Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

Abstract: A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body, a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer, and a protecting layer disposed on a one-side surface in the thickness direction of the substrate layer.

Abstract: A patchable biosensor includes a substrate extending in a longitudinal direction and being stretchable for being patched to a surface of a living body and an electronic component disposed on a one-side surface in a thickness direction of the substrate and extending in the longitudinal direction. The longitudinal direction of the electronic component crosses the longitudinal direction of the substrate.

Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

Abstract: A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: A patchable biosensor includes a substrate extending in a longitudinal direction and being stretchable for being patched to a surface of a living body and an electronic component disposed on a one-side surface in a thickness direction of the substrate and extending in the longitudinal direction. The longitudinal direction of the electronic component crosses the longitudinal direction of the substrate.

Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

Abstract: A biosensor includes a pressure-sensitive adhesive layer for attaching to a surface of a living body, a substrate layer disposed on an upper face of the pressure-sensitive adhesive layer and having a stretching property, a probe disposed on the lower face of the pressure-sensitive adhesive layer, and an electronic component mounted on the substrate layer so as to be connected to the probe, wherein a total thickness of the pressure-sensitive adhesive layer and the substrate layer is 1 ?m or more and less than 100 ?m.

Abstract: A laminate patchable a living body includes a pressure-sensitive adhesive layer for patching to the living body, a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer, and a protecting layer disposed on a one-side surface in the thickness direction of the substrate layer.

Abstract: A laminate patchable a living body includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.

Abstract: Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.

Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient ? [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E? [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30?Ea?120 [kJ/mol]??(1); and 10,000??×E??300,000 [Pa/K]??(2).

Abstract: A mobile terminal power receiving module 1 which is housed together with a rechargeable battery 3 in a rechargeable battery pack 2 in a mobile terminal such as a smart phone 5, includes a sheet coil 13 in which a coil 12 constituted by conductors is formed on a flexible circuit board 11 as a circuit pattern and a magnetic sheet 14 made of resin in which magnetic powder is dispersed.

Abstract: Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.