Patents by Inventor Eric Englhardt
Eric Englhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071796Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.Type: ApplicationFiled: September 7, 2023Publication date: February 29, 2024Inventors: Alex Berger, Jeffrey Hudgens, Eric Englhardt
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Patent number: 11784074Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.Type: GrantFiled: July 8, 2021Date of Patent: October 10, 2023Assignee: Applied Materials, Inc.Inventors: Alex Berger, Jeffrey Hudgens, Eric Englhardt
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Patent number: 11527424Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.Type: GrantFiled: March 20, 2020Date of Patent: December 13, 2022Assignee: Applied Materials, Inc.Inventors: Alex Berger, Jeffrey Hudgens, Eric Englhardt
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Publication number: 20210358788Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.Type: ApplicationFiled: July 8, 2021Publication date: November 18, 2021Inventors: Alex Berger, Jeffrey Hudgens, Eric Englhardt
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Publication number: 20210296150Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.Type: ApplicationFiled: March 20, 2020Publication date: September 23, 2021Inventors: Alex Berger, Jeffrey Hudgens, Eric Englhardt
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Publication number: 20150098773Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: APPLIED MATERIALS, INC.Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk VAN KATWYK, Van HOSKINS, Vinay SHAH
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Patent number: 8911193Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: GrantFiled: November 28, 2011Date of Patent: December 16, 2014Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 8689812Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.Type: GrantFiled: September 6, 2012Date of Patent: April 8, 2014Assignee: Applied Materials, Inc.Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin R. Elliott
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Patent number: 8601975Abstract: In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.Type: GrantFiled: November 2, 2011Date of Patent: December 10, 2013Assignee: Applied Materials, Inc.Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin R. Elliott
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Publication number: 20120325328Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.Type: ApplicationFiled: September 6, 2012Publication date: December 27, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin Elliott
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Patent number: 8204617Abstract: Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.Type: GrantFiled: August 14, 2007Date of Patent: June 19, 2012Assignee: Applied Materials, Inc.Inventors: Michael Teferra, Amitabh Puri, Eric Englhardt
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Publication number: 20120141237Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: November 28, 2011Publication date: June 7, 2012Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk Van KATWYK, Van HOSKINS, Vinay SHAH
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Publication number: 20120060971Abstract: In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.Type: ApplicationFiled: November 2, 2011Publication date: March 15, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin R. Elliott
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Patent number: 8074597Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.Type: GrantFiled: January 11, 2007Date of Patent: December 13, 2011Assignee: Applied Materials, Inc.Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin Elliott
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Patent number: 8066466Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: GrantFiled: July 20, 2010Date of Patent: November 29, 2011Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20100280654Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: ApplicationFiled: July 20, 2010Publication date: November 4, 2010Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7798764Abstract: A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.Type: GrantFiled: October 27, 2006Date of Patent: September 21, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7720557Abstract: Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.Type: GrantFiled: January 27, 2006Date of Patent: May 18, 2010Assignee: Applied Materials, Inc.Inventors: Michael Teferra, Amitabh Puri, Eric Englhardt
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Patent number: 7651306Abstract: Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.Type: GrantFiled: December 22, 2005Date of Patent: January 26, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7374393Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks.Type: GrantFiled: April 5, 2006Date of Patent: May 20, 2008Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Mario David Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah