Patents by Inventor Eric J. Smith

Eric J. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190260873
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for sending a forked media stream of an electronic communication between a customer and an agent to an analysis system for a duration. Receiving analysis results obtained from one or more analytics performed on the forked media stream. Then, determining whether to perform one or more operations in response to the analysis results.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Vijay Jayapalan, Greg Yarbrough, Eric J. Smith
  • Publication number: 20180303518
    Abstract: An orthopedic implant system is disclosed for use in correcting or reducing the progression of scoliosis. The orthopedic implant system can be inserted laterally or posteriorly and comprises an elongated flexible member secured to a user's spinal column via a plurality of vertebral body screws. Typically, the height of the elongated flexible member is significantly greater than the width, creating a flattened cross-sectional aspect. The vertebral body screws comprise a screw base and a screw head with a slot sized to accept an insert. Typically, the elongated flexible member is positioned within the slot via the insert, and is allowed to slide within the screw head as needed, as the user moves. However, at the apex of the user's scoliosis curve, the elongated flexible member is fixed within a vertebral body screw head.
    Type: Application
    Filed: April 24, 2018
    Publication date: October 25, 2018
    Inventor: Eric J. SMITH
  • Patent number: 9980752
    Abstract: An orthopedic implant system is disclosed for use in correcting or reducing the progression of scoliosis. The orthopedic implant system can be inserted laterally or posteriorly and comprises an elongated flexible member secured to a user's spinal column via a plurality of vertebral body screws. Typically, the height of the elongated flexible member is significantly greater than the width, creating a flattened cross-sectional aspect. The vertebral body screws comprise a screw base and a screw head with a slot sized to accept an insert. Typically, the elongated flexible member is positioned within the slot via the insert, and is allowed to slide within the screw head as needed, as the user moves. However, at the apex of the user's scoliosis curve, the elongated flexible member is fixed within a vertebral body screw head.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: May 29, 2018
    Inventor: Eric J. Smith
  • Publication number: 20180051492
    Abstract: Disclosed are vehicle door handle chassis, methods for making such chassis, and vehicle door assemblies with handle chassis. An example is a handle chassis for a motor vehicle door assembly. The door assembly includes a door panel, which has either a thin or a thick door panel construction. The handle chassis includes a chassis frame that secures to the door panel. The chassis frame has handle apertures for securing the door handle to the chassis. A mounting boss, which projects from the chassis frame, includes a distal end with a stepped region having high and low end faces each with a distinct height. The high end face presses against the inboard surface of a door panel having the thin construction. For a door panel having the thick construction, the low end face presses against the inboard surface while the first end face seats inside a hole in this door panel.
    Type: Application
    Filed: August 17, 2016
    Publication date: February 22, 2018
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventor: Eric J. Smith
  • Publication number: 20160287291
    Abstract: An orthopedic implant system is disclosed for use in correcting or reducing the progression of scoliosis. The orthopedic implant system can be inserted laterally or posteriorly and comprises an elongated flexible member secured to a user's spinal column via a plurality of vertebral body screws. Typically, the height of the elongated flexible member is significantly greater than the width, creating a flattened cross-sectional aspect. The vertebral body screws comprise a screw base and a screw head with a slot sized to accept an insert. Typically, the elongated flexible member is positioned within the slot via the insert, and is allowed to slide within the screw head as needed, as the user moves. However, at the apex of the user's scoliosis curve, the elongated flexible member is fixed within a vertebral body screw head.
    Type: Application
    Filed: April 6, 2015
    Publication date: October 6, 2016
    Inventor: Eric J. Smith
  • Patent number: 7597026
    Abstract: A cable assembly having a condensation drain provided for the conduit thereof, wherein moisture is enabled to escape the conduit through a drainage opening of the condensation drain, yet the operative interaction between the cable and the conduit of the cable assembly is unaffected by the presence of the condensation drain. The condensation drain may be provided with a drip initiator which assists removal of the moisture from the conduit.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 6, 2009
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Eric J. Smith, Jeffrey L. Konchan, Joseph P. Fannon, Darren M. Van Houzen
  • Publication number: 20090139365
    Abstract: A cable assembly having a condensation drain provided for the conduit thereof, wherein moisture is enabled to escape the conduit through a drainage opening of the condensation drain, yet the operative interaction between the cable and the conduit of the cable assembly is unaffected by the presence of the condensation drain. The condensation drain may be provided with a drip initiator which assists removal of the moisture from the conduit.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 4, 2009
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Eric J. Smith, Jeffrey L. Konchan, Joseph P. Fannon, Darren M. Van Houzen
  • Patent number: 7160795
    Abstract: A method of reducing parasitic capacitance in an integrated circuit having three or more metal levels is described. The method comprises forming a bond pad at least partially exposed at the top surface of the integrated circuit, forming a metal pad on the metal level below the bond pad and forming an underlying metal pad on each of the one or more lower metal levels. In the illustrated embodiments, the ratio of an area of at least one of the underlying metal pads to the area of the bond pad is less than 30%. Parasitic capacitance is thus greatly reduced and signal propagation speeds improved.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: January 9, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Shubneesh Batra, Michael D. Chaine, Brent Keeth, Salman Akram, Troy A. Manning, Brian Johnson, Chris G. Martin, Todd A. Merritt, Eric J. Smith
  • Patent number: 6909196
    Abstract: A method of reducing parasitic capacitance in an integrated circuit having three or more metal levels is described. The method comprises forming a bond pad at least partially exposed at the top surface of the integrated circuit, forming a metal pad on the metal level below the bond pad and forming an underlying metal pad on each of the one or more lower metal levels. In the illustrated embodiments, the ratio of an area of at least one of the underlying metal pads to the area of the bond pad is less than 30%. Parasitic capacitance is thus greatly reduced and signal propagation speeds improved.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: June 21, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Shubneesh Batra, Michael D. Chaine, Brent Keeth, Salman Akram, Troy A. Manning, Brian Johnson, Chris G. Martin, Todd A. Merritt, Eric J. Smith
  • Patent number: 6676196
    Abstract: A dual-pivot hinge assembly for an endgate of a vehicle includes a body bracket for connection to a vehicle body of the vehicle. The dual-pivot hinge assembly also includes an intermediate bracket pivotally connected to the body bracket and for operative connection to the endgate and having a dual pivot to allow the endgate to pivot to a first open position and a second open position and to a closed position relative to the vehicle body. The dual-pivot hinge assembly includes a roller rotatably connected to the intermediate bracket to interface with a torque rod having a first portion for connection to the endgate and a second portion extending from the first portion and cooperating with the roller to counterbalance a weight of the endgate.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: January 13, 2004
    Assignee: General Motors Corporation
    Inventor: Eric J Smith
  • Publication number: 20030235018
    Abstract: A method of reducing parasitic capacitance in an integrated circuit having three or more metal levels is described. The method comprises forming a bond pad at least partially exposed at the top surface of the integrated circuit, forming a metal pad on the metal level below the bond pad and forming an underlying metal pad on each of the one or more lower metal levels. In the illustrated embodiments, the ratio of an area of at least one of the underlying metal pads to the area of the bond pad is less than 30%. Parasitic capacitance is thus greatly reduced and signal propagation speeds improved.
    Type: Application
    Filed: November 12, 2002
    Publication date: December 25, 2003
    Inventors: Shubneesh Batra, Michael D. Chaine, Brent Keeth, Salman Akram, Troy A. Manning, Brian Johnson, Chris G. Martin, Todd A. Merritt, Eric J. Smith
  • Publication number: 20030234448
    Abstract: A method of reducing parasitic capacitance in an integrated circuit having three or more metal levels is described. The method comprises forming a bond pad at least partially exposed at the top surface of the integrated circuit, forming a metal pad on the metal level below the bond pad and forming an underlying metal pad on each of the one or more lower metal levels. In the illustrated embodiments, the ratio of an area of at least one of the underlying metal pads to the area of the bond pad is less than 30%. Parasitic capacitance is thus greatly reduced and signal propagation speeds improved.
    Type: Application
    Filed: June 21, 2002
    Publication date: December 25, 2003
    Inventors: Shubneesh Batra, Michael D. Chaine, Brent Keeth, Salman Akram, Troy A. Manning, Brian Johnson, Chris G. Martin, Todd A. Merritt, Eric J. Smith
  • Patent number: 6457392
    Abstract: A novel method and apparatus for producing an endless flexible seamed belt using a punch and die is disclosed. The punch and die have patterned edges in the form of a puzzle cut pattern with extremely small nodes and kerfs. The cutting tolerances of the patterned edges make it necessary to fix the punch with respect to the die so that there is no misalignment of the punch and die between cutting operations. This is accomplished by resiliently fixing the punch to the die, rather than having the punch attached to the force generating assembly as in normal punch and die assemblies. Belt material is positioned between a stock gap between the punch and die and the force generating assembly is activated to provide the cutting force. Once the belt material is cut, the cutting force is removed and the force generating assembly returns to its retracted position. There are two cutting edges on the punch and die so that a first end of one belt and a second end of another belt are formed in a single cutting operation.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: October 1, 2002
    Assignee: Xerox Corporation
    Inventors: Edward L. Schlueter, Jr., Laurence J. Lynd, Donald W. Owens, Eric J. Smith, Alex Skirko, David Watro
  • Patent number: 6311595
    Abstract: A novel method and apparatus for producing an endless flexible seamed belt using a punch and die is disclosed. The punch and die have patterned edges in the form of a puzzle cut pattern with extremely small nodes and kerfs. The cutting tolerances of the patterned edges make it necessary to fix the punch with respect to the die so that there is no misalignment of the punch and die between cutting operations. This is accomplished by resiliently fixing the punch to the die, rather than having the punch attached to the force generating assembly as in normal punch and die assemblies. Belt material is positioned between a stock gap between the punch and die and the force generating assembly is activated to provide the cutting force. Once the belt material is cut, the cutting force is removed and the force generating assembly returns to its retracted position. There are two cutting edges on the punch and die so that a first end of one belt and a second end of another belt are formed in a single cutting operation.
    Type: Grant
    Filed: September 26, 1996
    Date of Patent: November 6, 2001
    Assignee: Xerox Corporation
    Inventors: Edward L. Schlueter, Jr., Laurence J. Lynd, Donald W. Owens, Eric J. Smith, Alex Skirko, David Watro
  • Publication number: 20010029822
    Abstract: A novel method and apparatus for producing an endless flexible seamed belt using a punch and die is disclosed. The punch and die have patterned edges in the form of a puzzle cut pattern with extremely small nodes and kerfs. The cutting tolerances of the patterned edges make it necessary to fix the punch with respect to the die so that there is no misalignment of the punch and die between cutting operations. This is accomplished by resiliently fixing the punch to the die, rather than having the punch attached to the force generating assembly as in normal punch and die assemblies. Belt material is positioned between a stock gap between the punch and die and the force generating assembly is activated to provide the cutting force. Once the belt material is cut, the cutting force is removed and the force generating assembly returns to its retracted position. There are two cutting edges on the punch and die so that a first end of one belt and a second end of another belt are formed in a single cutting operation.
    Type: Application
    Filed: May 7, 2001
    Publication date: October 18, 2001
    Applicant: Xerox Corporation
    Inventors: Edward L. Schlueter, Laurence J. Lynd, Donald W. Owens, Eric J. Smith, Alex Skirko, David Watro
  • Patent number: 5896041
    Abstract: A programming circuit for an anti-fuse utilizes a boot circuit that charges a capacitor to the supply voltage during a non-programming period. Anti-fuse is to be programmed, the plate of the capacitor to which the supply voltage has been applied is switched to 0 volts, thereby causing the other plate of the capacitor to output a negative voltage. This negative voltage is switched to one plate of an anti-fuse, and the other plate of the anti-fuse receives a positive voltage from an external source. A voltage is thereby applied across the anti-fuse that is greater than any voltage applied to any node of the integrated circuit.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: April 20, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Joseph C. Sher, Eric J. Smith
  • Patent number: 5844298
    Abstract: A programming circuit programs an anti-fuse having first and second terminals with the programming circuit and the anti-fuse being fabricated in the same integrated circuit. The programming circuit includes a first external terminal of the integrated circuit coupled to the first terminal of the anti-fuse. The first external terminal is adapted to receive a first programming voltage having a predetermined polarity. A second external terminal of the integrated circuit is adapted to receive a second programming voltage having a polarity opposite that of the first programming voltage. A voltage translation circuit is coupled between the second external terminal and the second terminal of the anti-fuse and includes an enable terminal adapted to receive an enable signal. The voltage translation circuit is operable to couple the second programming voltage to the second terminal of the anti-fuse in response to the enable signal being active.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: December 1, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Eric J. Smith, Joseph C. Sher
  • Patent number: 5458086
    Abstract: The methods and apparatus disclosed enable controlled growth of multicomponent metal oxide thin films, including high temperature superconducting (HTS) thin films, which are uniform and reproducible. The method and apparatus enable a controlled flow and pressure of a gaseous phase of metal containing molecules to be introduced into a reaction chamber, or into an analysis chamber, or into both. The flow into the reaction chamber enables deposition of metal oxides on a substrate and, therefore, growth of multicomponent metal oxide thin films, including HTS thin films, on the substrate. The flow into the analysis chamber enables compositional analysis of the gas. The apparatus also allows adjustment of the gaseous phase flow and pressure into the reaction chamber based upon the results of the compositional analysis. In one aspect of this invention, a heating mantle provides substantially uniform heating throughout the apparatus.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: October 17, 1995
    Assignee: Superconductor Technologies, Inc.
    Inventors: Eric J. Smith, Steven P. DenBaars, Boo J. L. Nilsson
  • Patent number: RE36295
    Abstract: The methods and apparatus disclosed enable controlled growth of multicomponent metal oxide thin films, including high temperature superconducting (HTS) thin films, which are uniform and reproducible. The method and apparatus enable a controlled flow and pressure of a gaseous phase of metal containing molecules to be introduced into a reaction chamber, or into an analysis chamber, or into both. The flow into the reaction chamber enables deposition of metal oxides on a substrate and, therefore, growth of multicomponent metal oxide thin films, including HTS thin films, on the substrate. The flow into the analysis chamber enables compositional analysis of the gas. The apparatus also allows adjustment of the gaseous phase flow and pressure into the reaction chamber based upon the results of the compositional analysis. In one aspect of this invention, a heating mantle provides substantially uniform heating throughout the apparatus.
    Type: Grant
    Filed: October 16, 1997
    Date of Patent: September 14, 1999
    Assignee: Superconductor Technologies, Inc.
    Inventors: Eric J. Smith, Steven P. DenBaars, Boo J. L. Nilsson