Abstract: Methods and systems for managing test wafers an automated material handling system are provided. Test material is classified into a plurality of classes. A time profile for each class of test material for a time period is determined and the test material is placed into cassettes based on the determined time profile for each class. When a request to pick up a particular group of a test material class is received, a cassette is identifying for picking up the particular group based on the contents of the cassette.

Abstract: A method for pre-positioning routed material in a computer controlled manufacturing arrangement having alternate locations for predetermined ones of a plurality of manufacturing process steps and predetermined types of materials to be routed into alternate locations. The method includes establishing a distribution of events indicative of the alternate locations at which material is processed for a manufacturing process step with respect to the materials to be routed and documenting the distribution of events in a database with respect to the type of materials to be routed and the alternate locations in terms of routing times, therein establishing a historical routing time for the type of material to be routed. In addition, there is established the actual mix of materials to be routed to the alternate locations and their historical routing time and actual routing time for the type of routed material are compared.

Abstract: The present invention provides for a method and an apparatus for implementing an embedded process control into a manufacturing tool system. At least one semiconductor device is processed. An embedded process control procedure is performed in response to the processing of the semiconductor device. A subsequent process of semiconductor device is performed in response to the embedded process control procedure. The apparatus of the present invention comprises: a computer system; and at least one manufacturing tool system interfaced with the computer, the manufacturing tool system comprising an embedded process control system capable of receiving commands from the computer system and control a manufacturing process performed by the manufacturing tool system.

Abstract: An automated material handling system is presented for a manufacturing facility divided into separate fabrication areas. The automated material handling system plans and carries out the movement of work pieces between fabrication areas and maintains a database indicating the location of each work piece within the manufacturing facility. In one embodiment, the automated material handling system accomplishes the containerless transfer of semiconductor wafers through a wall separating a first and second fabrication areas. The wafers are transported within containers (e.g., wafer boats). The material handling system includes a number of transfer tools, including air lock chambers, mass transfer systems, robotic arms, and stock areas. The material handling system also includes a control system which governs the operations of the transfer tools as well as the dispersal of containers.

Abstract: An apparatus and method are presented for identifying a semiconductor die within a group of semiconductor dice formed upon a surface of the same semiconductor wafer. During wafer fabrication, several parallel-resonant electronic structures are formed within each die area of the semiconductor wafer. The parallel-resonant structures are configured such that each semiconductor die responds differently to an alternating current (a.c.) electrical signal. During an identification operation, an a.c. electrical signal is coupled to the parallel-resonant structures of a selected semiconductor die. The unique response of the parallel-resonant structures of the selected semiconductor die to the a.c. electrical signal is used to determine the position of the selected semiconductor die relative to other semiconductor dice formed from the same semiconductor wafer. The apparatus includes a includes a variable frequency oscillator configured to produce an a.c. voltage Vout, a probe, and a resistor.

Abstract: A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively.

Abstract: An apparatus and method are presented for non-contact manipulation of a semiconductor die during semiconductor device manufacturing. Multiple die manipulation circuits are formed within specific regions of die areas of a semiconductor wafer. The die manipulation circuits may be formed upon a frontside surface of the wafer or upon a backside surface of the wafer. Following separation of the semiconductor dice from the wafer, a die is positioned above a horizontal surface of a die manipulation apparatus. Each die manipulation circuit receives alternating current (a.c.) power via an alternating magnetic field and uses the a.c. power to produce a static magnetic field. The static magnetic field opposes static magnetic fields formed around one or more levitation coils of the horizontal surface, causing the die to be levitated above the horizontal surface. By varying the relative strengths of the magnetic fields created by the levitation coils, "waves" of magnetic flux may be formed.

Abstract: An automated system is presented for containerless transfer of semiconductor wafers through a wall separating a first fabrication area and a second fabrication area. The system includes multiple containers for transporting the wafers, one or more air lock chambers, mass transfer systems, robotic arms, stock areas, and a control system. The containers (e.g., wafer boats) are dispersed between the first and second fabrication areas. A portion of the containers contain at least one semiconductor wafer, and the remainder of the containers are empty. The air lock chambers are positioned in sealed openings in the wall. The air lock chambers provide isolation between the first and second fabrication areas while permitting the transfer of semiconductor wafers between the fabrication areas. A mass transfer system is positioned within each air lock chamber and allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to each air lock chamber.

Abstract: An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.

Abstract: A system and method for managing empty carriers in an automated material handling system. The system includes a plurality of material carriers, some of which are empty, and a plurality of stock areas which store the carriers while waiting for the contained material to be processed or after having been processed. The system also includes a transportation system for moving the carriers between the stock areas. The system also includes a control system which receives status information from the transportation system and stock areas and controls the movement of carriers, in particular empty carriers, within the system in order to avoid production inefficiencies due to time delays introduced by an empty carrier not being available at a stock area when needed. The control system accomplishes this by calculating status variables, such as the empty percentage of each stock area, the current move rate of carriers in the system, and the current empty move rate in the system.

Abstract: A scanning system for scanning bar codes attached to wafer cassettes received in a chamber of a wafer processing tool. The system includes a scanner positioned external to the chamber for reading the bar codes and generating signals indicative thereof. Light generated by the scanner passes through an opening in the chamber wall and reflects off one or more reflective or refractive members positioned internal to the chamber, to illuminate the bar code attached to a wafer cassette contained in the chamber. Light reflected from the bar code likewise is bent by the reflective or refractive members and passes through the wall opening where it is sensed by the scanner. The reflective or refractive members are positioned so that the scanner can read bar codes which are not within the line of sight of the scanner through the wall opening.