Abstract: Disclosed are wirebonding methods wherein bondwires are positioned using dynamically determined variations in die placement. Preferred methods of the invention include steps for placing a die on the prepared substrate using selected ideal placement coordinates. Deviation of the actual die placement from the selected ideal placement coordinates is monitored, and one ore more critical bondwires are wirebonded between respective die pins and pins on the substrate. The monitored placement deviation is used to dynamically position the critical bondwires on the critical pins according to actual die placement. Disclosed embodiments include methods using lateral deviation monitoring and angular deviation monitoring to dynamically position bondwires.

Abstract: A semiconductor circuit comprising a semiconductor die and a package substrate. In one embodiment, a first plurality of conductive bumps serves as a portion of a conductive path between contacts on the semiconductor die and contacts on the package substrate. A second plurality of conductive bumps serves as a portion of a conductive path between other contacts on the die and contacts on the package substrate. Each of the bumps in the first plurality of conductive bumps is larger than each of the bumps in the second plurality of conductive bumps. In another embodiment, the average size of the first plurality of conductive bumps may be at least 20% larger (or greater) than the average size of the second plurality of bumps.

Abstract: An electro-optic display comprises first and second substrates, and an adhesive layer and a layer of electro-optic material disposed between these substrates, the adhesive layer comprising a mixture of a polymeric adhesive material and an additive selected from a salt, a polyelectrolyte, a polymer electrolyte, a solid electrolyte, a conductive metal powder, a ferrofluid, a non-reactive solvent, a conductive organic compound, and combinations thereof. The additive enables the volume resistivity of the adhesive layer to be controlled. Also, in an encapsulated electrophoretic medium comprising capsules in a polymeric binder, the volume resistivity of the binder can be controlled in a similar manner.

Abstract: In high-speed semiconductor packaging, differential pair transmission lines 605 are used to receive incoming signals carried using differential signaling. Common mode noise can decrease the frequency at which these signals are clocked. The use of slots 620 formed in the ground (or power plane) 609 of the substrate and lying perpendicularly (and equally spaced) underneath the differential pair 605 improves the common mode rejection of the differential pair 605 by increasing the common mode impedance without affecting the differential mode impedance. The use of slots 620 does not require modifications to the packaging, and only minor modifications to the substrate.

Abstract: In high-speed semiconductor packaging, differential pair transmission lines 605 are used to receive incoming signals carried using differential signaling. Common mode noise can decrease the frequency at which these signals are clocked. The use of slots 620 formed in the ground (or power plane) 609 of the substrate and lying perpendicularly (and equally spaced) underneath the differential pair 605 improves the common mode rejection of the differential pair 605 by increasing the common mode impedance without affecting the differential mode impedance. The use of slots 620 does not require modifications to the packaging, and only minor modifications to the substrate.

Abstract: Improved ink jet paper coatings which impart high optical density images and excellent water resistance to paper and a process for making an improved ink jet recording paper. The coating formulation comprises an inorganic pigment, preferably silica, and an amine modified poly(vinyl alcohol) composition in which the poly(vinyl alcohol) is graft polymerized with an ethylenically unsaturated monomers containing primary, secondary, tertiary, or quaternary amine functionality.

Abstract: A family of piperidone functionalized polymers based on polymers containing a plurality of hydroxyl groups. Piperidone or piperidone derivatives form a cyclic ketal linkage with hydroxyl groups contained on adjacent or alternating carbon atoms of the base polymer. Preferred compositions are piperidone functionalized poly(vinyl alcohol) having the following general formulae: ##STR1## wherein R.sub.1 through R.sub.6 are each independently hydrogen, methyl, or a C.sub.2 to C.sub.4 saturated or unsaturated alkyl groups, R.sub.7 is O.cndot. or OR.sub.8, wherein R.sub.8 is hydrogen or a C.sub.1 to C.sub.4 alkyl or C(.dbd.O)alkyl group; X.sup.- is a salt; x ranges from 50 to 99 mol %; y ranges from 0 to 30 mol %; and z ranges from 1 to 20 mol %. The compounds are useful in ink jet paper coating applications.

Abstract: Isolated nucleic acids encoding a human serine protease PSP1, protein obtainable from the nucleic acids, recombinant host cells transformed with the nucleic acids, oligonucleotides and primer pairs specific for PSP1 polymorphisms and use of the protein and nucleic acid sequences are disclosed.

Abstract: Plasma etching apparatus for use in the manufacture of integrated circuit devices utilizes a one-piece director at an input of a process chamber that includes a sleeve portion and a bell jar portion. The director directs incoming process gas in the sleeve portion radially before the gas flows past electrodes used to establish a radio frequency discharge that ionizes the process gas. The one-piece director is clamped between the cap and the sleeve portion of the process chamber to eliminate the need for screws.

Abstract: A plasma discharge electrode having a front surface with a central portion thereof including outlets for discharging reactant gas which forms a plasma and a peripheral portion substantially surrounding the outlets. The peripheral portion has at least one recess for locally enhancing a density of the plasma formed by the electrode. The recess can be formed in a replaceable insert and the electrode can be made from a single crystal of silicon.

Abstract: A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

Abstract: A distinctive cultivar of Scaevola plant named `Outback Mini Pink Fan`, characterized by its mounded spreading habit; rapid growth rate; freely branching habit; numerous flowers per lateral branch; and light pink flowers.