Abstract: The present invention relates to a method of fabricating a microstructure having an inside cavity comprising the steps of:

Abstract: A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.

Abstract: The present invention provides a planar antenna having a first, outer planar conductive element and a second planar conductive element located in a hole in the outer element. At least 75% of the boundary between the hole and the first outer planar conductive element is a continuous concave smooth curve. The second planar conductive element is substantially coplanar with and surrounded by the first outer planar conductive element. At least 75% of the outer boundary of the second planar conductive element is a continuously convex smooth curve.

Abstract: A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Abstract: A polymer stud grid array for microwave circuits is proposed which includes an injection-molded, three-dimensional substrate that is fabricated from an electrically insulating polymer. The substrate includes a plurality of polymer studs which are arranged over the underside of the substrate and which are integrally formed with the substrate during the injection-molding process. Signal connections are formed on the studs which include an end surface that is capable of being soldered. Potential connections are formed on at least one of the studs. The potential connection also includes an end surface that is capable of being soldered. Striplines are also constructed which connect the studs to the microwave circuit. Each stripline includes a first structured metal layer disposed on the underside of the substrate, a dielectric layer disposed on the first metal layer and a second structured metal layer disposed on top of the dielectric layer.

Abstract: The present invention may provide a particle detector or imager which may be used for accurate recording of medical (2-D) X-ray images. The imager includes at least one detector panel. The detector panel includes a microgap detector with an array of pixel electrodes of a novel form. Each pixel electrode is insulated from a planar cathode by means of an insulating layer. Each pixel electrode is connected to an underlying contact by means of a via hole in the insulating layer. The insulating layer is preferable conformal with the electrodes. The underlying contact is connected to an electronic measuring element which preferably lies underneath the electrode and is about the same size as the electrode. The measuring element may be a storage device, a digital counter or similar. A switching transistor is connected to the measuring device. The switching transistor may be a thin film transistor. Alternatively, both measuring element and transistor may be formed in a single crystal semiconductor, e.g.

Abstract: In order to achieve better dissipation of the heat losses, a polymer stud grid array in proposed havingan injection-molded, three-dimensional substrate (S) composed of an electrically insulating polymer,polymer studs (PS) which are arranged over the area on the underneath of the substrate (S) and are integrally formed during injection molding,external connections which are formed on the polymer studs (PS) by an end surface which can be soldered,conductor runs which are formed at least on the underneath of the substrate (S) and connect the external connections to internal connections,at least one heat sink (WL) which is partially coated during the injection molding of the substrate (S), and havingat least one chip or wiring element (VE) which is arranged on the heat sink (WL) and whose connections are electrically conductively connected to the internal connections.The new configuration is suitable in particular for power components or power modules in a polymer stud grid array package.

Abstract: A method for evaluating the thermal impedance of packaged semiconductor chips. A measuring apparatus includes a thermostatic bath filled with a dielectric liquid and a temperature sensor for measuring the temperature of the bath. The semiconductor chip is subjected to a calibration step followed by a thermal response measurement step. Increasing the power pulse length allows measurement of the steady-state junction-to-case thermal resistance. The measuring apparatus and method is further used for tracing in-situ degradation of packaged semiconductor chips due to power cycling.

Abstract: A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Abstract: A system for evaluating the thermal impedance of packaged semiconductor chips. The measuring apparatus includes a thermostatic bath filled with a dielectric liquid and a temperature sensor for measuring the temperature of the bath. The semiconductor chip is subjected to a calibration step followed by a thermal response measurement step. Increasing the power pulse length allows measurement of the steady-state junction-to-case thermal resistance. The measuring apparatus and method is further used for tracing in-situ degradation of packaged semiconductor chips due to power cycling.

Abstract: A microgap sensor, and manufacturing method therefor, which includes a cathode and at least one strip anode parallel to the cathode, in which the strip anode is separated and insulated from the cathode by an insulation layer made from a polymeric material. The microgap sensor further includes a cathodic drift electrode substantially parallel to the cathode, the cathode and drift electrode being separated by a gap fillable with an ionizable gas. The gap is considerably greater than the thickness of the insulating layer, and the strip anode is located in the gap between the cathode and the drift electrode.

Abstract: A millimeter or microwave oscillator device for a receiver or a transmitter is described. The oscillator device including a high frequency oscillating circuit including an active device 41; said active device 41 having a first and a second contact 56, 52, a signal line 49 of said oscillator device 41 being connected to said first contact 56 for connection to a load circuit 43; a biasing circuit 47 for said active device; and a low frequency oscillation suppression circuit; wherein said low frequency oscillation suppression circuit includes a decoupling capacitor 45 and one electrode of said decoupling capacitor 45 is connected to said second contact 52. A manufacturing method for the oscillator device is also disclosed.