Abstract: A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.

Abstract: A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.

Abstract: A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another cross-sectional area located underneath along its vertical thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant.

Abstract: A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating pattern is formed on the conductive layer. The insulating pattern exposes a portion of the conductive layer. A supporting board is provided. Next, the insulating pattern is detachably fixed in the supporting board. After the insulating pattern is detachably fixed in the supporting board, the holding substrate is removed, and the conductive layer remains. After removing the holding substrate, the conductive layer is patterned to form a wiring layer.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another cross-sectional area located underneath along its vertical thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant.

Abstract: A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another located underneath along its thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant. The method further includes removing the metal plate after forming the encapsulant so as to prevent the encapsulant from overflowing onto the bottom surfaces of the bump solder pads.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating pattern is formed on the conductive layer. The insulating pattern exposes a portion of the conductive layer. A supporting board is provided. Next, the insulating pattern is detachably connected to the supporting board. After the insulating pattern is detachably connected to the supporting board, the holding substrate is removed, and the conductive layer remains. After removing the holding substrate, the conductive layer is patterned to form a wiring layer.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the holding substrate. Next, an insulating pattern is formed on the conductive layer. The insulating pattern exposes a portion of the conductive layer. A supporting board is provided. Next, the insulating pattern is detachably fixed in the supporting board. After the insulating pattern is detachably fixed in the supporting board, the holding substrate is removed, and the conductive layer remains. After removing the holding substrate, the conductive layer is patterned to form a wiring layer.

Abstract: An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.

Abstract: The invention is directed to a method of storing videos for a portable device having a buffer memory space and a storage device The method comprises recording a plurality of video frames and storing the video frames into the buffer memory space of the portable device and detecting an event. According to the event, a portion of the video frames recorded from a first predetermined time before the event is detected until the event is detected is restored into the storage device as a plurality of pre-event video frames and, meanwhile, a plurality of post-event video frames is continuously recorded for a second predetermined time after the event is detected and the post-event video frames are stored into the storage device, wherein the storage device is coupled to the portable device.

Abstract: A secure type storage device applies to data link with a mainframe, wherein the memory module thereof includes hidden and open storage spaces, for storing encrypted data and a file allocation table, respectively; the file allocation table registering storage location and property of the encrypted data accepts external queries, but the encrypted data does not be accessed through direct link; the secure type storage device and management software of the mainframe jointly implement the authentication process, respond the requirement issued by the mainframe after the read/write authorization is produced, access the hidden storage space, and decrypt and output the encrypted data to the mainframe, or receive and encrypt external information to store in the hidden storage space; thus, through the secure type storage device, the storage details is free checked, but the information does not be accessed arbitrarily, to prevent information from being arbitrarily modified or copied and spread.

Abstract: A multi-interface memory card includes a memory card shell, and a first memory card module and a second memory card module installed within the shell, in which the first memory card module and the second memory card module respectively have a first module interface and a second module interface, matching the same standard memory card specification and exposing to the shell surface; the read/write device of the multi-interface memory card has a slot and a mainframe interface for being plugged by the multi-interface memory card; the read/write device includes a first connector and a second connector exposing to the inside surface of the slot to connect with the first module interface and the second module interface of the multi-interface memory card, respectively, and the multi-interface memory card is transferred to the mainframe through the mainframe interface, to form a read/write system implementing data access to the multi-interface memory card.

Abstract: A composite memory card has 4-bit and 1-bit data transfer modes; in which, when the composite memory card plugs in a general reader, it operates in the 4-bit data transfer mode to form 4-bit format information signal linking with the external transfer through four data pins; and when it plugs in a dedicated reader, it operates in the 1-bit data transfer mode to form 1-bit format data signal linking with the external transfer through one data pin, while it starts the internal audio processing module to read the internal audio file streaming and to transform into voice output signal output to the dedicated reader through the other data pins for broadcast, and to receive the voice input signal of the dedicated reader through data pins to transform into audio file streaming to import for storage; thus, the composite memory card combines the standard memory card and the audio processing function.

Abstract: A memory device having wireless recognition function provided inside a portable electronic apparatus includes a semiconductor package having a substrate, a semiconductor chip disposed on the substrate, an antenna disposed on the substrate and electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip; and a magnetic member coupled to the encapsulant and spaced apart from the substrate by a pre-determined distance, in a manner that a projection area of the magnetic member on the substrate covers an area disposed with the antenna, thereby guiding electromagnetic waves emitted from the antenna in specific directions so as to enhance magnetic forces in the specific directions and enable the magnetic forces to penetrate a thicker casing in order to achieve a sensing chip having a sensing function, hence a mobile phone has an access card function.

Abstract: A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another located underneath along its thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant. The method further includes removing the metal plate after forming the encapsulant so as to prevent the encapsulant from overflowing onto the bottom surfaces of the bump solder pads.

Abstract: A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active surface of the sensor chip facing upward; forming a patterned conductive colloid on the sensor chip, wherein the patterned conductive colloid extends from the periphery of the active surface of the sensor chip along the side wall of the sensor and electrically connects with the circuit layer of the substrate; forming a non-conductive film to cover the sensor chip, the patterned conductive colloid and a portion of the substrate; and forming a conductive film on the non-conductive film. The patterned conductive colloid replaces the conventional bond wires to improve the product yield and to omit the molding process. The conductive film is electrically connected with the grounding point/area on the substrate to dissipate the static charges for protecting the chip.

Abstract: A pet tracking system includes a pet positioning device and a pet monitoring device. The pet positioning device is worn on a pet and includes a positioning unit which is configured for detecting a position of the pet. And, the pet positioning device builds a direct wireless communication to the pet monitoring device by a wireless communication unit to send back the position of the pet. Therefore, the pet monitoring device is able to acquire the position of the pet without a mobile communication provided by a telecommunication proprietor. In preferred embodiment, the pet monitoring device can provide a warning signal to remind pet owners to pay attention to the pet while the pet is out of a predetermined range.