Patents by Inventor Eric Hsieh

Eric Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160331282
    Abstract: Systems and methods for assessing fluids from a patient are disclosed. The system includes a receptacle including an inlet port, an outlet port, and a third port; a valve system in fluidic communication with the receptacle; and one or more features in the receptacle to aid in optical imaging of fluids. The system has a fill mode and a flush mode. In the fill mode, the valve system directs suction from a vacuum source through the third port into the receptacle, thereby drawing fluid through the inlet port into the receptacle. In the flush mode, the valve system directs suction from the vacuum source through the outlet port, thereby drawing fluid through the outlet port out of the receptacle. Fluid-related information such as, for example, concentration of a blood component, may be estimated based on images of fluids in the receptacle.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 17, 2016
    Inventors: Siddarth SATISH, Peter HYOUNG, Kevin MILLER, Andrew HOSFORD, Eric HSIEH
  • Patent number: 9276890
    Abstract: A system and method for providing notifications on a mobile computing device are disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: March 1, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Patent number: 9272302
    Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: March 1, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Frank Yu, Eric Hsieh, Kevin Jin
  • Patent number: 9270628
    Abstract: A system and method for providing notifications on a mobile computing device are disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: February 23, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Publication number: 20140237385
    Abstract: A system and method for providing notifications on a mobile computing device are disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Application
    Filed: April 29, 2014
    Publication date: August 21, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Publication number: 20140208336
    Abstract: A system and method for providing notifications on a mobile computing device are disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Application
    Filed: March 24, 2014
    Publication date: July 24, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Patent number: 8723823
    Abstract: A system and method for providing notifications on a mobile computing device is disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 13, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Patent number: 8668794
    Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: March 11, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Frank Yu, Eric Hsieh, Kevin Jin
  • Publication number: 20130298827
    Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.
    Type: Application
    Filed: July 19, 2013
    Publication date: November 14, 2013
    Applicant: Texas Instruments Incorporated
    Inventors: Frank Yu, Eric Hsieh, Kevin Jin
  • Patent number: 8546184
    Abstract: A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: October 1, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Chih-Chien Ho, Saihsi Jen, Eric Hsieh
  • Patent number: 8455989
    Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: June 4, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Chih-Chien Ho, Saihsi Jen, Eric Hsieh
  • Publication number: 20130001760
    Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
    Type: Application
    Filed: July 1, 2011
    Publication date: January 3, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: CHIH-CHIEN HO, SAIHSI JEN, ERIC HSIEH
  • Publication number: 20120204191
    Abstract: A system and method for providing notifications on a mobile computing device is disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.
    Type: Application
    Filed: June 29, 2011
    Publication date: August 9, 2012
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Samuel Hoang, Eric Hsieh
  • Publication number: 20120204125
    Abstract: Embodiments disclosed herein describe a system and method for displaying content on a computing device. According to an embodiment, the content may be displayed on a touch sensitive display having a plurality of slidable panels. A first panel displays a list of record entries and a second panel that displays a record corresponding to a selected entry from the list of record entries in the first panel. In certain embodiments, the list of record entries in the first panel is scrollable.
    Type: Application
    Filed: June 29, 2011
    Publication date: August 9, 2012
    Inventors: Megan Shia, Le Chen, Eric Hsieh, Matthew McNulty, Esther Leong, Samuel Hoang
  • Publication number: 20120202300
    Abstract: A method for assembling integrated circuit (IC) devices includes dispensing a die attach adhesive onto a surface of a workpiece using a die bonding system, and placing an IC die on the die attach adhesive at surface of the workpiece to form an IC device. A pre-cure bond line thickness (pre-cure BLT) value is automatically optically measured for the die attach adhesive. The IC device is unloaded from the die bonding system after automatically optically measuring. The method can include comparing the pre-cure BLT value to a pre-cure BLT specification range, and if the pre-cure BLT value is outside the pre-cure BLT specification range, adjusting at least one die attach adhesive dispensing parameter based on the pre-cure BLT value for subsequent assembling. The adjusting can be automatic adjusting and the adjustment can be to the Z height parameter of the bond arm.
    Type: Application
    Filed: February 3, 2011
    Publication date: August 9, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Frank Yu, Eric Hsieh, Twu Ares, Wei-Lung Hsu
  • Publication number: 20120199285
    Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.
    Type: Application
    Filed: February 3, 2011
    Publication date: August 9, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Frank Yu, Eric Hsieh, Kevin Jin
  • Patent number: D685811
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: July 9, 2013
    Assignee: Palm, Inc.
    Inventors: Megan Shia, Le Chen, Eric Hsieh, Matthew McNulty, Esther Leong, Samuel Hoang
  • Patent number: D696284
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: December 24, 2013
    Assignee: Palm, Inc.
    Inventors: Megan Shia, Le Chen, Eric Hsieh, Matthew McNulty, Esther Leong, Samuel Hoang
  • Patent number: D699734
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: February 18, 2014
    Assignee: Palm, Inc.
    Inventors: Megan Shia, Le Chen, Eric Hsieh, Matthew McNulty, Esther Leong, Samuel Hoang
  • Patent number: D703219
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: April 22, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Megan Shia, Le Chen, Chadwyck Wirtz, Eric Hsieh