Abstract: A thermal stress compensation layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity disposed between a pair of bonding layers. The thermal stress compensation layer has a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the MIO layer can be transient liquid phase bonded between a metal substrate and a semiconductor device. The pair of bonding layers may comprise a first pair of bonding layers and a second pair of bonding layers with the first pair of bonding layers disposed between the MIO layer and the second pair of bonding layers. The first pair of bonding layers may have a melting point above the TLP sintering temperature and the second pair of bonding layers may have a melting point below the TLP sintering temperature.

Abstract: A power electronics assembly that includes a first cooling chip fluidly coupled to a second cooling chip. The first cooling chip and the second cooling chip each include a cooling chip fluid inlet, a cooling chip fluid outlet, and one or more cooling chip fluid channels extending between and fluidly coupled to the cooling chip fluid inlet and the cooling chip fluid outlet. The power electronics assembly also includes a semiconductor device positioned between and thermally coupled to the first cooling chip and the second cooling chip and a thermo-electric generator positioned between and thermally coupled to the semiconductor device and one of the first cooling chip or the second cooling chip.

Abstract: System, methods, and other embodiments described herein relate to directing thermal energy within a photonic device. In one embodiment, the photonic device includes an optical component that is temperature sensitive and that provides a different response to light propagated within the optical component according to a present temperature of the optical component. The photonic device includes a heat source disposed at a separating distance from the optical component and that produces thermal energy within the photonic device. The photonic device includes a first thermal guide disposed proximate to the optical component and the heat source and spanning the separating distance. The first thermal guide concentrating the thermal energy from the heat source to the optical component.

Abstract: Thermal energy guiding systems and methods for fabricating thermal energy guiding systems are provided. A thermal energy guiding system includes a thermal energy source and an anisotropic thermal guiding coating in thermal communication with a surface of the thermal energy source. The anisotropic thermal guiding coating includes a plurality of layers including a first layer and a second layer. The first layer has a first thermal conductivity and the second layer has a second thermal conductivity. The plurality of layers are non-uniformly arranged on the surface of the thermal energy source in order to guide thermal energy from the thermal energy source according to a thermal energy management objective.

Abstract: Electronic assemblies for thermoelectric generation are disclosed. In one embodiment, an electronic assembly includes a substrate having a first surface and a second surface, and a conductive plane and a plurality of thermal guide traces position on the first surface of the substrate. The conductive plane includes a plurality of arms radially extending from a central region. The plurality of thermal guide traces surrounds the conductive plane, and is shaped and positioned to guide heat flux present on or within the substrate toward the central region of the conductive plane. The electronic assembly may also include a thermoelectric generator device thermally coupled to the central region of the conductive plane, and a plurality of heat generating devices coupled to the second surface of the substrate.

Abstract: A triboelectric generator includes a resiliently-deformable hexagonal housing including a first housing wall and a second housing wall positioned opposite the first housing wall. A first electrode resides along the first housing wall, and a second electrode resides along the second housing wall. A dielectric contact layer is positioned in intimate contact with the first electrode and between the first electrode and the second electrode. The dielectric contact layer is spaced apart from the second housing wall. The first housing wall is coupled to the second housing wall such that at least one of the first housing wall and the second housing wall is resiliently movable toward the other one of the first housing wall and the second housing wall so as to enable contact between the dielectric contact layer and the second electrode during operation of the triboelectric generator.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

Abstract: A wireless in-wheel electric motor assembly having a wheel, an electric motor disposed within the wheel, the electric motor including a stator and a rotor, a receiving coil disposed within the wheel and operable to receive wirelessly transmitted energy, a first converter disposed within the wheel, electrically coupled to the receiving coil and operable to convert the wirelessly transmitted energy from the receiving coil into direct current, an inverter circuit disposed within the wheel, electrically coupled to the conversion circuit and the electric motor, and operable to power the electric motor. The wireless in-wheel electric motor assembly further includes a cooling system disposed within the wheel that includes a micro pump operable to pump coolant, a fluid line operable to pass the coolant proximate at least one of the conversion circuit and the inverter circuit, and a heat exchanger operable to receive heated coolant and dissipate heat to the environment.

Abstract: A power electronics assembly includes a semiconductor device, a metal substrate, and a cooling structure. The metal substrate includes a plurality of stress-relief features that extend at least partially through a thickness of the metal substrate. The plurality of stress-relief features are at least partially filled with a transient liquid phase (TLP) bonding material. The semiconductor device is positioned over the plurality of stress-relief features and thermally bonded to the metal substrate via TLP bonding material. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A system for rapidly heating a vehicle engine when the engine is below a pre-determined temperature allows for improved fuel efficiency after a vehicle cold-start. The system includes an organic Rankine cycle (ORC) loop having a two-phase ORC fluid traveling circuitously through a conduit. The ORC fluid is vaporized by a power electronics cooling device and by an evaporator in thermal communication with exhaust waste heat. The vaporized ORC fluid is passed through an expander to generate electrical power. When the vehicle engine is below the pre-determined temperature, heat from the vaporized ORC fluid is transferred directly or indirectly to the engine. When the vehicle engine is at or above the pre-determined temperature, heat from the vaporized ORC fluid is instead transferred to an alternate heat sink.

Abstract: A power electronics assembly includes a semiconductor device, a metal substrate, and a cooling structure. The metal substrate includes a plurality of stress-relief features that extend at least partially through a thickness of the metal substrate. The plurality of stress-relief features are at least partially filled with a transient liquid phase (TLP) bonding material. The semiconductor device is positioned over the plurality of stress-relief features and thermally bonded to the metal substrate via TLP bonding material. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A hybrid vehicle including one or more in-wheel motors, a power electronics supplying power to the one or more in-wheel motors, and a Rankine cycle system is described. The Rankine cycle system includes a pump driving a working fluid through the Rankine cycle system, a heat exchanger receiving the working fluid from to the pump and connected to the power electronics to cool the power electronics, an evaporator heating the working fluid received from the heat exchanger utilizing heat from an exhaust gas from an engine, an expander receiving the working fluid from the evaporator, and a radiator cooling the working fluid received from the expander.

Abstract: A method for fabricating a multi-layer porous wick structure including, providing a first mold set comprising a negative mold and a positive mold, introducing metal particles in the negative mold defining a first porous wick layer, and sintering the metal particles within the negative mold while interfaced with the positive mold to form the first porous wick layer. The method further includes providing a second mold set comprising a negative mold and a positive mold corresponding to the negative mold and assembling the first porous wick layer with the negative mold of the second mold set. The method further includes introducing filler particles into the negative mold of the second mold set to form a sacrificial layer with the first porous wick layer, introducing metal particles in the negative mold of the second mold set with the first porous wick layer and the sacrificial layer and sintering the metal particles, thereby forming the multi-layer porous wick structure.

Abstract: The electric vehicle including one or more in-wheel motors, a battery electrically coupled to one or more in-wheel motors, a power electronics including a DC-AC inverter, a AC-DC inverter, and a boost converter that receives DC power from the battery and supplies AC power to the one or more in-wheel motors, and a generator electrically coupled to the battery via the power electronics. Further, it includes a Rankine cycle system including a pump, a first valve having an input, a first output, and a second output connected to the pump, the generator, and the one or more in-wheel motors, respectively. A second valve having a first input connects to the generator, a second input connects the one or more in-wheel motors and an output delivers the working fluid to the power electronics. An expander receives the working fluid from at least one of the power electronics.

Abstract: A hybrid vehicle including one or more in-wheel motors, a power electronics supplying power to the one or more in-wheel motors, and a Rankine cycle system is described. The Rankine cycle system includes a pump driving a working fluid, a first three-way valve having an input, a first output, and a second output. The Rankine cycle system also includes, a second three-way valve having a first input, a second input, and an output, an evaporator receiving the working fluid from the output of the second three-way valve and heating the working fluid utilizing heat from an exhaust gas from an engine, an expander receiving the working fluid from the evaporator, and a radiator cooling the working fluid received from the expander.

Abstract: An inductor includes a magnetic core composed of a magnetic material having variable permeability characteristics based on at least one of design parameters or operational parameters of the inductor that includes one or more air gaps. A coil is wound through the one or more air gaps and is configured to be excited by an electric current.

Abstract: An elastomeric triboelectric generator housing structured for incorporation into a wheel for a vehicle is provided. The housing includes a least one cavity having a pair of opposed walls, and a triboelectric generator incorporated into the at least one cavity. The at least one cavity is structured to actuate responsive to application of at least one force to the housing along an axis extending through the at least one cavity and between a central axis of the housing and a circumference of the housing.

Abstract: Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate. The plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount and a temperature sensitive component mount in electrical continuity with the heat generating component mount, where a shielding path projection extends from the heat generating component mount towards the temperature sensitive component mount, and at least one of the thermal conductor traces is transverse to the shielding path projection between the heat generating component mount and the temperature sensitive component mount to steer heat flux away from the temperature sensitive component mount.

Abstract: A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Abstract: A facility can include a main power source. One or more facility systems can be operatively connected to the main power source. The facility can include a plurality of sensors. The plurality of sensors can be configured to acquire facility data. A plurality of energy harvesters can be operatively connected to the plurality of sensors. The plurality of energy harvesters can be configured to convert energy received in one form into another form of energy. The plurality of energy harvesters can be operatively connected to supply energy to the plurality of sensors. The plurality of sensors can be exclusively powered by energy supplied by the plurality of energy harvesters. Thus, the plurality of sensors are decoupled from the main power source. The facility can be a fixed facility or a mobile facility. The facility can be used for disaster relief or other applications.