Object] To make it possible to further improve acoustic characteristics. [Solution] There is provided a headphone including: a driver unit including a vibration plate; a housing configured to house the driver unit, to form an air-tightened front air chamber of which a part except for an opening for sound output is spatially blocked from the outside on a front side on which the vibration plate of the driver unit is provided, and to form a rear air chamber that has a predetermined capacity on a rear side that is the opposite side to the front side; and an acoustic tube provided in a partial region of a partition wall of the housing that constitutes the rear air chamber and configured to spatially connect the rear air chamber and the outside of the housing through a tube.

Abstract: A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

Abstract: Provided are headphones with left and right sliders in linkage with each other. The headphones includes: a head band; a first slider that is provided on one end side of the head band and slides with respect to the head band; a second slider that is provided on the other end side of the head band and slides with respect to the head band; a connecting portion that connects the first slider and the second slider and slides the second slider in linkage with a slide operation of the first slider; and a pair of housings that are provided on the first slide portion and the second slide portion, respectively, and each house a sound output unit.

Abstract: A method for manufacturing emblems that can be mass-produced while being able to identify individual people, characterized in being configured so that the upper surface of an intermediate layer material is made visible by: placing the intermediate layer material on a lower layer material and a thermoplastic synthetic resin film upper layer material on said intermediate layer material, pressing the upper layer material, intermediate layer material and lower material with an engraving die that has a thermal cutting blade that follows the emblem countour line and performing induction heating by transmitting a high frequency to form a design on the upper layer material, removing unneccesary sections and creating an intermediate decorative piece, fitting said intermediate decorative piece in a jig and setting same in a laser engraver, and perfoming laser engraving using said individual information data and removing portions of the upper layer material according to the individual information data.