Patents by Inventor Eiji Kuwahara

Eiji Kuwahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160359470
    Abstract: A ladder-type filter includes: one or more series resonators connected in series between an input terminal and an output terminal; two or more parallel resonators connected in parallel between the input terminal and the output terminal; a first inductor connected in series between at least two nodes, each of the at least two nodes being located between a corresponding parallel resonator of at least two parallel resonators of the two or more parallel resonators and ground; and a first capacitor connected in series with the first inductor between the at least two nodes.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 8, 2016
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Eiji KUWAHARA, Yuki ENDO
  • Publication number: 20160295315
    Abstract: [Object] To make it possible to further improve acoustic characteristics. [Solution] There is provided a headphone including: a driver unit including a vibration plate; a housing configured to house the driver unit, to form an air-tightened front air chamber of which a part except for an opening for sound output is spatially blocked from the outside on a front side on which the vibration plate of the driver unit is provided, and to form a rear air chamber that has a predetermined capacity on a rear side that is the opposite side to the front side; and an acoustic tube provided in a partial region of a partition wall of the housing that constitutes the rear air chamber and configured to spatially connect the rear air chamber and the outside of the housing through a tube.
    Type: Application
    Filed: September 17, 2014
    Publication date: October 6, 2016
    Applicant: SONY CORPORATION
    Inventors: EIJI KUWAHARA, TAKAHIRO SUZUKI
  • Publication number: 20160142041
    Abstract: An acoustic wave device includes: an acoustic wave chip including an acoustic wave element formed therein; a multilayered substrate including the acoustic wave chip mounted on an upper surface thereof; a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip; a second ground terminal formed on the lower surface; a signal terminal formed on the lower surface and electrically coupled to a signal electrode of the acoustic wave chip; and a shield layer formed at least on the upper surface, on the lower surface, or between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, not electrically coupled to the first ground terminal in the multilayered substrate, and electrically coupled to the second ground terminal.
    Type: Application
    Filed: July 9, 2015
    Publication date: May 19, 2016
    Applicant: TAIYO YUDEN CO., LTD.
    Inventor: Eiji KUWAHARA
  • Publication number: 20140332146
    Abstract: A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.
    Type: Application
    Filed: June 11, 2014
    Publication date: November 13, 2014
    Inventors: Nobuo Kuroda, Eiji Kuwahara
  • Patent number: 8859461
    Abstract: A decoration piece has: a design piece made of thermoplastic synthetic resin formed with a design and having an outer profile line; a lower layer; and a dye migration preventing layer arranged between the design piece and the lower layer, said dye migration preventing layer having an outer profile same as that of said design piece, said dye migration preventing layer capable of being adhered to both said design piece and the lower layer, said dye migration preventing layer capable of preventing any migrating of dye. The dye migration preventing layer includes a dye migration preventing film made of ethylene-vinyl alcohol copolymer or polyamide MXD6, or a dye migration preventing film made of polyvinylidene chloride.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: October 14, 2014
    Inventor: Eiji Kuwahara
  • Publication number: 20130068376
    Abstract: A method and an apparatus produce a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for induction heating; stopping the high frequency induction heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.
    Type: Application
    Filed: June 2, 2010
    Publication date: March 21, 2013
    Applicants: EIJI KUWAHARA, NOBUO KURODA
    Inventor: Eiji Kuwahara
  • Publication number: 20120121869
    Abstract: A decoration piece has: a design piece made of thermoplastic synthetic resin formed with a design and having an outer profile line; a lower layer; and a dye migration preventing layer arranged between the design piece and the lower layer, said dye migration preventing layer having an outer profile same as that of said design piece, said dye migration preventing layer capable of being adhered to both said design piece and the lower layer, said dye migration preventing layer capable of preventing any migrating of dye. The dye migration preventing layer includes a dye migration preventing film made of ethylene-vinyl alcohol copolymer or polyamide MXD6, or a dye migration preventing film made of polyvinylidene chloride.
    Type: Application
    Filed: April 6, 2010
    Publication date: May 17, 2012
    Inventor: Eiji Kuwahara
  • Patent number: 8110059
    Abstract: There are provided (1) a method of manufacturing a three-dimensional decoration piece having a flat rear surface, (2) a method of manufacturing the decoration piece by easily cutting the same by means of a fusion cutter, (3) a method of manufacturing the decoration piece having a bonding or sticking feature on the rear surface and (4) a method of manufacturing a three-dimensional decoration piece without limiting the characteristics of the base member thereof. The three-dimensional decoration piece is manufactured by using an indented mold and high frequency dielectric heating. An indented mold having a second fusion cutter and arranged along an outer periphery of the fusion cutter is used. Firstly, a three-dimensional molded body of upper and intermediate layers having a recessed section on a lower surface thereof is molded by means of an indented mold and a protruding mold, and subsequently a lower layer material is molten by high frequency dielectric heating and made to flow into the recessed section.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: February 7, 2012
    Inventor: Eiji Kuwahara
  • Patent number: 5677037
    Abstract: There is provided a thermal transfer type emblem made of thermoplastic synthetic resin comprising three-dimensional design elements made of a flexible thermoplastic synthetic resin sheet as well as a method of manufacturing the same. Design elements formed with a design printed in color on the surface are bonded to the underside of a carrier film and a hot-melt type film is bonded to the lower surface of each of said design elements. If necessary, a synthetic resin adhesive layer is provided therebetween and said hot-melt type film may be bonded to a sheet of releasing paper at the underside. By appropriately selecting materials for the hot-melt type film and the synthetic resin adhesive layer, the flexible and three-dimensional emblem can be so made as to firmly adhere to an object by simply pressing the emblem with an iron regardless of the material of the object.
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: October 14, 1997
    Inventor: Eiji Kuwahara
  • Patent number: 5599416
    Abstract: There is provided a thermal transfer type emblem made of thermoplastic synthetic resin comprising three-dimensional design elements made of a flexible thermoplastic synthetic resin sheet as well as a method of manufacturing the same. Design elements formed with a design printed in color on the surface are bonded to the underside of a carrier film and a hot-melt type film is bonded to the lower surface of each of said design elements. If necessary, a synthetic resin adhesive layer is provided therebetween and said hot-melt type film may be bonded to a sheet of releasing paper at the underside. By appropriately selecting materials for the hot-melt type film and the synthetic resin adhesive layer, the flexible and three-dimensional emblem can be so made as to firmly adhere to an object by simply pressing the emblem with an iron regardless of the material of the object.
    Type: Grant
    Filed: May 12, 1995
    Date of Patent: February 4, 1997
    Inventor: Eiji Kuwahara
  • Patent number: 5589022
    Abstract: The object of the present invention is to provide a method of manufacturing an emblem in which high frequency induction heating is applied to a soft thermoplastic synthetic resin film such as a thermoplastic PVC film including a metal vapor deposition film and a polyurethane film. By a polyurethane film, the metal vapor deposition film is not damaged by hydrogen chloride gas or chlorine gas generated during the process of manufacturing the emblem by means of high frequency induction heating.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: December 31, 1996
    Inventor: Eiji Kuwahara
  • Patent number: 5520988
    Abstract: There is provided a thermal transfer type emblem made of thermoplastic synthetic resin comprising three-dimensional design elements made of a flexible thermoplastic synthetic resin sheet as well as a method of manufacturing the same. Design elements formed with a design printed in color on the surface are bonded to the underside of a carrier film and a hot-melt type film is bonded to the lower surface of each of said design elements. If necessary, a synthetic resin adhesive layer is provided therebetween and said hot-melt type film may be bonded to a sheet of releasing paper at the underside. By appropriately selecting materials for the hot-melt type film and the synthetic resin adhesive layer, the flexible and three-dimensional emblem can be so made as to firmly adhere to an object by simply pressing the emblem with an iron regardless of the material of the object.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: May 28, 1996
    Inventor: Eiji Kuwahara
  • Patent number: 5317907
    Abstract: In an air conditioning apparatus, the refrigerant discharged from a compressor of an outdoor unit is passed through an outdoor heat exchanger, the refrigerant having passed through the outdoor heat exchanger is passed through an indoor heat exchanger of an ambient air-conditioning unit and the refrigerant having passed through the indoor heat exchanger is returned to the compressor to cool the whole space in the room. At the same time, the refrigerant discharged from the compressor is passed through the outdoor heat exchanger, the refrigerant having passed through the outdoor heat exchanger is passed through indoor heat exchangers of a plurality of personal air-conditioning units and the refrigerant having passed through the indoor heat exchangers is returned to the compressor to separately cool the discrete spaces in the room.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: June 7, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiichiro Shimizu, Eiji Kuwahara, Manabu Kitamoto, Masao Amano, Yasunori Ichikawa, Masayuki Hibi, Keizo Iwata
  • Patent number: 5297395
    Abstract: A refrigeration cycle has a compressor, an outdoor rotary-type heat exchanger, a motor-operated expansion valve, and an indoor rotary-type heat exchanger which are sequentially connected to each other to circulate a refrigerant. A tank is set in a connected state or a non-connected state with respect to a refrigerant discharge side of the compressor. A detector detects at least a pressure at one side of each of the exchangers. A first controller sets the tank in a non-connected state when a normal operation of an air conditioner is to be started, and controls the capacity of the compressor, the rotational speed of the exchangers, and the opening degree of the valve in accordance with an air-conditioning load, thereby performing the normal operation of the air conditioner.
    Type: Grant
    Filed: January 29, 1993
    Date of Patent: March 29, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masao Ozu, Masao Isshiki, Eiji Kuwahara, Takao Hoshi, Atsuyuki Hiruma, Tohru Kubo, Atsushi Nagasawa, Nobuo Kawai, Yoshiaki Nagaoka, Kazuhiko Akiyama
  • Patent number: 5218838
    Abstract: Two or more indoor units are provided on ceiling and floor of a room. Each of the indoor units has an air heat exchanger for cooling indoor air, and a drain pan for catching drainage produced by the air heat exchanger. A drain pipe is provided in the ceiling and under the floor. The, drainage in each of the drain pans flows into the drainage pipe. The drain in the drain pipe is carried and discharged outdoor by a drain carrying unit.
    Type: Grant
    Filed: April 23, 1992
    Date of Patent: June 15, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Manabu Kitamoto, Yasunori Ichikawa, Keiichiro Shimizu, Eiji Kuwahara, Masao Amano, Masayuki Hibi, Keizo Iwata
  • Patent number: 5143672
    Abstract: A method for forming a gold-laced emblem of thermoplastic synthetic resin film. A woven fabric-like fine uneven pattern is formed on an outer surface of the thermoplastic synthetic resin film having a metal deposited layer on a lower surface thereof. Instead, a woven fabric-like fine uneven pattern is formed on an outer surface of metal-interposed multi-layer thermoplastic synthetic resin film. The film is superposed on an upper surface of a base, and pressed by an engraving die. The engraving die has one or more fusion cutters having sharp cutting edges along a profile line of a pattern to be shaped, and one or more pressing cutters, an edge face of which is slightly above a cutting edge face of the sharp cutting edges. The film is high-frequency-induction-heated by the engraving die. The film is plasticized and the film of a quantity corresponding to portions intruded by the cutters is swelled to both sides of the cutters.
    Type: Grant
    Filed: December 20, 1988
    Date of Patent: September 1, 1992
    Inventor: Eiji Kuwahara
  • Patent number: 5050396
    Abstract: A total cooling capability requested from one or a plurality of indoor units is compared with a total heating capability requested from one or the plurality of indoor units to set a cooling or heating operation mode.
    Type: Grant
    Filed: February 23, 1990
    Date of Patent: September 24, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seizi Ohkoshi, Eiji Kuwahara
  • Patent number: 5046323
    Abstract: An air conditioner is disclosed which includes a unit for setting a defrost mode, as required, when the heating operation mode is determined, a unit for enabling the refrigerant which is delivered from the compressor to flow through one or more indoor units calling for the heating operation mode, when the defrost mode is set, and to be returned back to the compressor through one or more indoor units calling for the cooling operation mode, and a unit for enabling a stream of the refrigerant which is delivered from the compressor to pass through the outdoor heat exchanger, when the defrost mode is set, and to enter the stream of the refrigerant flowing into one or more indoor units calling for the cooling operation mode.
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: September 10, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Eiji Kuwahara
  • Patent number: 5046325
    Abstract: A refrigerating circuit apparatus includes a two stage compressor having an upper stage compressing cylinder and a lower stage compressing cylinder, a heat stage tank, an upper stage side variable opening expansion valve and a lower stage side variable opening expansion valve. The upper stage side variable opening expansion valve is controlled toward its closed position for executing a heat storing operation wherein heat is discharged from refrigerant to the heat storage tank. The upper stage side variable opening expansion valve is opened and the lower stage side variable opening expansion valve is closed for carrying out a defrosting operation. Heat stored in the heat storage tank is used in the defrosting operation for removing frost accumulated on an external heat-exchanger during the heating operation.
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: September 10, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Eiji Kuwahara
  • Patent number: 5009078
    Abstract: A total cooling capability requested from one or a plurality of indoor units is compared with a total heating capability requested from one or the plurality of indoor units to set a cooling or heating operation mode.
    Type: Grant
    Filed: February 23, 1990
    Date of Patent: April 23, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seizi Ohkoshi, Eiji Kuwahara