Abstract: To enable to downsize a package for containing a solid-state imaging element relative to a solid-state imaging element having the same size and accordingly, downsize a solid-state imaging device for containing the solid-state imaging element thereto, further, downsize an apparatus such as a video camera or a still camera using the solid-state imaging device, there is provided a package for containing semiconductor element comprising a package having a recess portion for containing a semiconductor element, and a pair of positioning holes and a pair of attaching holes respectively provided at a pair of opposed side portions of the recess portion at surfaces of the package, wherein a line connecting the pair of positioning holes and a line connecting the pair of attaching holes are intersected with each other substantially at a center of the package.

Abstract: A pilot opening to the outside is formed at one side end of a package for a solid-state image-pickup device and a guide opening to the outside is formed at a side end opposite to and approximately in parallel with the one side end of the package. The pilot is made to face a pilot pin projecting above a circuit board and a guide pin is inserted into the guide. The solid-state image-pickup device is then fixed at a prescribed position on the circuit board after the pilot comes into contact with the pilot pin. With a solid-state-,image-pickup device and a mounting method thus provided, package size does not become large and mounting is carried out with an extremely high positioning precision.

Abstract: To enable to downsize a package for containing a solid-state imaging element relative to a solid-state imaging element having the same size and accordingly, downsize a solid-state imaging device for containing the solid-state imaging element thereto, further, downsize an apparatus such as a video camera or a still camera using the solid-state imaging device, there is provided a package for containing semiconductor element comprising a package having a recess portion for containing a semiconductor element, and a pair of positioning holes and a pair of attaching holes respectively provided at a pair of opposed side portions of the recess portion at surfaces of the package, wherein a line connecting the pair of positioning holes and a line connecting the pair of attaching holes are intersected with each other substantially at a center of the package.

Abstract: A solid image pickup device is enclosed in an integral package comprising an upper package and a lower package, which are made of a resin and molded together with a lead frame held between the upper and lower packages, the device having outline references provided on lateral sides of the integral package. Tapered surfaces are formed along an overall side periphery of the upper package and an overall side periphery of the lower package. A plurality of holes are formed to penetrate the integral package in the vertical direction. Cutouts are formed on opposite lateral sides of the integral package to make parts of two parallel sides of the lead frame exposed to the outside, and the holes are formed in the parts of the lead frame exposed in the cutouts.