Abstract: A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.

Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.

Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.

Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.

Abstract: Embodiments disclosed herein describe a system and method for displaying content on a computing device. According to an embodiment, the content may be displayed on a touch sensitive display having a plurality of slidable panels. A first panel displays a list of record entries and a second panel that displays a record corresponding to a selected entry from the list of record entries in the first panel. In certain embodiments, the list of record entries in the first panel is scrollable.

Abstract: A system and method for providing notifications on a mobile computing device is disclosed. The method comprises enabling multiple applications that operate on the mobile computing device to generate notifications in response to event occurrences. A plurality of notification representations are presented in a notification bar on the display. The plurality of notification representations are individually generated by a corresponding application in response to an event occurrence. The plurality of notification representations are represented in a first portion of the notification bar and with a number that represents how many notification representations from an application have been generated and not dismissed by a user.

Abstract: A method for assembling integrated circuit (IC) devices includes dispensing a die attach adhesive onto a surface of a workpiece using a die bonding system, and placing an IC die on the die attach adhesive at surface of the workpiece to form an IC device. A pre-cure bond line thickness (pre-cure BLT) value is automatically optically measured for the die attach adhesive. The IC device is unloaded from the die bonding system after automatically optically measuring. The method can include comparing the pre-cure BLT value to a pre-cure BLT specification range, and if the pre-cure BLT value is outside the pre-cure BLT specification range, adjusting at least one die attach adhesive dispensing parameter based on the pre-cure BLT value for subsequent assembling. The adjusting can be automatic adjusting and the adjustment can be to the Z height parameter of the bond arm.

Abstract: A method and apparatus for dispensing a volume of die attach adhesive onto a surface can include an optical system which images the dispensed volume of die attach adhesive. A two-dimensional area covered by the die attach adhesive and a die attach dispense pressure can be used as a comparison with a reference value to determine whether the volume of die attach adhesive dispensed is sufficient. The reference value can take into account viscosity changes of the die attach adhesive, so that the volume of die attach adhesive dispensed during production can be determined. The volume dispensed can be automatically adjusted in situ during production using a computer system.

Abstract: Fluorenyl-containing metallocenes are disclosed along with methods for making the metallocenes. Also disclosed are methods for using the metallocenes as polymerization catalysts. In addition, polymers resulting from such polymerizations are disclosed.

Abstract: A novel loop/slurry olefin polymerization process is provided which produces ultra high molecular weight ethylene homopolymer.

Abstract: A novel loop/slurry olefin polymerization process is provided which produces ultra high molecular weight ethylene homopolymer.