Abstract: An information display system having acute-angled diffusion characteristics configured to display an image to inside or outside of a space via a transparent projected member, the information display system including an image projection apparatus, a transparent sheet provided on an inner surface of a display region set on a part of the projected member; and a light direction changing unit that directs a direction of image light toward the transparent sheet of the display region, the image projection apparatus including an image light characteristic converting unit, and an image light control film that restricts an emission direction of the image light being provided on an upper surface of the image projection apparatus, so that the image light is not directly delivered to an observer and the image light reflected by the transparent sheet is recognized by the observer.

Abstract: A display device includes a backlight, a display element, a plate for holding at least a portion of an emission surface, from which an image light is emitted, provided on the display element, and a heat dissipation portion that dissipates heat generated from the display element. The display element is connected to the heat dissipation portion via the plate.

Abstract: The present invention has an object to perform a peeling treatment in a short time. Peeling is performed while a peeling layer is exposed to an atmosphere of an etching gas. Alternatively, peeling is performed while an etching gas for a peeling layer is blown to the peeling layer in an atmosphere of an etching gas. Specifically, an etching gas is blown to a part to be peeled while a layer to be peeled is torn off from a substrate. Alternatively, peeling is performed in an etchant for a peeling layer while supplying an etchant to the peeling layer.

Abstract: A release layer formed over a substrate; at least one of thin film integrated circuits is formed over the release layer; a film is formed over each of the at least one of thin film integrated circuits; and the release layer is removed by using an etchant; thus, the at least one of thin film integrated circuits is peeled from the substrate. A semiconductor device is formed by sealing the peeled thin film integrated circuit by lamination or the like.

Abstract: A coil device (1) in which a first coil (2), a second coil (4) and a third coil (3), each having a flat plate shape, are stacked with one other, wherein the first coil has a clearance section, the third coil has a second clearance section, part or whole of a lead wire (44) drawn out from the inside to the peripheral portion of the second coil while striding over the second coil (4) as well as part or whole of a lead wires (37a, 37b) drawn out from the inside to the peripheral portion of the third coil (3) while striding over the third coil are accommodated in the clearance section, and part or whole of lead wires (27a, 26b) drawn out from the inside to the peripheral portion of the first coil (2) while striding over the first coil are accommodated in the second clearance section.

Abstract: A saddle type vehicle is provided wherein the visibility thereof can be improved. The saddle type vehicle includes a headlamp configured to illuminate the front of the vehicle and position lamps configured to emit light for the visibility of the vehicle or act as blinkers. The position lamps are disposed in a left and right pair in front of the headlamp. Further, the left and right position lamps are disposed in such a manner as to sandwich the headlamp therebetween as viewed in front elevation.

Abstract: A magnetic circuit that forms an arc-shaped magnetic field space is provided. Of two magnets constituting a first magnetic circuit 10, a first magnetic pole 1 is provided with a first yoke 11 that is arc-shaped in planar view, a first magnet 13 that is arc-shaped in planar view and a magnetic pole piece 15. On the other hand, a second magnetic pole 2 is provided with a second yoke 21 that is arc-shaped in planar view, a second magnet 23 that is arc-shaped in planar view and a magnetic pole piece 25. The first magnetic pole piece 15 and the second magnetic pole piece 25 are disposed so as to be opposed to each other while being separated from each other. The first magnet 13 and the second magnet 23 are formed by arranging a plurality of small magnets.

Abstract: A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 ?/cm2 is formed on at least one surface of each structure body.

Abstract: The present invention has an object to perform a peeling treatment in a short time. Peeling is performed while a peeling layer is exposed to an atmosphere of an etching gas. Alternatively, peeling is performed while an etching gas for a peeling layer is blown to the peeling layer in an atmosphere of an etching gas. Specifically, an etching gas is blown to a part to be peeled while a layer to be peeled is torn off from a substrate. Alternatively, peeling is performed in an etchant for a peeling layer while supplying an etchant to the peeling layer.

Abstract: A magnetic field application device capable of applying a magnetic field to an object for a sufficient time is provided. A first magnetic circuit which is one of the two magnetic circuits provided to the magnetic field application device is provided with two magnetic poles of a first magnetic pole 1 and a second magnetic pole 2. The first magnetic pole 1 is provided with a first yoke 11 that is arc-shaped in planar view, a first magnet 13 that is arc-shaped in planar view and a first magnetic pole piece 15. On the other hand, the second magnetic pole 2 is provided with a second yoke 21 that is arc-shaped in planar view, a second magnet 23 that is arc-shaped in planar view and a second magnetic pole piece 25. The first magnetic pole piece 15 and the second magnetic pole piece 25 are disposed so as to be opposed to each other while being separated from each other.

Abstract: The present invention has an object to perform a peeling treatment in a short time. Peeling is performed while a peeling layer is exposed to an atmosphere of an etching gas. Alternatively, peeling is performed while an etching gas for a peeling layer is blown to the peeling layer in an atmosphere of an etching gas. Specifically, an etching gas is blown to a part to be peeled while a layer to be peeled is torn off from a substrate. Alternatively, peeling is performed in an etchant for a peeling layer while supplying an etchant to the peeling layer.

Abstract: A magnetic circuit that forms an arc-shaped magnetic field space is provided. Of two magnets constituting a first magnetic circuit 10, a first magnetic pole 1 is provided with a first yoke 11 that is arc-shaped in planar view, a first magnet 13 that is arc-shaped in planar view and a magnetic pole piece 15. On the other hand, a second magnetic pole 2 is provided with a second yoke 21 that is arc-shaped in planar view, a second magnet 23 that is arc-shaped in planar view and a magnetic pole piece 25. The first magnetic pole piece 15 and the second magnetic pole piece 25 are disposed so as to be opposed to each other while being separated from each other. The first magnet 13 and the second magnet 23 are formed by arranging a plurality of small magnets.

Abstract: A saddle type vehicle is provided wherein, even where an accommodating portion is provided on a front cowl, a wind inlet portion for a screen can be readily formed centrally in a vehicle widthwise direction and an aerodynamic property and a cooling performance can be assured suitably. The saddle type vehicle includes a vehicle body frame, a steering shaft supported for rotation at a front end of the vehicle body frame and configured to steer a front wheel, a front cowl disposed around the steering shaft and covering a front portion of a vehicle body, and a pair of accommodation portions provided on the front cowl. The accommodation portions are disposed in left and right pair. A wind inlet portion of a screen provided so as to be erected uprightly from the front cowl is disposed between the left and right accommodation portions.

Abstract: A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 ?/cm2 is formed on at least one surface of each structure body.

Abstract: The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.

Abstract: A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 ?/cm2 is formed on at least one surface of each structure body.

Abstract: A saddle type vehicle is provided wherein the visibility thereof can be improved. The saddle type vehicle includes a headlamp configured to illuminate the front of the vehicle and position lamps configured to emit light for the visibility of the vehicle or act as blinkers. The position lamps are disposed in a left and right pair in front of the headlamp. Further, the left and right position lamps are disposed in such a manner as to sandwich the headlamp therebetween as viewed in front elevation.

Abstract: A saddle type vehicle is provided wherein, even where an accommodating portion is provided on a front cowl, a wind inlet portion for a screen can be readily formed centrally in a vehicle widthwise direction and an aerodynamic property and a cooling performance can be assured suitably. The saddle type vehicle includes a vehicle body frame, a steering shaft supported for rotation at a front end of the vehicle body frame and configured to steer a front wheel, a front cowl disposed around the steering shaft and covering a front portion of a vehicle body, and a pair of accommodation portions provided on the front cowl. The accommodation portions are disposed in left and right pair. A wind inlet portion of a screen provided so as to be erected uprightly from the front cowl is disposed between the left and right accommodation portions.

Abstract: It is an object of the present invention to reduce the cost of a wireless chip, further, to reduce the cost of a wireless chip by enabling the mass production of a wireless chip, and furthermore, to provide a downsized and lightweight wireless chip. A wireless chip in which a thin film integrated circuit peeled from a glass substrate or a quartz substrate is formed between a first base material and a second base material is provided according to the invention. As compared with a wireless chip formed from a silicon substrate, the wireless chip according to the invention realizes downsizing, thinness, and lightweight. The thin film integrated circuit included in the wireless chip according to the invention at least has an n-type thin film transistor having an LDD (Lightly Doped Drain) structure, a p-type thin film transistor having a single drain structure, and a conductive layer functioning as an antenna.

Abstract: A coil device (1) in which a first coil (2), a second coil (4) and a third coil (3), each having a flat plate shape, are stacked with one other, wherein the first coil has a clearance section, the third coil has a second clearance section, part or whole of a lead wire (44) drawn out from the inside to the peripheral portion of the second coil while striding over the second coil (4) as well as part or whole of a lead wires (37a, 37b) drawn out from the inside to the peripheral portion of the third coil (3) while striding over the third coil are accommodated in the clearance section, and part or whole of lead wires (27a, 26b) drawn out from the inside to the peripheral portion of the first coil (2) while striding over the first coil are accommodated in the second clearance section.