Patents by Inventor Emma DOHNER
Emma DOHNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220181527Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.Type: ApplicationFiled: December 4, 2020Publication date: June 9, 2022Applicant: LUMILEDS LLCInventors: Emma DOHNER, Daniel ROITMAN
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Patent number: 11322665Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.Type: GrantFiled: May 14, 2020Date of Patent: May 3, 2022Assignee: Lumileds LLCInventors: Emma Dohner, Grigoriy Basin, Daniel B. Roitman, Vernon K. Wong
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Publication number: 20220131102Abstract: Embodiments of an electroluminescent device are described. The electroluminescent device includes a substrate, a first electrode disposed on the substrate, an emission layer comprising luminescent nanostructures disposed on the first electrode, a hybrid transport layer disposed on the emission layer, and a second electrode disposed on the hybrid transport layer. The hybrid transport layer includes an organic layer and inorganic nanostructures disposed within the organic layer. The luminescent nanostructures are separated from the inorganic nanostructures by the organic layer.Type: ApplicationFiled: October 21, 2021Publication date: April 28, 2022Applicant: Nanosys, Inc.Inventors: Daekyoung KIM, Ruiqing MA, Emma DOHNER, Donald ZEHNDER
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Patent number: 11302849Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles and/or air voids. The pigments, light scattering particles and/or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles and/or air voids inhomogeneously distributed in the reflector. The side reflector may comprise phosphor particles.Type: GrantFiled: October 25, 2019Date of Patent: April 12, 2022Assignee: Lumileds LLCInventors: Grigoriy Basin, Kentaro Shimizu, Brendan Moran, Emma Dohner, Noad Shapiro, Marcel Bohmer
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Publication number: 20220102595Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Applicant: LUMILEDS LLCInventors: Daniel Bernardo ROITMAN, Emma DOHNER, Kentaro SHIMIZU, Marcel Rene BOHMER
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Patent number: 11201267Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.Type: GrantFiled: December 16, 2019Date of Patent: December 14, 2021Assignee: LUMILEDS LLCInventors: Daniel Bernardo Roitman, Emma Dohner, Kentaro Shimizu, Marcel Rene Bohmer
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Publication number: 20210359171Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.Type: ApplicationFiled: May 14, 2020Publication date: November 18, 2021Inventors: Emma DOHNER, Grigoriy BASIN, Daniel B. ROITMAN, Vernon K. WONG
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Patent number: 11063191Abstract: A phosphor carrier assembly includes a substrate, a thermal or UV activated release adhesive, a layer containing a pixelated phosphor array, and a partially cured or highly viscous adhesive. The phosphor pixels on the carrier are typically all of the same color. In formation of a phosphor converted LED array the phosphor pixels on the carrier assembly are aligned with and placed in contact with corresponding LED pixels in an array of pixelated LED dice. Selected phosphor pixels on the carrier assembly may then be attached to corresponding LED pixels, and released from the substrate, by powering (activating) the corresponding LED pixels to heat the selected phosphor pixel to a temperature that releases the thermal release adhesive and that cures or partially cures the adhesive on the selected phosphor pixels in contact with the corresponding LED pixels.Type: GrantFiled: October 15, 2019Date of Patent: July 13, 2021Assignee: Lumileds LLCInventors: Emma Dohner, Kentaro Shimizu, Hisashi Masui
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Publication number: 20210151500Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalk. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.Type: ApplicationFiled: January 25, 2021Publication date: May 20, 2021Applicant: LUMILEDS LLCInventors: Hisashi MASUI, Ken SHIMIZU, Emma DOHNER
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Publication number: 20210151626Abstract: A light source includes an array of light emitters, with at least some light emitters having a central patterned surface and an unpatterned border; a light blocking metal layer positioned between each of the array of light emitters; and down-converter material positioned on each of the array of light emitters.Type: ApplicationFiled: October 30, 2020Publication date: May 20, 2021Applicant: Lumileds LLCInventors: Emma Dohner, Kentaro Shimizu
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Publication number: 20210126166Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles and/or air voids. The pigments, light scattering particles and/or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles and/or air voids inhomogeneously distributed in the reflector. The side reflector may comprise phosphor particles.Type: ApplicationFiled: October 25, 2019Publication date: April 29, 2021Applicant: Lumileds LLCInventors: Grigoriy BASIN, Kentaro SHIMIZU, Brendan MORAN, Emma DOHNER, Noad SHAPIRO, Marcel Bohmer
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Publication number: 20210126042Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.Type: ApplicationFiled: October 22, 2020Publication date: April 29, 2021Applicant: Lumileds LLCInventors: Grigoriy BASIN, Kentaro SHIMIZU, Brendan MORAN, Emma DOHNER, Noad SHAPIRO, Marcel BOHMER
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Publication number: 20210111315Abstract: A phosphor carrier assembly includes a substrate, a thermal or UV activated release adhesive, a layer containing a pixelated phosphor array, and a partially cured or highly viscous adhesive. The phosphor pixels on the carrier are typically all of the same color. In formation of a phosphor converted LED array the phosphor pixels on the carrier assembly are aligned with and placed in contact with corresponding LED pixels in an array of pixelated LED dice. Selected phosphor pixels on the carrier assembly may then be attached to corresponding LED pixels, and released from the substrate, by powering (activating) the corresponding LED pixels to heat the selected phosphor pixel to a temperature that releases the thermal release adhesive and that cures or partially cures the adhesive on the selected phosphor pixels in contact with the corresponding LED pixels.Type: ApplicationFiled: October 15, 2019Publication date: April 15, 2021Applicant: Lumileds LLCInventors: Emma DOHNER, Kentaro SHIMIZU, Hisashi MASUI
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Patent number: 10910433Abstract: The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.Type: GrantFiled: March 19, 2019Date of Patent: February 2, 2021Assignee: Lumileds LLCInventors: Hisashi Masui, Ken Shimizu, Emma Dohner
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Patent number: 10903266Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.Type: GrantFiled: March 19, 2019Date of Patent: January 26, 2021Assignee: Lumileds LLCInventors: Hisashi Masui, Ken Shimizu, Emma Dohner
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Publication number: 20200303450Abstract: The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.Type: ApplicationFiled: June 5, 2020Publication date: September 24, 2020Inventors: Hisashi MASUI, Ken SHIMIZU, Emma DOHNER
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Publication number: 20200212101Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.Type: ApplicationFiled: March 19, 2019Publication date: July 2, 2020Inventors: Hisashi MASUI, Ken SHIMIZU, Emma DOHNER
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Publication number: 20200212100Abstract: The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.Type: ApplicationFiled: March 19, 2019Publication date: July 2, 2020Inventors: Hisashi MASUI, Ken SHIMIZU, Emma DOHNER
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Publication number: 20200203579Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.Type: ApplicationFiled: December 16, 2019Publication date: June 25, 2020Applicant: Lumileds Holding B.V.Inventors: Daniel Bernardo ROITMAN, Emma DOHNER, Kentaro SHIMIZU, Marcel Rene BOHMER