Abstract: A memory package structure includes: a substrate having a first surface and a second surface, a first memory chip arranged on a chip-bearing area of the first surface and electrically connected with the substrate, an opening formed within a chip-bearing area of the substrate, a control chip arranged on the first memory chip within the opening and electrically connected with the substrate, at least a passive component arranged on the substrate, and a molding component covering the substrate, the first memory chip, the control chip and the passive component but exposing a portion of the second surface.

Abstract: The present invention discloses a memory card, a memory card connector and combination thereof. The memory card connector includes a shell body; a plurality of internal conductive points arranged in the shell body; a plurality of external conductive points arranged at the outside of the shell body; and a plurality of wires for electrically connecting those internal conductive points and those external conductive points. Wherein, a notch is arranged at the shell body for containing a first memory card and a plurality conductive pad of the first memory card to be electrically connected with those internal conductive points in the shell body. The memory device combining the first memory card and the memory card connector has an appearance of a second memory card so as the present invention can utilize the memory card connector to transfer the first memory card into the second memory card for accessing data.

Abstract: A stack structure of the semiconductor packages and the manufacturing method thereof are disclosed herein. The packages of the present invention utilize plural stackable plug-receivers, which are similar to connectors, to stack and electrically connect with each other. The stack height of the stacked packages can be effectively reduced by utilizing the protrusion of a plug-receiver of one package to match with the concavity of a plug-receiver of another package at the corresponding position. Meanwhile, utilizing the stackable plug-receiver to replace the conventional soldering method can improve the warpage problem, and so as to promote the product reliability.

Abstract: A forming method of Micro SD card (Micro Secure Digital Memory card) is provided. The plurality of Micro SD card module substrates is located on the substrate and connecting every adjacent module substrates with the plurality of connecting bars. After placing the chip to the proper location and molding the whole module. In order to polish the Micro SD card from rough surface to smooth and clear the plurality of bumps that caused by the punch step, utilizing the plurality of steps, such as punch, grind and chamfer to achieve the goal to smooth the Micro SD surface and reduce the cost.

Abstract: A package method for a flash memory card and structure thereof is disclosed. A plurality of independent memory card module substrates are arranged on the substrate and those memory card module substrates are suspended and connecting with the substrate by a plurality of connecting bars. Chips are arranging on those memory card module substrates and the molding compound is utilizing to respectively cover chips, those memory card module substrates, wherein the molding compound is formed as a chamfered standard profile by performing a molding process with a upper molding substrate and a support substrate. Then punch, and grind the plurality of rugged bumps of those connecting bars to gain good cutting surface of the product and lower the cost.