Abstract: Some embodiments relate to a photovoltaic module. The photovoltaic module may be configured to be installed on a roofing substrate. The photovoltaic module may comprise a frontsheet, a backsheet, and an encapsulated solar cell between the frontsheet and the backsheet. The backsheet may comprise at least one layer. The at least one layer of the backsheet may comprise a polymer and a graphene component. The at least one layer of the backsheet may be a heat conducting layer. The photovoltaic module may comprise a film as a heat conducting layer.

Abstract: A system includes a plurality of photovoltaic modules installed on a roof deck. Each of the photovoltaic modules includes solar cells, a first encapsulant encapsulating the solar cells, a frontsheet and a backsheet. The front sheet includes a glass layer. The backsheet includes a first layer and a second layer. Each of the first and second layers includes first, second, third and fourth edges. The first edge of the first layer is offset from the first edge of the second layer, the second edge of the first layer is offset from the second edge of the second layer, the third edge of the first layer is offset from the third edge of the second layer, and the fourth edge of the first layer is offset from the fourth edge of the second layer.

Abstract: A system includes a plurality of photovoltaic modules configured to be installed on a roof deck and a plurality of roofing shingles. Each of roofing shingles includes a cap layer composed of a first polymer material, and a core layer underneath the cap layer. The core layer includes a first layer composed of a continuous fiber thermoplastic composite tape (CFT), a second layer composed of a continuous fiber thermoplastic composite tape (CFT), and a third layer between the first layer and the second layer. The third layer is composed of a second polymer material.

Abstract: A light source includes an array of light emitters, with at least some light emitters having a central patterned surface and an unpatterned border; a light blocking metal layer positioned between each of the array of light emitters; and down-converter material positioned on each of the array of light emitters.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

Abstract: A lighting device is disclosed that includes a plurality of light emitting diodes arranged in an array, trenches disposed between the light emitting diodes, and a scattering layer disposed in the trenches, the scattering layer including a binder matrix, a plurality of scattering particles disposed in the binder matrix, and a plurality of porous particles containing a gas, the porous particles disposed in the binder matrix.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: In a gas sensing system, an emitter emits light through a gas toward a concave reflective surface. The reflective surface reflects the light toward a sensor while light that passes through a porous scattering material is scattered. The surface of the reflective surface provides a diffusion of the light. A concentration of the gas is detected by the sensor. The scattering material may be permeable or non-permeable to the gas. The scattering and reflecting of the light increases the distance the light travels from the emitter to the sensor to increase absorption of the light by the gas.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalk. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed. A downconverter layer transfer device includes a release liner and a downconverter layer disposed on the release liner, the downconverter layer including a downconverter material dispersed throughout an adhesive, the downconverter layer being solid and non-adhesive at a first temperature, and adhesive at an elevated temperature above the first temperature.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.