Abstract: Methods and systems may provide for 3D volumetric displays. Such 3D volumetric displays may include a transparent enclosed volume holding a gas as a stationary gain medium. A scanning mirror may direct a light beam from a light source. A voxel projector may receive the light beam from the scanning mirror and may project an expanded beam into a volume of the stationary gain medium. Changes in the X and Y orientation between the light beam from the scanning mirror and the voxel projector results in relatively larger changes in the X and Y dimension of the expanded beam that is projected into the volume of the stationary gain medium to produce a 3D image.

Abstract: A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

Abstract: An electronics assembly includes a cooling chip structure having a target layer and a jet impingement layer coupled to the target layer. The jet impingement layer has one or more jet channels disposed within the jet impingement layer. Further, one or more through substrate vias are disposed within the jet impingement layer, where the one or more through substrate vias are electrically conductive and are electrically coupled to the target layer. A fluid inlet port and a fluid outlet port are fluidly coupled to the one or more jet channels of the jet impingement layer.

Abstract: A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.

Abstract: Electronics assemblies incorporating three-dimensional heat flow structures are disclosed herein. In one embodiment, an electronics assembly includes a substrate having a surface defining a plane, a heat generating component coupled to the surface of the substrate, a cooling device positioned outside of the plane defined by the surface of the substrate, and a three-dimensional heat flow structure. The three-dimensional heat flow structure includes a first portion thermally coupled to the heat generating component and a second portion extending from the first portion. At least a portion of the first portion is parallel to the plane defined by the substrate. The second portion is transverse to the plane defined by the surface of the substrate. The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.

Abstract: An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.

Abstract: Electronics assemblies incorporating three-dimensional heat flow structures are disclosed herein. In one embodiment, an electronics assembly includes a substrate having a surface defining a plane, a heat generating component coupled to the surface of the substrate, a cooling device positioned outside of the plane defined by the surface of the substrate, and a three-dimensional heat flow structure. The three-dimensional heat flow structure includes a first portion thermally coupled to the heat generating component and a second portion extending from the first portion. At least a portion of the first portion is parallel to the plane defined by the substrate. The second portion is transverse to the plane defined by the surface of the substrate. The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.

Abstract: An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.

Abstract: An electronics assembly includes a cooling chip structure having a target layer and a jet impingement layer coupled to the target layer. The jet impingement layer has one or more jet channels disposed within the jet impingement layer. Further, one or more through substrate vias are disposed within the jet impingement layer, where the one or more through substrate vias are electrically conductive and are electrically coupled to the target layer. A fluid inlet port and a fluid outlet port are fluidly coupled to the one or more jet channels of the jet impingement layer.