Semiconductor element
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Description
FIG. 1 is a top, front perspective view of a semiconductor element showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
Claims
The ornamental design for a semiconductor element, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
D395423 | June 23, 1998 | Koyama et al. |
D395638 | June 30, 1998 | Koyama et al. |
D396696 | August 4, 1998 | Takagi et al. |
D401567 | November 24, 1998 | Farnworth et al. |
D402638 | December 15, 1998 | Farnworth et al. |
D427977 | July 11, 2000 | Takizawa et al. |
D432097 | October 17, 2000 | Song et al. |
- Catalog “Semiconductor '97 Package Manual,” “AS-A3,” Sony, 1997.
Patent History
Patent number: D441727
Type: Grant
Filed: Oct 4, 2000
Date of Patent: May 8, 2001
Assignee: Sony Corporation (Tokyo)
Inventor: Emiko Sekimoto (Tokyo)
Primary Examiner: Brian N. Vinson
Attorney, Agent or Law Firm: Rader,Fishman & Grauer
Application Number: 29/130,540
Type: Grant
Filed: Oct 4, 2000
Date of Patent: May 8, 2001
Assignee: Sony Corporation (Tokyo)
Inventor: Emiko Sekimoto (Tokyo)
Primary Examiner: Brian N. Vinson
Attorney, Agent or Law Firm: Rader,Fishman & Grauer
Application Number: 29/130,540
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;